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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 27 March 2024
High-end ABF substrate yields remain headache for Unimicron
Unimicron Technology's production yield rates for high-end ABF substrates remain lower than those of Ibiden. This presents a challenge to the Taiwanese company, despite being the...
Tuesday 26 March 2024
As passive components enter new cycle, manufacturers don't want to miss out on AI
The passive component sector expects a significant recovery period to start after the second quarter of 2024, possibly even in the second half of 2024.
Tuesday 26 March 2024
Liteon+ aims to boost startup innovation
Liteon Technology recently co-hosted its first Demo Day for its Liteon+ startup platform. The company presented the performance of five startups including PackAge+ and Elephantech.
Tuesday 26 March 2024
HDI board production in full swing, as replacement cycle for LEO satellites approaches
The low earth orbit (LEO) satellite supply chain covers four main aspects: satellite manufacturing, satellite services, satellite launch, and ground equipment. As companies seek to...
Monday 25 March 2024
SEMICON China shows mercury rising in US-China chip war
Chinese exhibitors went full native.
Monday 25 March 2024
Synopsys announces AI-driven EDA, IP and other solutions
Synopsys recently kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by company...
Monday 25 March 2024
Taiwan is new hunting ground for AI, tech intel
All roads lead to Taiwan.
Friday 22 March 2024
CSCC eyeing bigger presence in compound semiconductor sector
China Steel Chemical Corporation (CSCC)recently developed 5N-grade high-purity carbon powder and graphite crucibles that have been adopted by Taiwanese compound semiconductor firms...
Friday 22 March 2024
Advanced PCB processes to see greater impact from higher electricity prices, says TPCA
Taiwan Printed Circuit Association (TPCA) chairman Maurice Lee points to three main focuses for the industry in 2024.
Thursday 21 March 2024
Nvidia's Jensen Huang takes diplomatic rain check on Samsung's wafers
Huang showcased his diplomatic flair at Nvida's AI developers' conference.
Thursday 21 March 2024
BT substrate demand rising, ABF substrates to follow in 2H24
BT substrate demand has begun to rise, driven by growing demand for mobile phones and memory chips, while ABF substrate demand is expected to pick up in the second half of 2024, according...
Wednesday 20 March 2024
TSMC Japan 3DIC R&D Center increases partners to meet AI chip solution demand
TSMC Japan 3DIC R&D Center, located at Tsukuba Shi of the Ibaraki Prefecture, is now developing solutions for enlarging AI chip substrates.
Wednesday 20 March 2024
Topco expects silicone and heat dissipation material demand to rise
Topco Technologies is optimistic about the demand for heat-dissipation materials and silicone.
Wednesday 20 March 2024
What Merck is doing with AI: key areas to focus on
Merck views AI as the biggest driver of productivity growth in history, set to transform industries and reshape the world.
Tuesday 19 March 2024
TSMC chooses CoWoS factory site while continuing 3nm capacity expansion
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research