ODMs without US manufacturing capabilities have initiated active procurement discussions following AMD's acquisition of ZT Systems, with the upcoming US presidential election potentially...
Leading OEM and automobile firms, including Foxconn, BYD, and Xiaomi, are showcasing their collaborative robots (cobots) at the 2024 China International Industry Fair (CIIF), held...
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
Despite a positive outlook for the memory market, driven largely by data centers, Micron anticipates Samsung Electronics' entry into the HBM market and is shifting toward higher-value...
The possibility of Apple developing a more affordable Mixed Reality (MR) device is growing. It is rumored to feature an OLED display with a pixel density of 1,500 PPI to reduce manufacturing...
Japan-based SMC has announced that it has shipped chillers to TSMC for the trial production of 2nm chips. SMC is launching chiller products specifically for advanced semiconductor...
Japan may have pioneered perovskite solar cell (PSC) technology, but mass production remains elusive. In China, however, at least six startups are racing ahead, building PSC factories...
Samsung Electronics' foundry division is reportedly struggling to attract major customers due to low yield rates and persistent quality issues. These challenges are affecting the...
Sahasra Electronics, an India-based electronics manufacturing services (EMS) provider eyeing the semiconductor packaging business, is set to launch an initial public offering (IPO)...
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
Kioxia, a leading player in the NAND flash industry, has secured a loan commitment of JPY120 billion (US$841 million) from major financial institutions. This financing will enable...
As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor...
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
AMD will launch a new generation of MI325X chips utilizing HBM3E in October to enhance its standing in the AI GPU market, aiming to secure orders from AI server clients seeking to...
Huawei is preparing to launch its latest flagship Mate 70 series, a product bolstered by substantial government support and suppliers, particularly SMIC, who are reportedly sacrificing...
