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Friday 30 October 2026
Dowoo Insys develops rollable OLED UTG for vehicles
South Korean ultra-thin glass (UTG) maker Dowoo Insys is expanding its smartphone glass technology into the automotive market, developing protective glass for rollable OLED displays...
Friday 30 October 2026
HBM4 cycle faces squeeze as capacity, specs become critical
AI chipmakers' rising memory performance requirements are accelerating the shift from sixth-generation high-bandwidth memory (HBM4) to HBM4E, according to analysis of the South Korean...
Friday 30 October 2026
Taiwan manufacturing demand rises as bank property loans decline
Strong demand for AI applications and cloud services is driving investment in high-performance computing chips and AI servers, prompting Taiwan manufacturers to expand capacity and...
Friday 30 October 2026
Episil-Precision fire hits under 10% of capacity, 6- and 8-inch lines to restart within two weeks
Semiconductor epitaxy maker Episil-Precision said a localized fire broke out on October 28 at its plant on Innovation First Road in Hsinchu Science Park, but caused no injuries or...
Friday 30 October 2026
JPP Holding wins Airbus certification, targets A350 structural parts
Thailand-based precision sheet-metal manufacturer JPP Holding (jpp-KY) has secured more than 20 aerospace special-process certifications from Airbus, including certifications for A350...
Friday 30 October 2026
Intel increases equipment orders as server demand exceeds supply
Intel's server expansion is drawing equipment and materials suppliers into a capacity push, but the benefits will arrive in stages. Management's October 29 earnings-call comments identified...
Friday 30 October 2026
Alibaba, Tencent, ByteDance reportedly seek 10-year DRAM deals
Alibaba, Tencent, and ByteDance are reportedly seeking long-term server DRAM supply agreements with Samsung Electronics and SK Hynix, with some requests extending through 2035, as...
Friday 30 October 2026
Intel slashes 18A costs by 40% as foundry posts US$1.9 billion loss
Intel is cutting manufacturing costs for its newest processors, but the gains are reaching individual products and its foundry business at different speeds. Its October 29 earnings...
Friday 30 October 2026
Samsung, SK Hynix say memory crunch could drag on for years despite spending surge
Samsung Electronics and SK Hynix expect memory shortages to persist for years despite rising investment in chip factories, as surging AI demand and increasingly complex manufacturing...
Friday 30 October 2026
Taiflex, E Ink accelerate PTFE development for AI connectivity materials
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific announced on October 28 that its board had approved a memorandum of understanding with global e-paper leader E Ink Holdings...
Thursday 29 October 2026
Commentary: fire at Episil threatens tight epitaxial wafer supply
A fire broke out at the Innovation Plant of semiconductor epitaxial wafer maker Episil on October 28. The extent of equipment damage, the scope of production stoppages, and the recovery...
Thursday 29 October 2026
Qisda's commercial drones enter production as physical AI expands its growth strategy
Qisda President Cally Ko said future infrastructure supporting autonomous physical AI would evolve beyond simply providing connectivity and power to also deliver sensing, computing,...
Thursday 29 October 2026
Delayed Taiwan drone tenders hit Coretronic unit as it partners with US firm Aevex
Coretronic Intelligent Robotics Corp. (CIRC), a subsidiary of Coretronic Group, is partnering with US drone maker Aevex Aerospace to pursue Taiwan government tenders and opportunities...
Thursday 29 October 2026
SDC chief meets Applied Materials executives amid FMM-free OLED push
Samsung Display (SDC) President Lee Chung-hwan recently met with senior executives from US equipment maker Applied Materials as SDC accelerates development of fine metal mask (FMM)-free...
Thursday 29 October 2026
CXMT to start HBM3E production despite low yields amid tight domestic market
ChangXin Memory Technologies (CXMT), China's leading producer of DRAM memory, is reportedly planning to begin production of HBM3E, despite yields so far only reaching 20% to 30%. This...