Japan's Ministry of Economy, Trade and Industry (METI) on Oct. 16 approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3-nanometer logic chips at its...
Taiwan Mask Corporation (TMC) is expanding its presence in Japan through the acquisition of semiconductor equipment services provider TCK, extending its business beyond precision photomask...
Chinese EV giant and AI mobility manufacturer XPeng has made a major appearance at the Paris Automotive Summit by bringing not just its automotive expertise into the European collaborative...
The engineering fusion of SpaceX and Tesla's flagship technologies is making a dramatic showcase through Tesla's next-generation Roadster reveal, held at SpaceX's McGregor, Texas test...
On October 15, network equipment maker Gemtek Technology announced a strategic partnership with Starman New Photonics, a subsidiary of Starman Holdings, to form a joint venture in...
Taiwan plans to set up industrial parks in the US to help its supplier ecosystem reach customers like Nvidia and other local hardware manufacturers. It is starting with a complex in...
Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its...
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity...
The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the US, Europe and Japan. However,...
As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand...
LCD TV panel prices face a tug-of-war in the fourth quarter of 2026 as panel makers push for increases while LCD TV brands maintain relatively steady purchasing and contract manufacturers...
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Hyundai Motor Group plans to invest approximately US$15.5 billion in India from 2026, expanding production, research, and partnerships as it positions the country as a base for domestic...
TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise...
