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    Elite Semiconductor rides niche DRAM price hikes
    18min ago
    GlobalFoundries 2Q analysis 2/2: US subsidies, Taiwan rhetoric and GF's silicon photonics test
    19min ago
    GlobalFoundries 2Q analysis 1/2: AI optics power earnings beat and margin gains
    19min ago
    Second-tier foundries' repair rally lifts margins back to 30%
    25min ago
    NEWS TAGGED PRODUCTION
    Thursday 6 August 2026
    iBase Solution unit lands U.S. optical module cooling orders after July launch
    Industrial computer maker iBase Solution said its new subsidiary, which began operations in July 2026, has already moved into production after completing qualification with US customers...
    Thursday 6 August 2026
    Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
    Elon Musk is accelerating plans to establish a fully integrated US solar manufacturing ecosystem through Tesla and SpaceX, with a combined long-term capacity target of 200 GW. His...
    Thursday 6 August 2026
    TSMC’s CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
    Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
    Thursday 6 August 2026
    Commentary: Why China's AI optical-module dominance is Washington's next target

    The AI boom is accelerating data-centre expansion and turning high-speed optical interconnects into the next globally scrutinised supply...

    Thursday 6 August 2026
    China steps up EV battery and smart-driving inspections on five automakers

    China's Ministry of Industry and Information Technology launched surprise inspections in late July 2026 at five electric vehicle makers...

    Thursday 6 August 2026
    India's ASIP Technologies makes FCBGA core of OSAT plan
    ASIP Technologies will focus its Visakhapatnam semiconductor facility on flip-chip ball grid array packaging as it works toward volume production in the fourth quarter of 2027, Managing...
    Thursday 6 August 2026
    Samsung pitches 5nm as HBM4, Nvidia orders push 4nm lines to full capacity
    Samsung Electronics' foundry arm is stepping up sales of its 5nm process as its more advanced 4nm capacity is expected to remain fully booked through 2027, driven by HBM4 base-die...
    Thursday 6 August 2026
    US curbs on Chinese data-center optics open orders to non-China suppliers
    The US Federal Communications Commission is reportedly considering restrictions on new models of Chinese-made optical transceivers used in data centers, potentially exposing suppliers...
    Thursday 6 August 2026
    FOPLP leads production as CoPoS advances glass packaging
    AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
    Thursday 6 August 2026
    Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029
    The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...
    Thursday 6 August 2026
    China auto exports shift production and pressure suppliers in the first half of 2026
    China’s auto industry shifted sharply in the first half of 2026 as export growth offset weakening domestic demand, pushing production toward export-connected manufacturing hubs...
    Thursday 6 August 2026
    Chicony Power wins US communications customer as AI server products move toward production
    Chicony Power Technology Co. said on Aug. 4 that stronger demand for communication and server power improved its second-quarter 2026 product mix, even as higher raw material costs...
    Wednesday 5 August 2026
    Mitsubishi Electric, Daikin expand US production to meet data center cooling demand

    Mitsubishi Electric is establishing a cooling-equipment production company in Ohio, joining Daikin Industries in bringing manufacturing...

    Wednesday 5 August 2026
    Furukawa Electric to invest JPY100 billion to double rollable ribbon cable capacity in response to data center demand
    Furukawa Electric said on August 4 that it will invest approximately JPY100 billion (approx.US$630 million) in total to expand production capacity for optical fibers and optical fiber...
    Wednesday 5 August 2026
    Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

    Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

    1/182 pages
    Research_DB
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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