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    Taiwan decries US's 32% tariff as unfair, announces NT$88 billion response plan
    6min ago
    NEWS TAGGED PRODUCTION
    Friday 4 April 2025
    Uncertainty in BBU and EDLC design may delay GB300 launch
    Nvidia's high-end AI server, the GB300, made its official debut along with its peripheral components at Nvidia GTC 2025, with release expected in the third quarter. Market rumors...
    Friday 4 April 2025
    TSMC speeds up AI chip packaging expansion despite Nvidia's order cuts, targets future growth through collaboration with Intel
    Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its advanced packaging capacity to meet the growing...
    Thursday 3 April 2025
    AI boom drives growth for connector maker JPC
    Taiwan's JPC Connectivity is experiencing strong demand for AI and cloud server wire harnesses, with supply shortages compelling overtime production to meet requirements from US customers...
    Thursday 3 April 2025
    CHPT targets record 2025 revenue on AI mobile chip surge
    Chunghwa Precision Test Tech (CHPT) anticipates strong growth throughout 2025, driven by increasing demand for AI-driven high-performance computing and a key mobile application processor...
    Thursday 3 April 2025
    AUO Display Plus, E Ink to kick off large-format ePaper production by late 2025
    AUO Display Plus, a subsidiary of AUO, and E Ink Holdings have signed a term sheet to form a joint venture focused on scaling up the production of large-format ePaper modules. Backed...
    Wednesday 2 April 2025
    Sharp offloads dormant LCD plant to Aoi for semiconductor packaging pivot
    Sharp Corporation announced on March 31 that it has agreed to sell an idle LCD panel factory in Mie Prefecture, Japan, to local electronics component maker Aoi Electronics. Known...
    Wednesday 2 April 2025
    TSMC's JASM doubles workforce amid production delays
    On April 1, 2025, TSMC's Japanese subsidiary, JASM, hosted its annual new employee enrollment ceremony, a tradition for many Japanese companies, at its headquarters in Kikuyo Town,...
    Wednesday 2 April 2025
    Taiwan's AIDC partners with Malaysia's Zongheng Group for US expansion
    Taiwan's Aerospace Industrial Development Corp. (AIDC) is entering a pivotal transformation phase, extending its global footprint beyond its recent Malaysian partnership to establish...
    Wednesday 2 April 2025
    Taiwanese electronics industry thrives with AI Demand, but Trump's upcoming tariffs raise economic concerns

    Taiwan's electronics component industry has benefited from strong demand driven by AI and high-performance computing applications, with...

    Wednesday 2 April 2025
    Rapidus faces yield and customer challenges for 2nm chip ambition despite launching first fab
    Rapidus officially launched its IIM-1 semiconductor fab in Chitose City, Hokkaido, on April 1, marking a major milestone in Japan's ambition to produce cutting-edge 2nm chips. However,...
    Wednesday 2 April 2025
    'Machine gun' tariffs: Trump's economic barrage forces supply chain recalculation
    US President Donald Trump's aggressive tariff policy has struck the global economy like a machine gun blast. His 25% tariffs on imports from Canada and Mexico, coupled with uncertainties...
    Wednesday 2 April 2025
    Talent shortage and operational challenges loom in Southeast Asia expansion for PCB industry

    Looking ahead to 2025, the global PCB market is expected to maintain steady growth, driven by demand from AI servers and electric vehicles...

    Wednesday 2 April 2025
    Foxconn buys Apple equipment as production ramps up in India
    Foxconn (Hong Hai) revealed that its Indian subsidiary will procure equipment from Apple's subsidiary, signaling an expansion of Apple product production in India, which is rapidly...
    Wednesday 2 April 2025
    Rapidus targets swift 2nm chip delivery with initial 50% yield goal
    Rapidus, a Japanese company focused on semiconductor innovation, officially opened its first facility, IIM-1, in Chitose City, Hokkaido, on April 1, 2025. Aiming to advance in the...
    Wednesday 2 April 2025
    Hanmi Semiconductor hikes key HBM equipment price, likely impacts SK Hynix
    Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
    1/114 pages
    Research Report Database
    BIZ FOCUS
    Apr 2, 10:52
    Ransomware recovery: Restoring endpoints and data after an attack
    Wednesday 2 April 2025
    Ethereum's Pectra upgrade, market dynamics, and the broader tech ecosystem
    Wednesday 2 April 2025
    Is Solana the future of DeFi?
    Wednesday 2 April 2025
    GUC announces tape-out of the world's first HBM4 IP on TSMC N3P
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES