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Wednesday 16 September 2026
BizLink's CPO breakthrough hits the hard part: scaling
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal...
Wednesday 16 September 2026
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological...
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses,...

Wednesday 16 September 2026
SK Hynix, Intel in talks on US production to ease memory crunch
SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers...
Wednesday 16 September 2026
Micron unveils 512GB DDR5 RDIMM for next-gen servers

Micron has demonstrated what it calls the world's first 512GB DDR5 registered dual in-line memory module (RDIMM) across multiple server...

Wednesday 16 September 2026
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Wiwynn has officially kicked off mass production at its first US manufacturing facility. Departing from its previous strategy of leasing facilities in North America, the company is...
Wednesday 16 September 2026
Aleees locks in Tainan plant for 20-year North America order

Lithium iron phosphate (LFP) cathode materials maker Aleees said its new precursor plant will be built in Tainan, with trial production...

Wednesday 16 September 2026
Kepler bets HBM can scale without EUV — chip giants are buying in

US memory chip startup Kepler Computing has emerged from stealth after seven years, disclosing US$468 million in total funding and a...

Wednesday 16 September 2026
FSC teams with South Korean maker on TGV equipment for glass substrates
Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
Wednesday 16 September 2026
A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...
Wednesday 16 September 2026
DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy
DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...
Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience...