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    NEWS TAGGED PRODUCTION
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

    Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

    Thursday 10 September 2026
    Samsung SDS broadens AI push from software to factory robots
    Samsung SDS is using its enterprise AI strategy to move beyond office automation and into factory robotics, betting that its systems-integration experience can turn fragmented robot...
    Thursday 10 September 2026
    Beyond the stage, can XPeng's EV playbook scale humanoid robots?
    As humanoid robotics glides — in its own distinctive glamour — toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Samsung trims foundry partner network as remaining DSPs gain momentum
    Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
    Thursday 10 September 2026
    CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
    Thursday 10 September 2026
    How AI and global expansion are reshaping semiconductor recruitment to production, tech integration
    Driven by sustained artificial intelligence (AI) demand, global semiconductor capacity expansion is accelerating. According to the 2026 Semiconductor Industry Talent Report released...
    Thursday 10 September 2026
    Global PMX sees semiconductor parts shipments strengthen
    Global PMX, a major maker of automotive power and safety components, said August consolidated revenue rose to NT$802 million (approx. US$25.4 million), up 33.50% year on year and extending...
    Thursday 10 September 2026
    Chenbro Micom August revenue dips, core projects unchanged
    Server chassis maker Chenbro Micom reported August 2026 revenue of NT$2.46 billion, up 41% year-over-year. Cumulative revenue for the first eight months reached NT$19.85 billion, up...
    Wednesday 9 September 2026
    OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity
    For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less...
    Wednesday 9 September 2026
    Huaqin signs Nanchang projects as robotics push widens
    Huaqin Technology has signed two new projects in Nanchang High-tech Zone, expanding the smart-hardware ODM group's local manufacturing base into embodied-AI robotics and data collection,...
    Wednesday 9 September 2026
    Jin Lian Cheng expands into semiconductor wafer fab UPS battery recycling
    Jin Lian Cheng Resources completed an upgrade to its desulfurization production line as demand increased for lead-acid battery recycling tied to high-spec uninterruptible power supply...
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    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
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