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Thursday 27 August 2026
Doosan thins memory-package CCL insulation to 13µm
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...
Thursday 27 August 2026
Kioxia weighs third Kitakami fab as NAND demand rises
Kioxia Holdings is weighing construction of a new manufacturing building at its Kitakami plant in northern Japan, as rising NAND demand pushes the memory maker toward its next phase...
Thursday 27 August 2026
Foxconn reportedly weighs major India expansion as global manufacturing footprint grows
Hon Hai Technology Group, better known as Foxconn, is expanding its global manufacturing footprint through new land acquisitions, factory development, and capacity upgrades as demand...
Thursday 27 August 2026
China OLED buildout lifts Korean equipment sales as backlogs grow
Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
Thursday 27 August 2026
AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
Thursday 27 August 2026
India's CG Power targets 70% utilization at larger semiconductor packaging plant
CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
Thursday 27 August 2026
Ablecom takes control of Jochu to expand AI server rack, liquid cooling business
Ablecom Technology said it had joined a private placement for Jochu Technology and become the listed company's largest shareholder, giving the Taiwan-based chassis and thermal solutions...
Thursday 27 August 2026
Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Thursday 27 August 2026
Apple, Huawei foldables to collide in September, lifting ultra-thin glass, hinge and cooling demand
Huawei and Apple are set to intensify competition in foldable smartphones in September, accelerating demand across a supply chain spanning foldable OLED panels, ultra-thin glass, hinges,...
Thursday 27 August 2026
Samsung Galaxy A1 DDI packaging shifts to Chipbond
Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...
Thursday 27 August 2026
Apple pressure on OLED prices squeezes South Korean panel profits
Apple is reportedly negotiating lower unit prices with South Korean OLED panel suppliers as surging prices for high-performance mobile DRAM, NAND flash, and other memory chips threaten...
Thursday 27 August 2026
Research Insight: US humanoid supply chains pivot away from China as Taiwan moves from parts to actuator modules
As the humanoid robot supply chain moves closer to mass-production readiness, Taiwan's precision manufacturing sector is gaining new opportunities to enter the US market, according...
Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
Thursday 27 August 2026
WRC 2026 signals a new humanoid robot race as competition shifts from bodies to embodied AI models
The 2026 World Robot Conference (WRC 2026) has concluded in Beijing. While the commercial prospects of humanoid robots remain a subject of debate, they once again took center stage...
Wednesday 26 August 2026
YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO
Yangtze Memory Technologies (YMTC) is aiming to become the world's largest NAND flash supplier by the end of 2027, setting an aggressive target as its parent prepares a nearly US$5...