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Thursday 15 October 2026
Fujifilm to expand Arizona semiconductor materials output
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Thursday 15 October 2026
UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that...
Thursday 15 October 2026
Hiroca sees overseas revenue share top 50%, eyes strong pull-in momentum for 4Q26
Automotive parts supplier Hiroca saw an increase in overseas contributions for the first three quarters of 2026, with international markets accounting for more than 50% of the company's...
Thursday 15 October 2026
Sluggish demand keeps smartphone panel prices under pressure
As the fourth quarter begins, smartphone panel demand remains sluggish, with purchasing momentum from end-market brands showing no clear signs of recovery. Market activity throughout...
Wednesday 14 October 2026
BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders

China's BOE has spent approximately six months trying to resolve recurring glass substrate breakage at its Gen 8.6 OLED plant in Chengdu, raising...

Wednesday 14 October 2026
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Wednesday 14 October 2026
Taiwan IC substrate maker Xinxing halts some machinery after fatal workplace accident
IC substrate maker Xinxing experienced a fatal workplace accident at its Yangmei plant on October 13, prompting the Taoyuan City Labor Inspection Office to order a partial shutdown...
Wednesday 14 October 2026
LGD's KRW104.1B auto LCD module sale collapses
LG Display (LGD) has canceled the planned sale of its automotive LCD module business at its Nanjing subsidiary, losing a potential KRW104.1 billion (about US$72 million) payment and...
Wednesday 14 October 2026
TOK expands Koriyama photoresist capacity as AI chip demand rises
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
Wednesday 14 October 2026
Applied Materials CEO says AI race hinges on technology and capacity
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Wednesday 14 October 2026
HBM capacity shift sends DDR4 contract prices rising faster than DDR5
DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted...
Wednesday 14 October 2026
CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Wednesday 14 October 2026
AP Memory completes US$415.5M GDR offering, boosts three product lines
Memory IC design house AP Memory Technology has successfully priced its global depositary receipt (GDR) offering, raising a total of US$415.5 million. The GDRs were priced at US$56.15...
Wednesday 14 October 2026
China’s NEV export rebate cut puts budget EV makers under margin pressure
China will reduce its export tax rebate for new energy vehicles (NEVs) from 13% to 9% on April 1, 2027, increasing cost pressure on automakers, particularly those selling lower-priced...
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...