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Friday 19 June 2026
Cornelis-powered Lynx supercomputer enters service at LLNL, expanding NNSA computing capacity

Cornelis Networks has announced the successful deployment of the Lynx supercomputing cluster at the US Department of Energy's Lawrence...

Friday 19 June 2026
Samsung Foundry to make Claros power-management chips for AI data centers

Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup,...

Friday 19 June 2026
Apple to work with Intel on US chip design and manufacturing, Trump says
US President Donald Trump said on June 18 that Apple has agreed to work with Intel to design and manufacture chips in the US, a claim he made in a post on his Truth Social platform...
Friday 19 June 2026
Nvidia leads China assisted-driving chip market; Horizon Robotics rises to second
China's assisted-driving chip market is becoming more concentrated, with Nvidia leading in assisted-driving domain controller chip installations and Horizon Robotics...
Friday 19 June 2026
Research Insight: Fukuta expands small power modules as drones and robot dogs drive growth

As global EV market growth slows, motor makers that once relied on EV power systems are moving faster to find new growth engines. Fukuta...

Friday 19 June 2026
Df-OS targets traceability gap in India's electronics manufacturing
India's air-conditioner supply chain may be becoming an early test case for a broader electronics manufacturing challenge: how to trace products, components, process data, and defects...
Thursday 18 June 2026
BMW opens Neue Klasse reservations early; car business margin forecast unexpectedly cut in half
Although BMW's Neue Klasse BEV lineup is receiving strong market feedback and demand, it is also facing challenges due to weakness in the Chinese auto market and the conflict in the...
Thursday 18 June 2026
Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants,...

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label — but hurdles remain

The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of...

Thursday 18 June 2026
Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...
Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Thursday 18 June 2026
TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on s...
Thursday 18 June 2026
Taiyo Yuden to boost AI server MLCC capacity, resists price hikes

Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers...