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Saturday 11 July 2026
Lianyou Metals posts record second-quarter revenue as tungsten supply tightens
Lianyou Metals, a rare metals recycler focused on tungsten and cobalt, said its June consolidated revenue reached NT$750 million (US$23.36 million), up 22% from May and 555% from a...
Saturday 11 July 2026
Record chip profits mask a widening divide inside Samsung
Samsung Electronics' preliminary results for the second quarter of 2026 again underscore a striking split inside the company: surging semiconductor profits driven by AI server demand...
Saturday 11 July 2026
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

Saturday 11 July 2026
QuantumDiamonds sets up Asia HQ in Taiwan, installs first regional system at iST
Backed by support from the European Chips Act, German quantum startup QuantumDiamonds has completed a financing round totaling EUR91 million (approx. US$104.1 million), a move expected...
Saturday 11 July 2026
China's display makers raise billions to close the OLED gap — and South Korea is watching
Chinese display panel and materials companies are tapping capital markets to fund next-generation OLED, oxide and Mini LED technologies, drawing close attention from South Korea's...
Saturday 11 July 2026
Laster lifts second-quarter revenue 13% as new vehicle launches approach
LED automotive lighting module maker Laster reported June consolidated revenue of NT$500 million (US$15.58 million), down 31.67% from May and 29.48% year on year. Even so, second-quarter...
Saturday 11 July 2026
Mobilint touts NPU for physical AI, with CEO urging South Korea to accelerate development
South Korean AI semiconductor startup Mobilint is gaining traction in physical AI with its neural processing units (NPU) for edge devices, as the AI boom spreads from cloud computing...
Friday 10 July 2026
Largan samples CPO product in July 2026, eyes GC edge
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...
Friday 10 July 2026
ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

Friday 10 July 2026
Sigurd posts record second quarter revenue as Hsinchu plant starts ramping up
Sigurd said its revenue hit a record in the second quarter of 2026 and for the first half of the year, driven by stronger demand from overseas customers. June sales stayed at a high...
Friday 10 July 2026
Insight: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Friday 10 July 2026
Apple's US$30 billion Broadcom deal puts its server-chip plans back in focus

Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing...

Friday 10 July 2026
Google Cloud says Taiwan's AI shift to production could shape global enterprise use
Taiwan's move from AI trials to production systems signals a broader shift that could affect how companies worldwide adopt automation, data governance, and digital security. As more...
Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...