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Thursday 5 November 2026
Micron has paused a Taiwan cleanroom since October amid labor dispute, but keeps EUV plans
Micron has paused construction of a new cleanroom at its Fab 11E site in Taoyuan, Taiwan, since mid-October 2026, according to semiconductor supply chain sources. The company recently...
Thursday 5 November 2026
Largan consolidates camera actuator unit as optical business expands into CPO
Largan Technology reported October revenue of NT$5.846 billion (US$178.1 million) on November 5, down 7.0% year-over-year, while moving to consolidate its camera actuator subsidiary...
Thursday 5 November 2026
Toyota, Waymo target Robotaxi market with dual-track strategy
Toyota Motor Corporation is partnering with autonomous taxi leader Waymo to advance its dual-track strategy in self-driving vehicles, as the auto industry faces the rapid rise of autonomous...
Thursday 5 November 2026
Chipmakers rush to secure equipment for 2029 as lead times top two years
Chipmakers are moving to secure production equipment for delivery as far ahead as 2029, as AI-driven fab expansion pushes some equipment lead times beyond two years and forces manufacturers...
Thursday 5 November 2026
China's Big Fund III pivots to 12-inch chip fabs, equipment acquisitions to close semiconductor supply chain gaps
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and...
Thursday 5 November 2026
Flexium eyes 2027 breakthrough as PTFE enters mass production in 2028
Flexium Interconnect chairman Walter Cheng said the company has emerged from the toughest operating downturn of the past two years and expects AI orders for smart glasses and infrastructure...
Thursday 5 November 2026
Commentary: AOI locks in China's InP substrates for AI optics, but export controls threaten supply
AI data centers are accelerating demand for high-speed optical communications, extending competition in the optical transceiver market beyond chips and module manufacturing to critical...
Thursday 5 November 2026
Samsung reportedly plans 2nm fab to boost HBM base-die output
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...
Thursday 5 November 2026
SK Hynix leads HBM4 yield at 60%, expands DRAM supply
SK Hynix's sixth-generation high-bandwidth memory (HBM4) yield has reportedly reached the mid-60% range, the highest in the industry. Analysts say improved yield has lifted production...
Thursday 5 November 2026
Winbond approves US$2.2 billion fab expansion, seeks long-term deals with 10 customers
Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares...
Thursday 5 November 2026
CXMT prepayments surge 16x with DRAM shortage lifting market share
Global memory supply constraints are creating opportunities for Chinese DRAM maker CXMT to expand its market share. As major international manufacturers prioritise high-bandwidth memory...
Thursday 5 November 2026
Corning starts optical connectivity output in western India, plans larger adjacent plant for 2027
Corning's move to begin making optical connectivity products in Pune and add a larger adjacent plant by 2027 shows the AI-driven surge in data center fiber demand, so far strongest...
Thursday 5 November 2026
FPT starts chip-testing plant trials in northern Vietnam, plans packaging expansion
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Thursday 5 November 2026
Airoha targets multibillion growth as 100G ramps, 200G tapes out
Airoha, a MediaTek subsidiary, expects its optical communications business to deliver another multiple-fold increase in 2027 as 100G pulse-amplitude modulation (PAM4) digital signal...
Thursday 5 November 2026
AI chips need 1.5 years to move beyond cloud: HCLTech
HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale...