Chipmakers are moving to secure production equipment for delivery as far ahead as 2029, as AI-driven fab expansion pushes some equipment lead times beyond two years and forces manufacturers...
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and...
Flexium Interconnect chairman Walter Cheng said the company has emerged from the toughest operating downturn of the past two years and expects AI orders for smart glasses and infrastructure...
AI data centers are accelerating demand for high-speed optical communications, extending competition in the optical transceiver market beyond chips and module manufacturing to critical...
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...
SK Hynix's sixth-generation high-bandwidth memory (HBM4) yield has reportedly reached the mid-60% range, the highest in the industry. Analysts say improved yield has lifted production...
Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares...
Global memory supply constraints are creating opportunities for Chinese DRAM maker CXMT to expand its market share. As major international manufacturers prioritise high-bandwidth memory...
Corning's move to begin making optical connectivity products in Pune and add a larger adjacent plant by 2027 shows the AI-driven surge in data center fiber demand, so far strongest...
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Airoha, a MediaTek subsidiary, expects its optical communications business to deliver another multiple-fold increase in 2027 as 100G pulse-amplitude modulation (PAM4) digital signal...
HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale...
Murata Manufacturing and Samsung Electro-Mechanics (Semco) have reportedly secured silicon capacitor production capacity from Winbond Electronics to meet demand from their end customers,...
Although the defense market has emerged as a new blue ocean for the auto industry, entering it is far from smooth sailing. The main concern remains the national security sensitivities...
Samsung Electronics plans to produce high-bandwidth memory (HBM) base dies for AMD at its second foundry plant in Taylor, Texas, with the US chipmaker accounting for most of the facility's...
