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Friday 10 July 2026
Largan samples CPO product in July 2026, eyes GC edge
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...
Friday 10 July 2026
ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

Friday 10 July 2026
Sigurd posts record second quarter revenue as Hsinchu plant starts ramping up
Sigurd said its revenue hit a record in the second quarter of 2026 and for the first half of the year, driven by stronger demand from overseas customers. June sales stayed at a high...
Friday 10 July 2026
Insight: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Friday 10 July 2026
Apple's US$30 billion Broadcom deal puts its server-chip plans back in focus

Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing...

Friday 10 July 2026
Google Cloud says Taiwan's AI shift to production could shape global enterprise use
Taiwan's move from AI trials to production systems signals a broader shift that could affect how companies worldwide adopt automation, data governance, and digital security. As more...
Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
Micron's US$250 billion memory push sharpens three-way race with Korean and Chinese rivals
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site,...
Friday 10 July 2026
GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI),...
Friday 10 July 2026
India scraps duties on electronics and battery components to boost local manufacturing

India has scrapped import duties on a targeted set of components and factory machinery used to build smartphones, displays, and lithium-ion...

Friday 10 July 2026
EU tariffs push Chinese carmakers to seek deeper ties in Europe

The EU's higher tariffs on China-made battery electric vehicles are reshaping global auto trade and investment. As Brussels tightens...

Friday 10 July 2026
Meta readies Iris chip, locks in supply for push to 14 gigawatts
Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion...
Friday 10 July 2026
HBM prices set to double in 2027 as AI demand and supply deals tighten the memory market

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

Friday 10 July 2026
Liteon Technology June revenue jumps 37% on AI server power demand
Liteon Technology reported consolidated revenue of NT$18.7 billion (US$580 million) in June 2026, up 8% from May and 37% from a year earlier, as demand for AI and cloud computing high-end...