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Tuesday 16 June 2026
Rapidus signs UK chip pact in push for 2nm customers

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Monday 15 June 2026
SAP says human-in-the-loop review is key to moving enterprise AI agents from POC to production
SAP reported that enterprise AI agents are shifting from proof of concept to real-world deployment as companies aim to embed generative AI into operational workflows such as finance...
Monday 15 June 2026
Samsung foundry chief sees 2028 profit path as bonus costs mount

Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business...

Monday 15 June 2026
Galatek opens Penang hub to meet surging semiconductor equipment demand

Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor...

Monday 15 June 2026
Southeast Asia shifts from test-and-pack to multi-center advanced packaging hub

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient,...

Monday 15 June 2026
Wus Printed Circuit sees turnaround on high-end PCB demand

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward...

Monday 15 June 2026
Visionox pushes ViP OLED commercialization as China's flexible OLED utilization slumps

Chinese OLED panel maker Visionox is accelerating the commercialization of its proprietary Visionox intelligent Pixelization (ViP) technology...

Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

Monday 15 June 2026
China eases InP substrate exports, lifting compound semiconductor supply

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026...

Monday 15 June 2026
LG Innotek's Vietnam substrate investment plan comes as FC-BGA demand broadens

LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand...

Monday 15 June 2026
Tsang Yow plans Malaysia plant as semiconductor demand shifts to Southeast Asia
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof...
Sunday 14 June 2026
SpeedTech's shift toward assembly and systems work could reshape 2026 revenue mix

Connector and wire-harness maker SpeedTech is accelerating its shift from component supply toward systems assembly and full-unit OEM...

Saturday 13 June 2026
Taiwan IC distributor Edom eyes four growth engines beyond cloud AI

As cloud service providers ramp up investment in AI infrastructure, Edom chairman Wayne Tseng said rising costs for materials, production...

Saturday 13 June 2026
ITE Tech wins design slots in US AI computing platform, raising global PC supply chain stakes
ITE Tech said its embedded controller chip and HDMI 2.1 retimer have been adopted by a US agentic AI computing platform, with mass production expected as early as the second half of...
Saturday 13 June 2026
SK Hynix weighs supplier price hikes as HBM boom lifts equipment makers

SK Hynix is reviewing rare price increase requests from several tier-one equipment suppliers, a sign that the high-bandwidth memory...