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Wednesday 5 August 2026
Mitsubishi Electric, Daikin expand US production to meet data center cooling demand

Mitsubishi Electric is establishing a cooling-equipment production company in Ohio, joining Daikin Industries in bringing manufacturing...

Wednesday 5 August 2026
Furukawa Electric to invest JPY100 billion to double rollable ribbon cable capacity in response to data center demand
Furukawa Electric said on August 4 that it will invest approximately JPY100 billion (approx.US$630 million) in total to expand production capacity for optical fibers and optical fiber...
Wednesday 5 August 2026
Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

Wednesday 5 August 2026
SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...
Wednesday 5 August 2026
AMD says server CPU market to hit US$220B by 2030

AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate...

Wednesday 5 August 2026
Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
Wednesday 5 August 2026
CXMT-SK Hynix LPDDR6 race shifts to yields, customers and capacity

China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung...

Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
Cloud AI chipmakers race to secure capacity with long-term deals
Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
Wednesday 5 August 2026
From factories to consumers: Samsung's long retreat from China enters its final chapters

Samsung Electronics' latest move to scale back its smartphone retail network in China marks another milestone in a years-long restructuring...

Tuesday 4 August 2026
Samsung Foundry nears full utilization, but 2nm yields remain a hurdle
Samsung Electronics' contract chipmaking business could approach full utilization in the second half of 2026, marking a potential turning point after prolonged underuse weighed on...
Tuesday 4 August 2026
China's chip output jumps nearly 350% in a decade as semiconductor supply chain expands
China's industrial enterprises above the designated size produced 484.28 billion integrated circuits in 2025, up nearly 350% from 108.72 billion in 2015, as the country expanded manufacturing...
Tuesday 4 August 2026
Factorial, SK On sign pact to assess solid-state battery manufacturing

Factorial Energy and SK On have agreed to study whether existing battery plants could be adapted for solid-state cells, a move that...

Tuesday 4 August 2026
Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed...

Tuesday 4 August 2026
CXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in...