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Friday 31 July 2026
Exclusive: Asian chipmakers' shift to US helium raises concentration risk
Chipmakers in Taiwan, South Korea, and Japan have avoided broad helium-related production disruptions so far, but their rapid shift toward US supply is creating a new concentration...
Friday 31 July 2026
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

Friday 31 July 2026
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
CXMT's IPO marks a shift in China's DRAM strategy from capacity building towards mainstream products, process upgrades, and global competition, according to DIGITIMES Intelligence.
Friday 31 July 2026
Thunder Tiger calls for budget clarity as Taiwan pushes uncrewed surface vessel development
Taiwanese drone manufacturer Thunder Tiger demonstrated an uncrewed surface vessel (USV) equipped with mission autonomy software in collaboration with US-based defense technology startup...
Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
India's first telecom manufacturing zone to land in Madhya Pradesh

India has moved to build a major telecom manufacturing hub in Gwalior, a step that could reshape supply chains, investment flows, and...

Friday 31 July 2026
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
Montage Announces Industry-First Trial Production of CXL 3.2 MXC

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands...

Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
Thursday 30 July 2026
Samsung foundry to double 2nm design wins in 2026 on Broadcom talks; claims profit turnaround 'possible in near term'

Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in...

Thursday 30 July 2026
China rejects 'overcapacity' claims in new policy paper, defends industrial strategy
China's Ministry of Commerce (MOFCOM) has released a policy paper rejecting allegations that the country's manufacturing sector suffers from "overcapacity," arguing that the concept...