AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...
Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...
Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...
As artificial intelligence (AI), high-performance computing (HPC), high-speed networking, and edge computing applications continue to expand rapidly, global demand for...
SiPearl has powered on and begun validating Rhea1, its first-generation server CPU designed in Europe. Its next challenge is convincing...
Foxlink Texas (FTI), a subsidiary of Cheng Uei Precision Industry (Foxlink), officially opened its first artificial intelligence (AI)...
Micron has said its Strategic Customer Agreement (SCA) long-term supply deals with 16 key strategic customers include seven automotive...
Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...
TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...
