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Monday 6 July 2026
Huawei chip chief proposes Tau Law V2 centered on time-based scaling
Huawei's semiconductor chief is promoting a post-Moore roadmap that shifts industry focus from shrinking transistors to reducing time across the computing stack, a framework backed...
Monday 6 July 2026
Micron breaks ground on Hiroshima expansion to boost AI memory chip production
Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion)...
Monday 6 July 2026
Foldable phone market braces for second-half launch wave
The foldable phone market is set for a busy second half as Samsung, Huawei, Apple, and Chinese rivals line up new models. Wider launches, higher prices, and fresh designs could lift...
Monday 6 July 2026
India launches third semiconductor plant as CG Semi begins commercial production in Gujarat
India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at...
Monday 6 July 2026
USMCA shifts to annual review as trade deficit keeps pressure on Mexico talks
The US, Mexico and Canada have moved into annual review talks on the USMCA after Washington declined to approve a straight 16-year extension under the current text, according to PwC...
Monday 6 July 2026
Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a...

Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
Sunday 5 July 2026
Advantest and OpenLight join forces on silicon photonics test platform for mass production
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence...
Saturday 4 July 2026
Samsung and SK Hynix seek substrate price cuts for the second half of 2026
Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in...
Friday 3 July 2026
Apple plans five iPhone launches to capture market share amid component shortages

Apple is reportedly planning to launch at least five new models by this time next year, with the company expanding its foldables' production...

Friday 3 July 2026
Chinese NOR Flash supplier Giantec raises prices 25% as memory market risks persist

China's memory price rally continues to gather momentum. Giantec Semiconductor Corporation, a Chinese NOR flash supplier, recently...

Friday 3 July 2026
China's polarizer makers seek price hikes as material bottlenecks bite

Chinese polarizer film suppliers are seeking higher prices from panel makers after raw-material and logistics costs rose in the second...

Friday 3 July 2026
CSCC expands Pingnan plant to lift carbon materials output
China Steel Chemical Corporation (CSCC) is expanding its Pingnan plant to increase development capacity for advanced carbon materials and graphite blocks. The Taiwan-based subsidiary...
Friday 3 July 2026
Turvo shifts North America production as robot revenue target rises before 2029
Turvo International said it has expanded its manufacturing footprint across Taiwan, China and the US to reduce exposure to tariffs and geopolitical risk, while preparing for a bigger...
Friday 3 July 2026
Samsung's HBM4E yield tops 70%, sharpening AI memory race with SK Hynix and Micron
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening...