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Friday 13 November 2026
DEEPX tapes out AI chip on Samsung's 2nm process
South Korean AI chip developer DEEPX has completed the tape-out of its next-generation DX-M2 processor using Samsung Electronics' second-generation 2nm process, advancing plans to...
Friday 13 November 2026
E Ink targets 2027 revenue from PTFE materials for AI data centers
E Ink Holdings is expanding into materials for AI data centers through a partnership with Taiflex Scientific. The electronic paper maker expects its first revenue from polytetrafluoroethylene...
Friday 13 November 2026
DIGITIMES Chairman urges Taiwan to become sovereign AI partner
Digitimes Chairman and CEO Colley Hwang said Taiwan should leverage its strengths in chip manufacturing, advanced packaging, and ICT hardware production to pursue sovereign AI opportunities...
Friday 13 November 2026
Samsung reportedly wins more AI chip orders from US cloud firms
Samsung Electronics has reportedly secured new AI chip manufacturing orders from major US cloud service providers for a second consecutive quarter, with commercial shipments expected...
Friday 13 November 2026
LGES, Samsung SDI target 2Q27 LFP battery production for AI servers
LG Energy Solution (LGES) and Samsung SDI plan to begin mass production of lithium iron phosphate (LFP) batteries for AI servers in the second quarter of 2027, expanding the technology...
Friday 13 November 2026
FICG returns to growth in 3Q26 as 1.6T enters mass production
FIC Global (FICG) returned to growth in the third quarter of 2026, driven by the gradual ramp-up of overseas capacity in its optical communications business and strong demand for high-speed...
Friday 13 November 2026
Analysis: The overlooked industry behind the Steel City — and the struggle to scale innovation
For generations, Sheffield's industrial identity has been forged in steel. Yet behind that familiar legacy, a less visible technological transformation has been unfolding for decad...
Friday 13 November 2026
Samsung expands HBM packaging at Onyang as Cheonan runs short of space
Samsung Electronics is expanding its high-bandwidth memory (HBM) packaging operations in South Korea as its Cheonan campus runs short of space, prompting the company to develop nearby...
Friday 13 November 2026
SK Hynix's HBM4 yield tops 70% as Samsung expands chip packaging capacity
SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources,...
Friday 13 November 2026
Analysis: Nvidia's leadership change leaves Taiwan suppliers confident in near-term demand
Jensen Huang's resignation is expected to have short-term effects on Taiwan's server suppliers, which are developing Nvidia's Vera Rubin and Feynman platforms. However, suppliers say...
Friday 13 November 2026
APD Opens Shenzhen Facility, Advancing Dual-Plant Integration and Smart Manufacturing

APD, a global power supply manufacturer, held a grand opening ceremony for its new Shenzhen facility on November 12. Covering nearly 30,000 square meters, APD's new manufacturing...

Friday 13 November 2026
Samsung reportedly moves up 8-inch foundry exit to 2029, outsources some production to UMC
Samsung Electronics is targeting an exit from its 8-inch foundry business by the end of 2029, a year earlier than previously reported, and has been outsourcing some production to Taiwan's...
Thursday 12 November 2026
Foxconn sees high-double-digit AI rack growth in 2027
Foxconn reported third-quarter 2026 revenue of more than NT$3 trillion (US$91 billion) and raised its full-year outlook, while taking a "cautiously optimistic" view of 2027 and forecasting...
Thursday 12 November 2026
Aleees makes Tainan plant launchpad for North American LFP expansion
Advanced Lithium Electrochemistry (Aleees), a lithium iron phosphate (LFP) cathode-material maker, signed a memorandum of understanding (MOU) with a North American partner on November...
Thursday 12 November 2026
India's Tata Electronics reportedly seeks up to US$2 billion in loans
Tata Electronics is lining up fresh debt at a moment when nearly every leg of its expansion has run into friction: a flagship chip fab whose production start has moved from the end...