General Interface Solution (GIS) Holding is gaining traction in optical communications and other new products despite weak consumer electronics demand caused by rising memory prices...
South Korea's Hyundai Rotem is accelerating its expansion into aerospace propulsion systems, showcasing 10-ton- and 35-ton-class methane rocket engines under development at AEROTEC...
Samsung Display (SDC) and LG Display (LGD) are calling on the South Korean government to strengthen tax incentives for OLED investment and research as intensifying competition from...
Elite Semiconductor Microelectronics Technology (ESMT) reported September consolidated revenue of NT$7.461 billion (approx. US$234 million), up 470.23% from NT$1.308 billion a year...
Days after reports emerged that TSMC was reassessing plans for a wafer fab in Texas, Tim Culpan, a former Bloomberg columnist and founder of independent media outlet Culpium,...
Aerospace Industrial Development (AIDC) unveiled its first self-developed fixed-wing tactical drone, the Raven X. AIDC president Hsiu-mei Chuang recently stated that the Taiwan-based...
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push...
Biren Technology is preparing its next-generation GPU for mass production, advancing a domestic AI accelerator roadmap built around broader low-precision support and locally available...
Japanese companies sharply reduced their footprint in China over the past two years, with the number operating there falling 22.4% from 13,034 to 10,118 as of the end of June 2026,...
ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly...
Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion...
Nvidia is testing glass-free PCB material systems for its next-generation AI server platforms, evaluating polytetrafluoroethylene (PTFE) and hydrocarbon (HC) resin formulations for...
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have...
South Korea's LG Electronics and LS Electric are expanding deeper into AI data center infrastructure, targeting two of the fastest-growing bottlenecks around high-density computing:...
