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Monday 24 August 2026
India weighs new capital subsidies to build domestic polysilicon capacity
India is preparing a new capex-based subsidy scheme to support domestic polysilicon manufacturing, as the government seeks to reduce import dependence and build a more integrated solar...
Monday 24 August 2026
Notebook brands shift production back to China as Southeast Asia costs rise
Notebook brands that rushed into Southeast Asia for manufacturing are moving production back to China, as the cost gap remains too wide and the impact of substitute tariffs has proved...
Monday 24 August 2026
Taiwan speeds chip materials push with consumables, ITRI says

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value...

Monday 24 August 2026
Shanghai accepts YMTC's STAR Market listing application
China's largest NAND flash maker is moving toward a major Shanghai listing, but global investors will be watching more than the size of the deal. YMTC's IPO comes as chip demand rises,...
Monday 24 August 2026
India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
India has announced an INR625 billion (US$6.53 billion) Mobile Phone Manufacturing Scheme aimed at moving the country's electronics industry beyond large-scale assembly and toward...
Monday 24 August 2026
Xiaomi unveils second-generation humanoid robot at Beijing conference

Xiaomi unveiled its second-generation humanoid robot at the 2026 World Robot Conference in Beijing, where the machine made its first...

Saturday 22 August 2026
Automation Taipei 2026: If AI is advancing so fast, why is the factory floor still so hard to automate?
For all the extraordinary progress made by artificial intelligence, the physical world remains stubbornly difficult to automate.
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
Friday 21 August 2026
China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving...
Friday 21 August 2026
SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
Friday 21 August 2026
Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won,...
Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
Friday 21 August 2026
Honor Robot Phone moves from concept to mass production

With the official launch of Honor's new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers...

Friday 21 August 2026
SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision...
Friday 21 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...