Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Sercomm, a networking equipment manufacturer, released its 2024 business report and financial statements during a shareholders meeting held on May 29, 2025. Company Chairman James...
Wolfspeed, once the dominant supplier of silicon carbide (SiC) materials, is now grappling with financial distress as its market lead continues to erode. Just five years ago, the...
The Taiwan External Trade Development Council (TAITRA) released a survey on May 28, 2025, revealing that the proportion of enterprises expecting an average increase of over 20% in...
Server chassis supplier InWin holds optimism for the second half of 2025 if no drastic changes occur in terms of the two most crucial factors of tariffs and exchange rates, says company...
Arizon RFID Technology has moved swiftly to mitigate the effects of recent sharp fluctuations in exchange rates. CEO Louis Lin acknowledged that the appreciation of the New Taiwan...
Amid growing uncertainty over global tariffs, Taiwanese memory chipmaker Winbond Electronics has seen a sudden surge in urgent orders during the second quarter of 2025, so much so...
The conclusion of Computex 2025 showcased artificial intelligence (AI) and humanoid robot development as central themes, with automotive factory robot upgrades emerging as a notable...
While rival Innolux accelerates its push into FOPLP with plans for mass production in late 2025, AUO is taking a more cautious path. CEO and President Frank Ko explained that, despite...
At GTC Taipei 2025, PEGATRON, a global leader in design and manufacturing services within the ICT industry, announced its latest advancements in industrial autonomy through digital...
Power supply unit (PSU) manufacturer AcBel Polytech held its annual shareholders meeting on May 28, presided over by company chairman Jerry Hsu. AcBel posted an operating loss of...
As global display technologies pivot toward thinner, lighter, and more flexible form factors — especially for automotive and smart device applications — Taiwanese glass...
In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...
The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor...
