LG Display announced a planned investment of approximately KRW1.26 trillion (around US$920 million) to boost its OLED technology capabilities and support its ongoing shift from LCD...
On June 18, 2025, Texas Instruments (TI) announced it will invest over US$60 billion in seven semiconductor fabs across the US. This historic investment aims to boost TI's domestic...
Taiwan-based FineMat Applied Materials held its shareholders' meeting on June 17, approving all proposals and outlining its strategic direction amid increasing competition in China's...
Struggling chipmaker Wolfspeed Inc. will be taken over by creditors including Apollo Global Management Inc., under a proposal that would put it into bankruptcy just long enough to...
Dai Nippon Printing (DNP) is set to fully operate its eighth-generation OLED display substrate metal mask factory by the fiscal year 2027, spanning April 2027 to March 2028, with...
AESC Group Ltd., the battery subsidiary of Shanghai-based green tech company Envision Group, has reportedly paused its US expansion plans due to funding constraints, but its existing...
Japanese glass fiber supplier Nitto Boseki (Nittobo) reportedly has raised prices of its composite material products by up to 20% due to increasing costs, but the price hike does...
Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...
Japanese industrial automation giant Yaskawa has announced a US$180 million investment to establish a new production base in Wisconsin, creating the company's first industrial robot...
PCL Technologies has secured a significant laser optical packaging order from Broadcom for its next-generation data center switch chips, signaling a milestone in the commercial rollout...
The Trump Organization unveiled Trump Mobile on June 16, 2025, promoting it as an all-American wireless provider with a flagship T1 phone boasting made-in-USA credentials. However,...
China continues to lag behind memory giants SK Hynix, Micron, and Samsung Electronics in developing high bandwidth memory (HBM) technology. Although US export controls on semiconductor...
Heavy electrical equipment maker Fortune Electric has been negotiating with its clients amid the uncertainties in US tariff policies and exchange rate fluctuations, with company president...
Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment...
Taiwanese IC design houses report a steady reduction in 8-inch wafer capacity by local foundry partners. Several foundries are now urging clients to transition select products to...
