To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Simon Yang, the former YMTC CEO and later deputy chairman, has joined Rong Semiconductor (Ningbo) Co. (RongSemi) as head of its technical expert committee. The announcement came alongside...
Taiwan-based Lianyou Metals, which was listed on September 9, 2025, is capitalizing on geopolitical shifts and supply chain disruptions by expanding its production of cobalt metal...
Precision gear manufacturer Khgears International has been actively delivering samples of gears and harmonic reducers for robots in its efforts to grow in this segment. The company...
AMD will launch new products in 2025 and 2026, with OpenAI set to adopt them. OpenAI and Broadcom are targeting mass production in 2026. Interest in diverse AI chip solutions is growing,...
Nvidia has reportedly placed an order with Samsung Electronics for GDDR7 graphics memory, with the supply volume doubling compared to previous orders. Samsung's GDDR7 was previously...
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
Contemporary Amperex Technology (CATL), the largest China-based battery maker, has recently dispatched procurement managers and engineers on a large-scale visit to South Korea, with...
Broadcom delivered strong earnings guidance with its latest results, as CEO Hock Tan revealed a US$10 billion ASIC mass-production order from a major new customer outside the core...
Taiwan is drafting new measures to curb China's rising dominance in mature-node chip production, with the Legislative Yuan scheduled to review the plan when its new session opens...
The competition for advanced process leadership among TSMC, Samsung Electronics, and Intel is intensifying, making the pace of their new equipment acquisitions a key industry focus...
Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including...
