Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...

Hanwha Semitech is poised to expand its supply of thermal compression bonding machines (TCB) for high-bandwidth memory (HBM) production to SK Hynix.

Following the announcement of a price increase by Micron, the world's third-largest DRAM manufacturer, South Korean media analysis indicates that the other two major DRAM players,...

A recent survey from South Korea reveals a significant boost in the country's top 500 companies' performance in 2024. Operating profits soared by 66% compared to 2023, reaching KRW73...

The South Korean government recently announced a collaboration with Samsung Electronics, SK Hynix, and DB Hitek to enhance the operational quality of the national public foundry platform,...

SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...

SK Hynix has completed the full acquisition of Intel's NAND Flash division, concluding a four-year process. The assets will be integrated under Solidigm, SK Hynix's US subsidiary,...

As the memory chip market re-enters a favorable cycle, industry forecasts predict that Samsung Electronics and SK Hynix's operating profits in 2025 could surge by 40% compared to...

SK Hynix is reportedly accelerating equipment installation at its M15X fab in Cheongju, South Korea, moving the original timeline forward from December to October in response to surging...

Samsung Electronics Co. pledged to strengthen its position in the high-bandwidth memory (HBM) chip market this year, in response to shareholder criticism over its underperformance...

At the ongoing Nvidia GTC 2025, both SK Hynix and Micron Technology have demonstrated their respective AI memory solutions.

SK Hynix announced on March 19 that it has begun delivering early samples of its new 12-layer HBM4 ultra-high performance DRAM for AI applications to key clients.

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time...

Following SanDisk announcing a price rise effective in April, reports suggest that Micron, Samsung Electronics, SK Hynix, and Yangtze Memory Technology Corp (YMTC) will also hike...