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    NEWS TAGGED SK HYNIX
    Friday 6 June 2025
    South Korea's new presidential tech vision: KRW9 trillion semiconductor boost for Samsung and SK Hynix
    As Lee Jae-myung takes office as South Korea's 21st President, the global tech and industry community is closely monitoring his ambitious economic agenda. Among the key sectors under...
    Thursday 5 June 2025
    South Korea's Lee proposes 10% tax credit for domestic chip production
    South Korea's newly elected President Lee Jae-myung has unveiled a flagship policy offering up to 10% production tax credits for semiconductors manufactured and sold domestically,...
    Thursday 5 June 2025
    CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
    China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
    Thursday 5 June 2025
    Micron takes lead in LPDDR5X race with early 1γ-based mobile memory shipment
    Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for...
    Wednesday 4 June 2025
    Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design
    South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster...
    Wednesday 4 June 2025
    South Korea maintains HBM chip lead while China faces tech and trade hurdles
    The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
    Tuesday 3 June 2025
    South Korea's chip crown becomes a strategic burden

    South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...

    Wednesday 28 May 2025
    Hanmi engineers return to SK Hynix after US$30.7 million TCB order resolves dispute
    The protracted dispute between Hanmi Semiconductor and SK Hynix regarding the supply of Thermo Compression Bonding (TCB) equipment has reached a resolution, with Hanmi Semiconductor...
    Tuesday 27 May 2025
    CXMT to scrap DDR4 in policy-fueled pivot—DDR5 deluge may follow
    ChangXin Memory Technologies (CXMT), China's top DRAM supplier, is reportedly preparing to phase out DDR4 products for server and PC use by mid-2026. As the company pivots to DDR5...
    Monday 26 May 2025
    Samsung edges toward Nvidia HBM3E approval, but SK Hynix remains dominant

    Samsung Electronics may clear Nvidia's certification for its 12-layer HBM3E memory, but industry sources say the achievement is unlikely...

    Friday 23 May 2025
    Samsung launches Dual-Site 1c DRAM expansion to bolster HBM4 leadership
    Samsung Electronics is doubling down on its leadership in advanced memory technology. Following its latest developments at the Pyeongtaek facility, industry sources report that Samsung...
    Friday 23 May 2025
    SK Hynix System IC reportedly offers generous incentives for transfer to China JV amid intense competition
    According to iNews24 and SE Daily, SK Hynix System IC, the 8-inch foundry subsidiary of SK Hynix, is urging employees in both South Korea and China to transfer to...
    Thursday 22 May 2025
    SK Hynix develops UFS 4.1 solution based on 321-High NAND

    SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's highest 321-layer 1Tb triple-level cell 4D NAND...

    Thursday 22 May 2025
    Nvidia CEO shows support for SK Hynix, praises 'beautiful' HBM4 at Computex 2025
    Nvidia CEO Jensen Huang made a special visit to the SK Hynix booth at Computex 2025, leaving messages of support and showing the close cooperative relationship between the two comp...
    Tuesday 20 May 2025
    SK Hynix places orders for HBM equipment with Hanwha Semitech and Hanmi Semiconductor amid patent disputes
    South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor,...
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    Thursday 5 June 2025
    Darveen signs distributor agreement with IP SYSTEMES to expand market presence in France
    Thursday 5 June 2025
    BIOSTAR concludes COMPUTEX 2025 on a high note with the debut of Edge-Comp series and edge AI platforms
    Wednesday 4 June 2025
    "Revenge Seekers" team develops AI-powered emergency assistant to improve disaster response efficiency.
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES