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Friday 7 March 2025
How China views TSMC's US investment
TSMC's recent announcement of an additional US$100 billion investment in US manufacturing has sparked sharp criticism from Beijing. Chinese media and government officials frame the...
Thursday 6 March 2025
Trump's push to repeal CHIPS Act puts Samsung at greatest risk
In his first congressional address of his second term, US President Donald Trump reaffirmed his commitment to repealing the CHIPS and Science Act, a policy shift that has unsettled...
Thursday 6 March 2025
Behind the Scenes: How Mark Liu and Micron CEO Sanjay Mehrotra Are Forging a New Era in US Chip Strategy
Following his retirement as chairman of Taiwan Semiconductor Manufacturing Company (TSMC), Mark Liu shifted his focus to the United States. The latest announcement by Micron Technology...
Thursday 6 March 2025
TSMC's US$100 billion US push: Will Samsung, SK Hynix blink?
Coming on the heels of Donald Trump's second-term victory, TSMC has announced a staggering US$100 billion expansion in the US. This move has sparked debate about whether Samsung Electronics...
Tuesday 4 March 2025
SK Hynix America sees revenues soar in 2024 amid high demand for advanced memory products
SK Hynix America, the US branch of SK Hynix, is seeing significant revenue growth due to the demand for HBM. In 2024, its revenue rose about 2.6 times from the previous year.
Thursday 27 February 2025
SK Hynix reportedly hits 70% yield in HBM4 testing
SK Hynix has reportedly reached a significant milestone in its pre-production trials by raising the yield rate of its sixth-generation high-bandwidth memory (HBM4) to 70%. This achievement...
Thursday 27 February 2025
SK Hynix begins first fab construction at Yongin cluster, eye 2027 completion
SK Hynix has advanced the groundbreaking of its first-phase Yongin Semiconductor Cluster plant (Yongin 1) from March 2025 to late February 2025 after the Yongin Special City government...
Wednesday 26 February 2025
YMTC's hybrid bonding patents: is Samsung losing ground in 400+ layer 3D NAND?
South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND...
Wednesday 26 February 2025
Samsung signs licensing agreement with YMTC for Hybrid Bonding tech
Samsung Electronics has reportedly signed a patent licensing agreement with Chinese NAND Flash manufacturer Yangtze Memory Technology Corp (YMTC) to license its Hybrid Bonding technology...
Wednesday 26 February 2025
SK Hynix to finalize Intel NAND takeover in March, cementing eSSD leadership
SK Hynix will finalize its acquisition of Intel's NAND flash business, now rebranded as Solidigm, in March 2025. This strategic move strengthens its enterprise SSD (eSSD) market position...
Friday 21 February 2025
SK Hynix CEO sees greater opportunities for semiconductor industry amid DeepSeek's impact
SK Hynix CEO Noh-Jung Kwak, reflecting on the emergence of China's DeepSeek, predicts that the generative AI model will ultimately have a positive impact on the semiconductor industry...
Friday 21 February 2025
Ex-Samsung executive sentenced for alleged 18nm DRAM tech leak to CXMT
A former Samsung Electronics senior manager was sentenced to seven years in prison and fined KRW200 million (approx. US$138,820) by a South Korean court for allegedly leaking core...
Wednesday 19 February 2025
China's HBM breakthrough intensifies pressure on Samsung
China's memory industry is making remarkable progress, substantially closing the technology gap with South Korea in DRAM and NAND flash manufacturing. The country has also achieved...
Wednesday 19 February 2025
SK Hynix expands HBM3E production, boosting Hanmi Semiconductor's growth despite DeepSeek threat
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
Wednesday 19 February 2025
SK Hynix taps VP to lead US HBM packaging facility
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...