Taiwan-based LandMark Optoelectronics, dedicated to supplying GaAs and InP-based epi-wafers and silicon photonics components, expects its silicon photonics revenue for the entire...
Lockheed Martin and GlobalFoundries (GF) have announced a strategic collaboration to advance semiconductor manufacturing and innovation in the United States and to enhance the security,...
The European Union (EU) has been seeking deeper synergy with Taiwan's semiconductor ecosystem as it pursues greater autonomy in the sector. As a part of this effort, the EU-Taiwan...
Ayar Labs has completed Series C1 funding, raising an additional US$25 million to bring its total Series C funding to US$155 million, according to the US-based silicon photonics chip...
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
US-based SkyWater Technology, a Category 1A Trusted Foundry accredited by the Defense Microelectronics Activity (DMEA) under the US Department of Defense, announced on May 2 that...
Despite uncertain macro environments worldwide, 400G (Gbps) optical communications solutions will enter a growth period in 2023, which will enable many related players including LuxNet...
On January 31, Belgium-based semiconductor research hub Imec announced that it demonstrated co-integration of its high-quality silicon nitride waveguide technology with its silicon...
Taiwan-based LandMark Optoelectronics, which specializes in GaAs and InP epi-wafers for optical communications, expects to post another on-year revenue increase in 2023, when the...
Taiwan's ICs and materials distributors are keen on diversifying business deployments and product applications into fields such as biotech, healthcare, green energy and even device...
Elite Advanced Laser (eLASER ) remains cautious about its business prospects for the first half of 2023 while reiterating its focus on demand for server-use high-speed optical communication...
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
ASE Technology is partnering with TSMC on the development of silicon photonics (SiPh), and has cut into the supply chain of Tier-1 chip vendors for co-packaged optics (CPO) products,...
Regional politics will become a new variable to the development of the semiconductor industry in the next decade, and semiconductor players should manage to learn its unpredictability...
