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NEWS TAGGED SIPH
Friday 13 December 2024
TSMC to integrate CoWoS and SiPh in 2026, sources say
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
Wednesday 30 October 2024
Samsung enters the SiPh race with I-Cube So/Eo, challenging TSMC and China's rising stars
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
Thursday 24 October 2024
LandMark optimistic about 2025 as 800G SiPh becomes mainstream
Optical epitaxy specialist LandMark Optoelectronics reported a gross margin increase to 27.58% in the third quarter of 2024, driven by silicon photonics (SiPh) shipments to high-speed...
Wednesday 23 October 2024
Holtek joins SiPh supply chain, 400G modules to launch in 2025
Microcontroller unit (MCU) firms have been eagerly venturing into the optical transceiver module market, as silicon photonics (SiPh) technology continues to attract attention. According...
Wednesday 23 October 2024
Guangdong locks in SiPh core project, aiming for breakthrough in 2030
China is accelerating its silicon photonics (SiPh) industry development as part of its next-generation semiconductor policy, with a recently released official action plan focusing...
Tuesday 1 October 2024
SiPh and glass substrates seen as new areas of focus for TSMC and Nvidia
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
Thursday 26 September 2024
AMD reportedly teams up with 2 Taiwan startups for SiPh R&D collaboration
AMD has teamed up with Taiwan-based BE Epitaxy Semiconductor Technology and Best Epitaxy Manufacturing for joint development of next-generation silicon photonics (SiPh) technology,...
Friday 13 September 2024
Nvidia AI chip supply chain grows amid market skepticism
The supply chain for Nvidia's AI processors continues to evolve and expand, despite recent negative market sentiment, according to industry sources.
Tuesday 10 September 2024
Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Monday 9 September 2024
AI boom drives silicon photonics era, Taiwan seizes opportunities via international partnerships
The burgeoning AI industry is accelerating the arrival of the silicon photonics (SiPh) era, and Taiwan's industry is actively promoting various integration efforts to seize the growing...
Monday 9 September 2024
A new era of co-innovation between Taiwan and Canada starts with AI and semiconductors
The Canada-Taiwan Semiconductor Co-Innovation Forum, held on September 6 in Hsinchu during the week of SEMICON Taiwan 2024, attracted Taiwanese semiconductor supply chain companies...
Friday 6 September 2024
Foxconn evaluates European semiconductor packaging plant, continues advanced technology development
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
Friday 6 September 2024
ASE establishes SiPhIA consortium, CEO Tien Wu sees accelerated progress in silicon photonics
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Thursday 5 September 2024
Heterogeneous integration crucial to SiPh and compound semiconductor interconnects
Win Semiconductors (WinSemi), a GaAs foundry, believes that heterogeneous integration will become a crucial technology for interconnects in silicon photonics (SiPh) and compound se...
Thursday 5 September 2024
EML technology to reach market faster than SiPh, says Broadcom exec
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...