According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
Spun off from a laboratory at Inha University in South Korea, PhotoniSol, a dynamic startup, is leading the charge in silicon photonic integrated devices. The company focuses on commercializing...
Win Semiconductors forecasts a larger role for compound semiconductors in wireless and optical communications as well as silicon photonics, driven by advancements in AI. The company...
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
As AUO (AU Optronics) undergoes a strategic transformation, the company maintains a cautious stance on fan-out panel level packaging (FOPLP) but shows increased optimism about silicon...
Photonic computing is experiencing renewed interest, driven by the growing demands of AI computations. The Mach-Zehnder Interferometer (MZI) serves as a cornerstone of Photonic Integrated...
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
The integration of silicon photonics co-packaged optics (CPO) technology into network communication chips has become inevitable**, driven by its ability** to enable high-speed, low-latency...
Optical epitaxy specialist LandMark Optoelectronics reported a gross margin increase to 27.58% in the third quarter of 2024, driven by silicon photonics (SiPh) shipments to high-speed...
Microcontroller unit (MCU) firms have been eagerly venturing into the optical transceiver module market, as silicon photonics (SiPh) technology continues to attract attention. According...
China is accelerating its silicon photonics (SiPh) industry development as part of its next-generation semiconductor policy, with a recently released official action plan focusing...
The advancement of generative AI hinges on enhancing the scale and refinement of current AI models, according to recent statements from numerous AI industry leaders. These improvements...
Hubei Jiufengshan Laboratory, with CNY8.2 billion (approx. US$1.12 billion) subsidy from the Chinese government, has integrated a laser light source into a silicon chip, marking a...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
AMD has teamed up with Taiwan-based BE Epitaxy Semiconductor Technology and Best Epitaxy Manufacturing for joint development of next-generation silicon photonics (SiPh) technology,...
