Recently, SK Hynix CEO Noh-Jung Kwak traveled to Europe, where he is expected to meet with IMEC executives including CEO Luc Van den Hove. He will also engage with several European...

SK Hynix is reducing its CIS and wafer foundry operations to prioritize high-margin HBM and AI memory products. It is also expanding into emerging technologies, including Compute...

Samsung Electronics and SK Hynix are reportedly advancing high-value-added technologies such as High Bandwidth Memory 4 (HBM4) and Compute Express Link (CXL) to maintain their dominance...

Samsung Electronics is encountering significant challenges, especially in its semiconductor business. Beyond stagnation in its foundry business, concerns about its competitiveness...

Samsung Electronics reported an operating profit of less than KRW10 trillion (approx. US$7.42 billion) for the third quarter of 2024. In addition to its poor financial performance,...

The DRAM equipment investment plans of Samsung Electronics (Samsung) and SK Hynix in 2025 may vary based on the sales of high bandwidth memory (HBM).

These are the most-read DIGITIMES Asia stories in the week of October 7 - October 13.

Samsung Electronics reported consolidated revenue of KRW79 trillion (about US$58.6 billion) and an operating profit of KRW9.1 trillion for the third quarter of 2024, missing market...

As general DRAM prices decline, recent forecasts indicate a divergence in the DRAM expansion strategies of Samsung Electronics (Samsung) and SK Hynix for 2025. Samsung plans on reducing...

NAND Flash prices have begun to decline due to lower-than-expected IT demand. Major memory companies are reportedly planning to adjust their utilization rates and may refocus investments...

SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...

Despite AI-driven growth in the NAND flash market, the rising costs of technological transitions remain a major hurdle.

Apple's mixed reality (MR) headset, the Vision Pro, is known to feature two key chips—the M2 for handling most computations and the R1 for reducing latency and processing sensor...

SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...

Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...