SK Hynix has revealed plans to establish a new company in Indiana through its third quarter 2024 business report, marking a significant step toward building a semiconductor packaging...
South Korea's semiconductor sector anticipates that Donald Trump's presidential victory could intensify restrictions on China's high-tech industries, particularly affecting the semiconductor...
South Korea's thriving AI industry has catalyzed growth across its materials, components, and equipment sectors, particularly within the AI memory supply chain. South Korean manufacturer...
Solidigm, a U.S. subsidiary fully-owned by Korea's SK Hynix, and a leading provider of innovative NAND flash memory solutions, introduced today the 122TB (terabyte) Solidigm D5-P5336...
Nvidia is gearing up to debut its next-gen "Rubin" GPU in 2025, featuring eight HBM4 chips, with a Rubin Ultra version to follow, packing twelve. In a strategic bid to reclaim HBM...
Kioxia has announced plans to develop next-generation memory technology, Compute Express Link (CXL), to address the growing demands of AI, with support from the Japanese government...
The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Nvidia CEO Jensen Huang emphasized during a video call at the SK AI Summit in Seoul's Coex that he aims to strengthen collaboration with SK Hynix in the high bandwidth memory (HBM)...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean memory maker SK Hynix is set to establish a dedicated HBM...
South Korean semiconductor firms have shown little interest in investing in India, even as U.S. and Japanese semiconductor companies begin to establish a presence there.
