Samsung Electronics reported consolidated revenue of KRW79 trillion (about US$58.6 billion) and an operating profit of KRW9.1 trillion for the third quarter of 2024, missing market...
As general DRAM prices decline, recent forecasts indicate a divergence in the DRAM expansion strategies of Samsung Electronics (Samsung) and SK Hynix for 2025. Samsung plans on reducing...
NAND Flash prices have begun to decline due to lower-than-expected IT demand. Major memory companies are reportedly planning to adjust their utilization rates and may refocus investments...
SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...
Apple's mixed reality (MR) headset, the Vision Pro, is known to feature two key chips—the M2 for handling most computations and the R1 for reducing latency and processing sensor...
SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...
Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation...
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Recent debates in the semiconductor industry have raised concerns about a potential oversupply of high bandwidth memory (HBM). Analysts believe a key factor will be whether Samsung...
Despite AI-driven growth in the semiconductor industry, South Korea is facing a critical shortage of skilled workers. A preference among students for medical degrees and aggressive...
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...