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NEWS TAGGED SK HYNIX
Wednesday 16 October 2024
2025 DRAM expansion strategies: Samsung's conservative approach vs. SK Hynix's aggressive stance
The DRAM equipment investment plans of Samsung Electronics (Samsung) and SK Hynix in 2025 may vary based on the sales of high bandwidth memory (HBM).
Monday 14 October 2024
Weekly news roundup: Samsung's HBM3E reportedly clears Nvidia's on-site inspection
These are the most-read DIGITIMES Asia stories in the week of October 7 - October 13.
Friday 11 October 2024
Samsung's HBM3E delays could shift memory market lead to SK Hynix
Samsung Electronics reported consolidated revenue of KRW79 trillion (about US$58.6 billion) and an operating profit of KRW9.1 trillion for the third quarter of 2024, missing market...
Friday 11 October 2024
2025 DRAM outlook: Samsung, SK Hynix adopt diverging expansion strategies
As general DRAM prices decline, recent forecasts indicate a divergence in the DRAM expansion strategies of Samsung Electronics (Samsung) and SK Hynix for 2025. Samsung plans on reducing...
Wednesday 9 October 2024
Industry considers production cuts as NAND prices drop and IT demand fails to meet expectations
NAND Flash prices have begun to decline due to lower-than-expected IT demand. Major memory companies are reportedly planning to adjust their utilization rates and may refocus investments...
Tuesday 8 October 2024
SK Hynix highlights its HBM production efficiency; 8.8 times better than Samsung and Micron
SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...
Tuesday 8 October 2024
NAND flash market faces cost crunch: Samsung and SK Hynix buck the trends eyeing expansion
Despite AI-driven growth in the NAND flash market, the rising costs of technological transitions remain a major hurdle.
Tuesday 8 October 2024
Apple Vision Pro's high-cost components revealed: SK Hynix powers RI chip
Apple's mixed reality (MR) headset, the Vision Pro, is known to feature two key chips—the M2 for handling most computations and the R1 for reducing latency and processing sensor...
Monday 7 October 2024
SK Hynix diversifies supply chain, challenges Hanmi's grip on HBM equipment
SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...
Monday 7 October 2024
Samsung's HBM3E reportedly clears Nvidia's on-site inspection; mass production still pending
Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...
Tuesday 1 October 2024
SK Hynix's debut at TSMC OIP forum showcases HBM3E, H200 breakthrough, boosts Nvidia partnership
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation...
Tuesday 1 October 2024
SK Hynix advances 16-layer HBM3E to maintain market lead
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
Monday 30 September 2024
HBM oversupply looms as Samsung seeks Nvidia validation for HBM3E
Recent debates in the semiconductor industry have raised concerns about a potential oversupply of high bandwidth memory (HBM). Analysts believe a key factor will be whether Samsung...
Thursday 26 September 2024
South Korea's semiconductor sector struggles amid severe talent shortage
Despite AI-driven growth in the semiconductor industry, South Korea is facing a critical shortage of skilled workers. A preference among students for medical degrees and aggressive...
Thursday 26 September 2024
SK Hynix begins volume production of 12-layer HBM3E
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...