Tae-won Chey, CEO and chairman of SK, was quoted in recent South Korean media reports as addressing the market's growing fears about the AI bubble and the commercialization of sixth-generation...

As AI applications proliferate, global tech giants are ramping up investments in data centers worldwide. While traditional hubs like the US, Europe, Japan, and China remain pivotal,...

The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...

SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes,...

The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...

China is attempting to produce High-Bandwidth Memory (HBM) in hopes of regaining control over AI, according to South Korean industry insiders.

SK Hynix is set to showcase its latest advancements in its memory technologies and products at the upcoming Future Memory and Storage (FMS) 2024 event.

SK Hynix is reportedly considering an initial public offering (IPO) for its solid-state drive (SSD) subsidiary, Solidigm, in the US, following a surge in demand for enterprise SSDs...

SK Hynix has announced board approval for a KRW9.4 trillion (approximately US$6.77 billion) investment to construct its first plant and related operational facilities at the Yongin...

SK Hynix has introduced what it claims to be the industry's best-performing GDDR7, a next-generation graphics memory product.

SK Hynix Inc. announced today that it has decided to invest about KRW 9.4 trillion in building the first fab and business facilities of the Yongin Semiconductor Cluster after the...

Benefiting from its High Bandwidth Memory (HBM) business, SK Hynix has experienced substantial revenue growth and forecasts a doubling of shipments in 2024. Regarding recent concerns...

The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.

As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...

Samsung and SK Hynix plan to invest KRW360 trillion (US$259.2 billion) and KRW120 trillion, respectively, to build 10 semiconductor fabs in Yongin, South Korea, making it the world's...