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NEWS TAGGED SK HYNIX
Monday 17 June 2024
HBM competition (3): the likely changes in the industry ecosystem
Before we discuss the possible impact of HBM4 standard interface on the DRAM industry, we need to review the current status of the DRAM industry.
Friday 14 June 2024
AI demand helps South Korean chip export prices to record jump in May
The price of South Korea's semiconductor exports...
Thursday 13 June 2024
HBM competition (2): The choice of HBM's next steps?
It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions.
Friday 7 June 2024
SK top executives visit TSMC's new chairman in secret mission
In a strategic move to bolster AI semiconductor competitiveness, SK Group Chairman Chey Tae-won and SK Hynix President Kwak Noh-Jun made a whirlwind visit to Taiwan on June 6.
Friday 7 June 2024
AI-enabled PCs, smartphones with PIM technology on the horizon
Samsung Electronics and SK Hynix have been at the forefront of developing the Processing-In-Memory (PIM) technology in recent years. They are poised to integrate it into AI-enabled...
Wednesday 5 June 2024
Micron has advantage in HBM4 orders for Nvidia's Rubin platform, said South Korean media
Nvidia CEO Jensen Huang disclosed that the next-generation Rubin platform will be equipped with 6th-gen high bandwidth memory - HBM4 at...
Monday 3 June 2024
SK Hynix races ahead in HBM with next-gen innovation
SK Hynix is swiftly advancing in the High-Bandwidth Memory (HBM) arena, aiming to develop next-generation HBM that incorporates computing, communication, and other advanced functions...
Monday 3 June 2024
Micron's latest HBM performance catches the eyes of South Korean competitors
Although the current High-Bandwidth Memory (HBM) market is still dominated by SK Hynix and Samsung Electronics, Micron has recently caught up rapidly. Following its earlier announcement...
Monday 3 June 2024
Samsung grapples with strikes and rivalry as SK Hynix ramps up investments
Samsung Electronics' semiconductor division is under pressure, facing fierce competition from industry rivals and internal...
Thursday 30 May 2024
Samsung's new chip chief seeks to rally troops after setbacks
The new head of Samsung Electronics Co.'s semiconductor division urged employees to work their way past challenges in the business, making his first remarks to staff after the surprise...
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Tuesday 28 May 2024
Former SK Hynix employee arrested on allegations of leaking memory technology to Huawei
South Korean media outlets Money Today and Yonhap News reported that the Industrial Technology Security Investigation Team of the South Gyeonggi Provincial Police...
Monday 27 May 2024
South Korean media analyze why Samsung's HBM fails to pass Nvidia certification test
Samsung Electronic's HBM3E failed to pass Nvidia's verification tests due to heating and power consumption concerns. Although Samsung declined to comment on specific customers, the...
Monday 27 May 2024
Are TSMC and SK Hynix on the same page regarding HBM4 collaboration?
SK Hynix and TSMC are collaborating on the development of the next generation of high bandwidth memory (HBM). Although it is widely believed that SK Hynix would entrust TSMC with...
Monday 27 May 2024
South Korea looks to bolster IC design sector, currently 1% of global market
South Korea has unveiled a support package to strengthen its semiconductor industry and catch up with international rivals. The plan aims to support large companies and weaker sectors,...