TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
ASE Technology Holding (ASEH) is expected to see its revenue rebound substantially in March after reaching a low point in February, as the OSAT continues to offload "wafer bank" inventories...
As fab utilization rates fall due to slowing customer orders, OSATs have implemented cost-cutting measures such as encouraging employees to take leave, according to industry source...
High-performance computing (HPC) chip demand has been difficult for IC test interface solution vendors to predict, but they anticipate recovery could start in the second half of 20...
OSAT firm Siliconware Precision Industries (SPIL), wholly owned by ASE Technology Holding (ASEH), has kicked off operations at its new plant in Changhua, central Taiwan.
Taiwan-based ASE Technology Holding (ASEH) ranked 72 in the "2023 Asia Supply Chain Market Cap 100 Ranking," representing a significant improvement from the 81 it held a year earli...
Taiwan-based OSATs with manufacturing sites in China, such as King Yuan Electronics (KYEC) and ASE Group, have quietly ramped up their capacity supports for China-based clients including...
OSATs including Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) are quietly looking to scale up output at their plants in China to fulfill orders from the...
Qualcomm has contracted both Amkor Technology and Siliconware Precision Industries (SPIL) to provide backend services for its just-unveiled flagship smartphone SoC, according to industry...
ASE Technology and other first-tier IC backend houses have seen their fab capacity utilization rates start loosening, as fabless clients have also begun to ask them to defer order...
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...
Chipmakers have kicked off shipments for the upcoming iPhones slated for launch in September, but uncertainty remains whether the shipments will continue to see strong momentum between...
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
