CONNECT WITH US
NEWS TAGGED SPIL
Tuesday 29 October 2024
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Friday 11 October 2024
TSMC accelerates Fab AP8 project for CoWoS advanced packaging
TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...
Thursday 3 October 2024
TSMC's backend equipment suppliers benefit from AI chip demand
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
Tuesday 11 June 2024
Weekly news roundup: SPIL injects US$1.276 billion into Penang to build packaging, testing capacity
These are the most-read DIGITIMES Asia stories in the week of June 3 – June 7.
Monday 3 June 2024
SPIL invests US$1.276 billion to build facility in Penang, Malaysia
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Tuesday 17 October 2023
Suppliers plan ahead amid potential US ban on more AI chips
The US reportedly may impose stricter restrictions on Chinese chipmakers and Nvidia's downgraded AI H800 processors. In light of this, Taiwanese testing companies and probe card providers...
Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Friday 14 July 2023
Backend fab toolmakers see short lead-time orders from TSMC
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Wednesday 14 June 2023
SPIL cuts into Marvell supply chain, sources say
Siliconware Precision Industries (SPIL) with its 2.5D and fan-out packaging technology has cut into the supply chain of network processor vendor Marvell, according to industry sour...
Monday 12 June 2023
TSMC on track to double CoWoS capacity for AI GPU/HPC chips
With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
Monday 22 May 2023
ASE lands Broadcom orders for silicon photonics-based networking chips
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Wednesday 3 May 2023
OSATs remain cautious about handset IC demand
OSATs remain cautious about handset IC demand despite the emergence of short lead-time orders, according to industry sources.
Tuesday 2 May 2023
OSATs see a delay in capacity demand from MediaTek
With unclear business outlook from Taiwan's mobile SoC vendor MediaTek, its backend partners including ASE Technology, Powertech Technology (PTI), Sigurd Microelectronics and King...
filusch fiore kommunikations.design GmbH
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research