During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually...
NVIDIA founder and CEO Jensen Huang visited Taichung on January 16, with his first stop being the new Tan-Ke factory of Siliconware Precision Industries (SPIL), a leader in global...
Nvidia CEO Jensen Huang's visit to Siliconware Precision Industries (SPIL) on his current trip to Taiwan has garnered market attention to the company's emphasis on advanced packagi...
Nvidia CEO Jensen Huang's first stop in Taiwan is confirmed to be Taichung. According to an announcement from ASE Holdings' subsidiary SPIL, on the afternoon of January 16, Huang...
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
The US reportedly may impose stricter restrictions on Chinese chipmakers and Nvidia's downgraded AI H800 processors. In light of this, Taiwanese testing companies and probe card providers...
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Siliconware Precision Industries (SPIL) with its 2.5D and fan-out packaging technology has cut into the supply chain of network processor vendor Marvell, according to industry sour...
