AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
ASE Technology and other Taiwan-based OSATs are gearing up for MediaTek's 5G mmWave chips solutions slated for launch in 2022, according to industry sources.
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Leading Wi-Fi chipmakers Qualcomm, Broadcom and even Intel are keenly developing Wi-Fi 7 SoCs, and may have their chips manufactured at TSMC using 6N RF process, looking to meet the...
Qualcomm will sharply cut back its modem chip supply for Apple's iPhones starting 2023, sparking speculation that Apple will have its in-house developed modem solution ready for the...
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Siliconware Precision Industries (SPIL) is building a new plant at the Central Taiwan Science Park (CTSP), which will become its main high-end packaging and testing base for the next...
