Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications, according...
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Siliconware Precision Industries (SPIL) is building a new plant at the Central Taiwan Science Park (CTSP), which will become its main high-end packaging and testing base for the next...
Suppliers including foundry TSMC are expected to kick off production for the redesign of Sony's PlayStation 5 (PS5) games console between the second and third quarters of 2022, according...
Some Taiwan-based IC distributors and testing service vendors in AMD's supply chain are benefiting significantly from robust sales of the US firm's HPC (high-performance computing)...
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing...
TSMC's bold US$100 billion capex plan for the next three years has greatly boosted the confidence of its ecosystem partners about bright prospects for the semiconductor industry, inspiring...
Prices for packaging-use epoxy molding compounds (EMC) will rise 10% starting April and supply shortages are expected to persist through the end of 2021 at least, according to Chang...
OSAT firm Siliconware Precision Industries (SPIL), wholly owned by ASE Technology, has secured 14.5 hectares of land in the Central Taiwan Science Park in Changhua County, where the...
Taiwan's first-tier IC designers including MediaTek, now facing increasingly tight capacity support from domestic backend houses, are expected to release some orders to Chinese OSATs...
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
