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Monday 6 July 2026
Greatek Electronics advances Taiwan+1 plan with acquisition of Onsemi Philippines packaging plant
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging...
Monday 6 July 2026
Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a...

Saturday 4 July 2026
SoftBank targets AI cloud market with 10GW US rental plan

SoftBank Group (SBG) and telecom subsidiary SoftBank said they will set up a new company in the US in July 2026 to rent out AI computing...

Friday 3 July 2026
TSMC wins approval for US$20 billion Arizona expansion
Taiwan's Department of Investment Review (DIR) under the Ministry of Economic Affairs (MOEA) has approved Taiwan Semiconductor Manufacturing Company's (TSMC) US$20 billion capital...
Friday 3 July 2026
CSCC expands Pingnan plant to lift carbon materials output
China Steel Chemical Corporation (CSCC) is expanding its Pingnan plant to increase development capacity for advanced carbon materials and graphite blocks. The Taiwan-based subsidiary...
Thursday 2 July 2026
China ICT vendor H3C enters new AI server chapter after Unisplendour leadership reset

Unisplendour has reset its leadership as H3C, its core ICT subsidiary, enters a tougher phase in China's AI infrastructure buildout...

Thursday 2 July 2026
AI server demand drives MiTAC to expand in Taiwan, Vietnam, and California
MiTAC Holdings' subsidiary, MiTAC Computing Technology, has won strong demand from US cloud customers, driving a sharp rise in orders and a global expansion plan from Asia to North...
Monday 29 June 2026
Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong...

Monday 29 June 2026
Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
Friday 26 June 2026
Altos and FPT sign MOU to scale enterprise AI and HPC across Asia-Pacific
Altos, a subsidiary of Acer, said on June 24, 2026, that it signed a memorandum of understanding (MOU) with Vietnam-based FPT to jointly deploy and commercialize enterprise AI across...
Thursday 25 June 2026
Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
Thursday 25 June 2026
Acer Gadget sees double-digit growth as PC peripherals and smart living drive expansion
Acer Gadget said momentum in its core PC peripherals and smart living accessories businesses drove a record revenue start to 2026, signaling potential improvement in operating performance...
Thursday 25 June 2026
E Ink subsidiary scales solvent-free OCA to support higher-quality, lower-carbon displays
E.Comis Technology, a subsidiary of E Ink Holdings Group, said it has scaled a self-developed, solvent-free optically clear adhesive to meet growing demand for thinner displays, better...
Thursday 25 June 2026
China wafer champion turns to US$1.6B overhaul to stop losses
National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai...
Wednesday 24 June 2026
IBM targets Anderon venture to anchor quantum wafer supply
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon,...