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    Commentary: Behind Micron's bet for a long memory demand cycles
    9h 46min ago
    Interview: Qnity's Taiwan investment to focus on advanced packaging, CPO and cooling
    9h 46min ago
    GPU and ASIC new platforms to drive stronger server shipments in 2H26
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    South Korean memory makers weigh stronger profits from general DRAM than HBM
    9h 46min ago
    MCU price hike expectations drive early 1H26 pull-ins
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    iPhone 18 Pro price hike: Memory costs or margin play?
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    NEWS TAGGED SUBSIDIARY
    Monday 29 June 2026
    Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

    Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong...

    Monday 29 June 2026
    Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
    ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
    Friday 26 June 2026
    Altos and FPT sign MOU to scale enterprise AI and HPC across Asia-Pacific
    Altos, a subsidiary of Acer, said on June 24, 2026, that it signed a memorandum of understanding (MOU) with Vietnam-based FPT to jointly deploy and commercialize enterprise AI across...
    Thursday 25 June 2026
    Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
    JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
    Thursday 25 June 2026
    Acer Gadget sees double-digit growth as PC peripherals and smart living drive expansion
    Acer Gadget said momentum in its core PC peripherals and smart living accessories businesses drove a record revenue start to 2026, signaling potential improvement in operating performance...
    Thursday 25 June 2026
    E Ink subsidiary scales solvent-free OCA to support higher-quality, lower-carbon displays
    E.Comis Technology, a subsidiary of E Ink Holdings Group, said it has scaled a self-developed, solvent-free optically clear adhesive to meet growing demand for thinner displays, better...
    Thursday 25 June 2026
    China wafer champion turns to US$1.6B overhaul to stop losses
    National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai...
    Wednesday 24 June 2026
    IBM targets Anderon venture to anchor quantum wafer supply
    IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon,...
    Wednesday 24 June 2026
    Alibaba sues US Defense Department over military company label, raising contract and free-speech concerns
    Alibaba Group Holding and its US subsidiary filed a suit on June 23, 2026, in federal court in California, seeking to overturn the Department of Defense's designation of Alibaba as...
    Tuesday 23 June 2026
    Huawei renews Wi-Fi 6 patent push, putting networking equipment makers on alert

    Huawei has continued to pursue patent litigation against networking equipment makers in Europe in recent years, with its latest case...

    Monday 22 June 2026
    Jio Platforms files draft paper for IPO
    Jio Platforms Limited (JPL), the technology and digital services arm of Reliance Industries Limited, has formally initiated its public listing process by filing a Draft Red Herring...
    Thursday 18 June 2026
    Mirle Automation names CEO as chair

    Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the...

    Thursday 18 June 2026
    WUS and its subsidiary keep complementary AI partnership
    A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in...
    Wednesday 17 June 2026
    WFE Technology to transform into holding company, eyeing smart building growth
    Electronic components distributor WFE Technology has launched a transformation plan to become an investment holding company. The company said smart building demand is boosting its...
    Wednesday 17 June 2026
    Nexchip reportedly broadens semiconductor ambitions with new design and materials subsidiary

    Chinese foundry Nexchip is expanding beyond wafer manufacturing with the establishment of a new wholly owned subsidiary, marking its...

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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook