Globalfoundries and Texas Instruments (TI) reportedly have defeated a group of Taiwan-based niche memory chip providers to win the rights for the purchase of a major portion of the...
Globalfoundries and Texas Instruments (TI) have both provided offers to acquire part of the equipment installed at Powerchp Technology's P3 12-inch plant, bringing uncertainty to...
Texas Instruments (TI) has announced plans to reduce costs and focus investments in its wireless business on embedded markets. Cost reductions include the elimination of about 1,700...
The Petrov Group has announced a new 333-page/211-figure report titled "Texas Instrument's Power Business - Edition 2012". Texas Instruments (TI), the largest analog IC...
To ease the impact created by its WoA Surface tablet PC, Microsoft has been negotiating with brand vendors including Hewlett-Packard (HP) and Dell since July hoping to pacify them;...
Texas Instruments Incorporated (TI) introduced the industry's first fully-integrated, seven-channel relay driver that can support low-voltage relays from as low as 1.8 V up to 5 V...
Hewlett-Packard (HP) and Dell are both set to launch Windows RT-based tablet PCs after the release of the new operating system. HP will adopt chip solutions from Texas Instruments...
Clientron Corp., a world-leading supplier of thin client and embedded systems, in collaboration with Texas Instruments Incorporated (TI), debuts it first TI SoC (System-on-Chip) based...
The MEMS market reached US$10.2 billion in 2011, up 17%, according to Yole Developpement. STMicroelectronics saw its MEMS sales rise 42% to more than US$900 million on exploding demand...
Samsung Electronics' in-house development of an ARM-architecture processor, Exynos, for use in its Galaxy S III smartphone signals Samsung's stepping into development of ARM processors...
Intel will adopt the Texas Instruments-developed (TI) WL1283 Wi-Fi/Bluetooth/GPS chips for its Medfield platform to be launched in the second quarter of 2012 and Broadcom-developed...
Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...
Supply disruptions spurred by the Japan earthquake are continuing to cause pricing increases for general-purpose analog components that are used in most types of electronic equipment...
Insyde Software has announced the delivery of UEFI BIOS and engineering services to customers designing ultra-thin laptops, tablets and mobile internet devices based on the ARM-based...