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Wednesday 29 June 2011
Insyde brings UEFI BIOS to TI OMAP platform supporting next-version Windows
Insyde Software has announced the delivery of UEFI BIOS and engineering services to customers designing ultra-thin laptops, tablets and mobile internet devices based on the ARM-based...
Wednesday 15 June 2011
TI reportedly cuts wafer starts at TSMC, UMC
Texas Instruments (TI) has cut its orders to Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), according to sources in the industry...
Friday 13 May 2011
TSMC receives more requests to produce analog chips using 12-inch, advanced processes
A number of international analog IC companies have been in talks with Taiwan Semiconductor Manufacturing Company (TSMC) for allocation of 12-inch wafer production capacity to put...
Thursday 12 May 2011
TI remains largest power IC supplier but competition is fierce, says IMS
Texas Instruments (TI) remained the largest supplier in the power management and driver IC market in 2010, a year in which most suppliers experienced an exploding market but struggled...
Friday 15 April 2011
TI certifies 8-inch wafers from SAS, says paper
Eight-inch epitaxy wafers by Taiwan-based Sino-American Silicon Products (SAS) has been certified by Texas Instruments (TI), according to a Chinese-language Commercial Times...
Wednesday 13 April 2011
TI announces first USB-IF certified four-port host controller
Texas Instruments (TI) has announced that it is the first semiconductor company to receive certification from the USB Implementer's Forum (USB-IF) for its SuperSpeed USB (USB 3.0)...
Thursday 7 April 2011
Commentary: TI triggers new competition in analog IC market
After dedicating its own 12-inch wafer fab to the production of analog ICs, TI has taken over National Semiconductor (NS), with the aim of boosting its share in the global market...
Wednesday 6 April 2011
TI to acquire National Semiconductor for US$6.5 billion
Texas Instruments (TI) has signed a definitive agreement to purchase National Semiconductor in an all-cash transaction of about US$6.5 billion. Both companies will operate independently...
Wednesday 23 March 2011
Digitimes Insight: Sony, Renesas, TI impacted by earthquake for supply of ODD components
Sony, Renesas Electronics and Texas Instruments (TI), among makers of components of optical disc drives (ODDs) in Japan, have suffered the most impact of the large earthquake hitting...
Thursday 17 March 2011
Nvidia launches new 3D Vision glasses and entry-level GPU
Nvidia recently launched a new 3D Vision bundle priced US$149, lower than US$199 of the previous 3D Vision bundle, to boost demand for 3D applications, according to the company.
Tuesday 15 March 2011
Japan earthquake damages factories, says TI
Texas Instruments (TI) has said that its manufacturing site in Miho, Japan, about 40 miles northwest of Tokyo, suffered substantial damage during the recent earthquake.
Tuesday 8 March 2011
Standalone application processors are wining in mobility markets, says Petrov Group (part 1)
Several years ago there was a widely accepted expectation that application mobile processors would be fully integrated with baseband processors on a single chip. However, today we...
Wednesday 2 March 2011
Taiwan analog IC prices affected by TI 12-inch fab going on-line
With Texas Instrument's (TI) 12-inch fab to soon commence production of analog ICs and the company lowering prices since the second half of 2010, a new analog IC price war is expected...
Wednesday 23 February 2011
USB 3.0 interface to become mainstream sooner or later: Q&A with Dan Harmon, interface product marketing manager, Texas Instruments
Texas Instruments (TI) is actively venturing into the USB 3.0 interface market for notebooks, desktops and smartphones as rival Renesas Electronics is still thriving in the segment...
Wednesday 26 January 2011
Switch to 8-inch wafers to provide sufficient capacity and inventory flexibility for analog IC design houses
With the imminent entry of Texas Instrument's (TI) 12-inch analog IC process, Taiwan-based analog IC design houses have looked to transition to 8-inch wafers since the second half...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research