Intel will adopt the Texas Instruments-developed (TI) WL1283 Wi-Fi/Bluetooth/GPS chips for its Medfield platform to be launched in the second quarter of 2012 and Broadcom-developed...
Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...
Supply disruptions spurred by the Japan earthquake are continuing to cause pricing increases for general-purpose analog components that are used in most types of electronic equipment...
Insyde Software has announced the delivery of UEFI BIOS and engineering services to customers designing ultra-thin laptops, tablets and mobile internet devices based on the ARM-based...
Texas Instruments (TI) has cut its orders to Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), according to sources in the industry...
A number of international analog IC companies have been in talks with Taiwan Semiconductor Manufacturing Company (TSMC) for allocation of 12-inch wafer production capacity to put...
Texas Instruments (TI) remained the largest supplier in the power management and driver IC market in 2010, a year in which most suppliers experienced an exploding market but struggled...
Eight-inch epitaxy wafers by Taiwan-based Sino-American Silicon Products (SAS) has been certified by Texas Instruments (TI), according to a Chinese-language Commercial Times...
Texas Instruments (TI) has announced that it is the first semiconductor company to receive certification from the USB Implementer's Forum (USB-IF) for its SuperSpeed USB (USB 3.0)...
After dedicating its own 12-inch wafer fab to the production of analog ICs, TI has taken over National Semiconductor (NS), with the aim of boosting its share in the global market...
Texas Instruments (TI) has signed a definitive agreement to purchase National Semiconductor in an all-cash transaction of about US$6.5 billion. Both companies will operate independently...
Sony, Renesas Electronics and Texas Instruments (TI), among makers of components of optical disc drives (ODDs) in Japan, have suffered the most impact of the large earthquake hitting...
Nvidia recently launched a new 3D Vision bundle priced US$149, lower than US$199 of the previous 3D Vision bundle, to boost demand for 3D applications, according to the company.
Texas Instruments (TI) has said that its manufacturing site in Miho, Japan, about 40 miles northwest of Tokyo, suffered substantial damage during the recent earthquake.
Several years ago there was a widely accepted expectation that application mobile processors would be fully integrated with baseband processors on a single chip. However, today we...
