CONNECT WITH US
NEWS TAGGED TSMC
Thursday 22 August 2024
xMEMS aims for 2025 production of groundbreaking cooling SoC with 3-pronged market entry strategy
US-based xMEMS Labs is set to deliver its newly unveiled XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing MEMS technology,...
Thursday 22 August 2024
Global foundry revenue rises on AI demand
The global foundry industry's revenue grew about 9% sequentially and 23% year on year in the second quarter of 2024, according to Counterpoint Research. The sequential growth was...
Thursday 22 August 2024
TSMC's German fab set to offer job opportunities and promote wafer ecosystems in Europe
Dresden officially welcomed the construction of a new wafer fab by TSMC with a groundbreaking ceremony on August 20.
Wednesday 21 August 2024
Intel in tight spot with no news on progress in Germany
Having received a subsidy of EUR10 billion (US$11 billion) from the German government to complete construction and start production within three years, what is the newest progress...
Wednesday 21 August 2024
Why Dresden is TSMC's choice for its first wafer fab in Europe
TSMC's first European wafer fab is set to be located in Dresden, Germany, a region already recognized as a significant chip manufacturing hub in both Germany and Europe. This decision...
Wednesday 21 August 2024
TSC expands disilane market share
Taiwan Specialty Chemicals (TSC) has gradually expanded its share of the global disilane market, which is dominated by its Japan- and France-based counterparts.
Wednesday 21 August 2024
TSMC breaks ground on EUR10 billion semiconductor fab in Dresden
ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over...
Wednesday 21 August 2024
TSMC maintains steady pace in EU fab expansion as competitors slow projects
Many chipmakers have disclosed delays or suspensions in their new European fab projects; however, TSMC's are proceeding more efficiently than those of their competitors.
Tuesday 20 August 2024
ESMC breaks ground on Dresden fab
European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to...
Tuesday 20 August 2024
FOPLP v CoWoS: the next frontier for advanced chip packaging
As the application scope of genAI grows so does the market for its chips, with forecasts predicting explosive growth in the coming years.
Tuesday 20 August 2024
Is TSMC-Innolux FOPLP collaboration possible?
TSMC recently acquired Innolux's 5.5G LCD fab at the Southern Taiwan Science Park (STSP) for NT$17.14 billion (US$530.8 million), which includes factory buildings and associated facilities...
Tuesday 20 August 2024
TSMC places SHR orders with fab toolmakers
TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Tuesday 20 August 2024
Challenges ahead for Europe's first 12-inch wafer fab
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Monday 19 August 2024
Intel's 18A under fire: struggling yields, skepticism, and a race against TSMC
Intel has been attempting to shift the narrative to a more positive light following the company's "gruesome" series of trainwrecks that saw a disappointing second-quarter 2024 earnings...
Monday 19 August 2024
Intel Foundry's push for self-sufficiency could pave way for spin-off and rebranding
Is it time for Intel Foundry (IF) to be spun off as an independent entity? During the 2008-2009 financial crisis, AMD was forced to divest its wafer fabrication division, offloading...