Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing...
According to a Bloomberg analysis, ASML's orders grew by 23.7% in the second quarter of 2024, indicating smooth progress in TSMC's N2 process development, which may accelerate capacity...
Since Donald Trump has openly requested "protection fees" from Taiwan, various interpretations have emerged to gauge the attitude of the United States towards Taiwan's role in the...
Samsung Electronics is reportedly adjusting its investment pace and postponing the construction of the wafer foundry line at its Pyeongtaek Plant 4 (P4) due to difficulties in securing...
As the ICT and semiconductor markets recover, semiconductor material equipment supplier Wah Lee has experienced double-digit growth across its core businesses. Amid strong pull-in...
Mobile phone manufacturers are concerned about the increasing competition among chip vendors for advanced process capacity, despite the more optimistic demand forecasts.
TSMC has come up with a new definition of the foundry sector, a move aimed at dispelling market concerns about its dominance, as it braces for possible impacts on the global semiconductor...
C. C. Wei, chairman and CEO of TSMC, introduced the concept of "Foundry 2.0" and provided additional information regarding the company's advanced 2nm and A16 process technologies...
US Republican presidential candidate Donald Trump, in an interview with Bloomberg Businessweek, claimed that Taiwan had taken 100% of the chip business from the US without...
TSMC announced that revenue and margins exceeded guidance in the second quarter of 2024, and it expects revenue for the third quarter to increase 9.5% sequentially at the midpoint.
ASML experienced a significant increase in sales and net bookings over the last quarter, suggesting that TSMC might be intensifying its capital investments. However, potential tightened...
The monthly output of 3nm chips at TSMC will climb to 125,000 wafers in the second half of this year, up from 100,000 units currently, according to industry sources. The output ramp-up...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...