Taiwan Semiconductor Manufacturing Company (TSMC) announced on October 8 to subscribe to a NT$3.74 billion cash capital increase (approximately US$116 million) for Vanguard International...
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver...
After five years of development, Intel's Core Ultra 200V processor family, codenamed Lunar Lake, has been confirmed for manufacturing on TSMC's 3nm process, ushering in a shift in...
Boosted by short-term orders in the electronics supply chain and shipments of AI and high-performance computing (HPC) chips, Taiwan's wafer foundry industry posted better-than-expected...
The semiconductor industry is highly resource-intensive, requiring large amounts of water, electricity, and raw materials, including various chemicals, during production. Consequently,...
Cerebras Systems, a leading competitor in the AI processor market dominated by Nvidia, is preparing for an initial public offering (IPO) on Nasdaq. The company's S-1 filing reveals...
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
What happens when a tech giant starts to stumble? For outsiders, Intel's decline may come as a shock. However, for industry insiders, the failure of the semiconductor giant can be...
Synopsys has announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog...
