III-V compound epitaxial wafer maker Visual Photonics Epitaxy (VPEC) has reported consolidated revenues of NT$341.6 million (US$12.0 million) for March, the highest-ever monthly level,...
Taiwan's III-V semiconductor players including foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC), and IDM Transcom have all reported impressive sales results...
Epitaxial wafer supplier Visual Photonics Epitaxy Company (VPEC) is likely to see its March revenues top NT$300 million (US$10.56 million), buoyed by strong market demand for RF components,...
Taiwan's backend houses and III-V semiconductor suppliers are poised to explore business opportunities for RF and PA modules for space communication applications, demand for which...
Suppliers of GaAs-based power amplifiers and RF components will be ready to kick off shipments of related 5G-enabled products for Apple's next-generation iPhone lineup by the end...
Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
Taiwan's III-V IC firms including GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) as well as epi-wafer suppliers Visual Photonics Epitaxy (VPEC) and Intelligent...
Android-camp handset vendors including Samsung Electronics are expected to follow in the footsteps of Apple in incorporating direct time-of-flight (dToF) CMOS image sensors (CIS)...
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Component shipment momentum for iPhone 12 series continues to strengthen, with order visibility for VCM (voice coil motor) components for iPhone 12 Pro and Pro Max models clear through...
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
Qualcomm's next-generation mid-tier 5G SoC solutions will come with RF360's second-generation 5G GaAs power amplifiers (PA) that will enable handset makers to roll out new 5G phones...
Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...
Global shipments of end-market devices supporting the latest Wi-Fi 6E standards are expected to reach 310-320 million units in 2021, according to industry observers.
