TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess...
Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform...
Lam Research reported third-quarter 2026 revenue of US$8.2 billion, up 22% quarter-over-quarter, and forecast fourth-quarter revenue of US$8.6 billion, plus or minus US$400 million...
China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research...
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme...
AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of...
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies...
As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand...
The feasibility of Terafab's proposed construction was a major topic of discussion among semiconductor suppliers during SEMICON West 2026, held October 13–15 in San Francisco...
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
As it becomes harder and costlier to shrink transistors, advanced packaging has become the place chip equipment makers look to for their next leg of growth, and ASML appears to be...
TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still...
Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven...
