CONNECT WITH US
NEWS TAGGED WAFER
Thursday 29 October 2026
Commentary: fire at Episil threatens tight epitaxial wafer supply
A fire broke out at the Innovation Plant of semiconductor epitaxial wafer maker Episil on October 28. The extent of equipment damage, the scope of production stoppages, and the recovery...
Thursday 29 October 2026
Analysis: Samsung's record quarter came from higher prices, not more chips; expects buyers to get no relief before 2028
Samsung Electronics' third-quarter profit came almost entirely from charging more for memory chips, not from selling more of them. On its earnings call, the company also told investors...
Thursday 29 October 2026
KLA: wafer fab equipment market exceeding US$200B in 2027
KLA expects global wafer fabrication equipment (WFE) spending to exceed US$200 billion in 2027, as semiconductor manufacturers accelerate investments in advanced logic, DRAM and high-bandwidth...
Thursday 29 October 2026
UMC targets 10% ASP growth in 2027 as AI revenue share heads toward 25% within three years
United Microelectronics Corporation (UMC) expects wafer foundry pricing to continue rising in 2027, with CEO Jason Wang projecting approximately 10% year-over-year growth in the company's...
Thursday 29 October 2026
Samsung, SK Hynix invest KRW110 trillion as memory supply boost slips to 2028
Samsung Electronics and SK Hynix are undertaking their largest-ever equipment investments in 2026, but the memory supply increase is not expected to materialize until 2028. By then,...
Thursday 29 October 2026
Intel CTO: process gap with TSMC down to a few points, but scale still lags
Technology podcast host Dwarkesh Patel recently released a special episode after spending two days touring Intel's fabs and research laboratories and speaking with several technology...
Wednesday 28 October 2026
UMC utilization tops 90% in 2H26 as AI demand drives expansion
United Microelectronics (UMC) saw operating momentum strengthen in the third quarter of 2026, as demand for artificial intelligence (AI), high-performance computing (HPC), communications,...
Tuesday 27 October 2026
Pat Gelsinger warns AI compute efficiency must jump 10,000x amid power, memory, and fab constraints
Silicon Valley venture capital firm Playground Global has returned to Taiwan alongside a cohort of portfolio companies specializing in memory, power management, optical communications,...
Tuesday 27 October 2026
PSMC capacity crunch holds back Jeju Semiconductor's growth
South Korean memory chip designer Jeju Semiconductor is struggling to secure enough wafer capacity from Taiwan's Powerchip Semiconductor Manufacturing (PSMC), limiting its sales growth...
Tuesday 27 October 2026
Inside SKT’s push to turn SK Hynix’s fabs into an AI business
South Korean telecommunications provider SK Telecom (SKT) has reportedly established Hy-TF, a task force dedicated to AI collaboration with SK Hynix, to upgrade its digital-twin and...
Tuesday 27 October 2026
Vietnam's first fab reportedly faces doubts over 2027 target
Vietnam's first wafer fab may miss its 2027 trial-production target, Reuters reported on October 26, citing concerns about project execution and equipment procurement. Developer...
Friday 23 October 2026
Why is TSMC suddenly looking at Texas?
TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess...
Friday 23 October 2026
Samsung Foundry targets automotive, edge AI chips with 8LPU+
Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform...
Friday 23 October 2026
Lam Research sees WFE topping US$200 billion in 2027
Lam Research reported third-quarter 2026 revenue of US$8.2 billion, up 22% quarter-over-quarter, and forecast fourth-quarter revenue of US$8.6 billion, plus or minus US$400 million...
Friday 23 October 2026
AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking
China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research...