TSMC announced its financial results for the third quarter of 2024 on October 17th, reporting consolidated revenue of NT$759.69 billion (approx. US$23.5 billion) and a net profit...
Amidst Samsung Electronics's ongoing reform of its semiconductor operations, the conglomerate has decided to concentrate on developing its power semiconductor business. This strategic...
After a partnership with Israel-based Tower Semiconductor for a wafer fab in India, the Adani Group is reportedly talking with two large Israel-based nich technology firms to form...
TSMC has disclosed that its third-quarter revenue and margins surpassed the guidance it provided three months ago. The pure-play foundry anticipates a 13% sequential increase in revenue...
The price collapse of 6-inch silicon carbide (SiC) substrates is taking its toll on the 8-inch segment, where volume production has yet to begin but prices are already tumbling, according...
Samsung Electronics is currently grappling with the choice of application processors (AP) for its Galaxy S25 series, but time is running out to make the final decision.
Wolfspeed, a US-based silicon carbide (SiC) chipmaker, has secured up to US$750 million in federal funding to construct a new wafer plant in North Carolina and expand its New York...
China's sluggish economic recovery continues to affect the consumer electronics market, with microcontroller unit (MCU) industry insiders reporting that significant signs of demand...
A recent breakdown of a semiconductor joint venture between Taiwan's Powerchip Semiconductor Manufacturing Corporation (PSMC) and Japan's SBI Holdings has led to differing statements...
China has made notable progress in lithography technology, but its new machine still lags behind the most advanced global technologies. While this development is significant, it's...
Executives from Powerchip Semiconductor Manufacturing Corporation (PSMC) visited the Miyagi Prefectural Government in Japan to explain the reasons behind their decision to cancel...
Samsung Electronics, facing difficulties in its wafer foundry business, has implemented cost-cutting measures, including the cancellation of on-site events and a slowdown in investment...
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver...
Mitsubishi Electric has announced that silicon power semiconductor chips produced at its Fukuyama factory in Hiroshima Prefecture, Japan, have begun supplying module assembly lines,...