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NEWS TAGGED WAFER
Friday 1 November 2024
Samsung DS division's 3Q24 operating profit falls 40%; foundry and system LSI losses mount
Despite achieving record revenue in the third quarter of 2024, Samsung has reported a significant decline in its semiconductor operating profit, which fell by 40% compared to the...
Thursday 31 October 2024
UMC sees falling fab utilization and gross margin in 4Q24
Pure-play foundry United Microelectronics (UMC) anticipates a decline in both its fab utilization rate and gross margin in the fourth quarter of 2024, and has lowered its capital...
Wednesday 30 October 2024
Intel foundry: to split or not? Insights from Gelsinger and insiders
In March 2022, Intel CEO Pat Gelsinger was a guest at President Biden's State of the Union address, highlighting Intel's pivotal role in revitalizing semiconductor manufacturing in...
Wednesday 30 October 2024
Infineon unveils ultra-thin 20-micrometer power semiconductor wafer
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Tuesday 29 October 2024
Can Samsung, Intel rise above challenges? Different strategies for IDM, pure foundry models
The third quarter financial results for both Samsung Electronics (Samsung) and Intel are set to be released on October 31, 2024. The outcome likely hinges on how well their management...
Monday 28 October 2024
Can Intel and Samsung unite to challenge TSMC's foundry throne?
South Korea's Maeil Business Newspaper recently reported that Intel CEO Pat Gelsinger is seeking a face-to-face meeting with Samsung Electronics Chairman Jae-yong Lee to...
Monday 28 October 2024
Intel expands Chengdu facility with new server chip packaging and testing services
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...
Monday 28 October 2024
Samsung bets on 1c-nm DRAM to compete with HBM rivals
Samsung Electronics is reportedly progressing its 1c-nanometer DRAM, regarded as a crucial potential for the company to contend with high bandwidth memory (HBM) competitors.
Monday 28 October 2024
Rapidus's Hokkaido 2nm fab nears completion, eyes 1.4nm production with government support
Rapidus has announced that its first wafer fab in Hokkaido, which is intended for 2mm chip production, is now 80% complete. The company also aims to progress to 1.4mm chips if its...
Friday 25 October 2024
Samsung reveals silicon capacitors and 3.5D packaging roadmap
Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic...
Thursday 24 October 2024
Wolfspeed halts EUR3bn SiC wafer plant, throwing Germany's semiconductor plans off track
Wolfspeed has suspended the construction of its SiC wafer plant in Ensdorf, Germany, as Europe's electric vehicle market faces a slowdown. This comes on the heels of Intel's halted...
Thursday 24 October 2024
Japan restarts minimal fabs to train semiconductor talent
Talent development is a key challenge for Japan as it seeks to revitalize its semiconductor industry. In response, the Japanese government has chosen to resurrect the half-inch wafer...
Wednesday 23 October 2024
Japan steps up collaborative efforts to tackle chip talent crunch in key regions of Kyushu and Hokkaido
The demand for semiconductor talent in Japan is increasing, especially in Kyushu, where TSMC is establishing wafer fabs, and in Hokkaido, where Rapidus plans to mass-produce 2nm chips...
Wednesday 23 October 2024
PSMC chairman turns caution towards India to optimism amid Tata partnership
After a partnership between Taiwan-based Powerchip Semiconductor Manufacturing Corporation (PSMC) and Japan-based SBI Holdings to establish a wafer fab fell through, PSMC is now pursuing...
Tuesday 22 October 2024
SK Hynix prioritizes HBM, scales back CIS and foundry operations
SK Hynix is reducing its CIS and wafer foundry operations to prioritize high-margin HBM and AI memory products. It is also expanding into emerging technologies, including Compute...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research