The penetration rate of Taiwan's 5G service subscriber market is expected to reach over 23% in 2021 thanks to continued network deployments by telecom players and the availability...

Taiwan makers of inductors are keenly enforcing capacity expansions to meet increasingly strong demand for automotive, handset and other consumer electronics applications, according...

TSMC has prioritized expanding 12-inch fabs over 8-inch ones, and it may be easier for the foundry house to squeeze in extra orders from some clients its 12-inch fabs in the second...

Wistron Group has forged a strategic alliance with Chunghwa Telecom (CHT) to jointly tap business opportunities arising from proliferating 5G and AI applications.

Singapore-based semiconductor packaging equipment vendor K&S has seen strong influx of orders for wire bonders for logic ICs and memory chips with delivery lead times extending...

MediaTek has obtained sufficient 6nm and 7nm process capacity at TSMC, which will allow the mobile SoC specialist to boost its 5G chip shipments in 2021, according to industry sour...

Samsung Electronics has announced mass production of its most advanced line of datacenter SSDs - the PM9A3 E1.S - which fully complies with the Open Compute Project (OCP) NVMe Cloud...

MLCC vendors including Samsung Electro-Mechanics (Semco) and TDK are likely to raise their quotes for high-capacitance MLCCs in response to stronger-than-expected demand for 5G handset...

Taiwan suppliers of high-end IC substrates, HDI boards, rigid PCBs with high layer counts and flexible PCBs are expected to have another busy year in 2021 after benefiting from pandemic-induced...

Having seen its revenues hit a record high of over US$10 billion in 2020, MediaTek is lookking to cash in on the momentum to push the sale of its next-generation 5G SoC solutions,...

IDM vendors may consider outsourcing more of their production starting 2022, with Taiwan-based contract chipmakers being among the beneficiaries, according to industry sources.

As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity...

Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...

Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.

Thinking Electronic Industrial, Polytronics Technology and Fuzetec Technology, which make circuit protection components for handsets, notebooks and game consoles, all saw their January...