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IN THE NEWS
Friday 22 January 2021
Kinsus to expand ABF substrate capacity by 30% in 2021
Taiwan-based IC substrate maker Kinsus Interconnect Technology plans to restore a fire-hit flexible PCB (FPCB) plant in Hsinchu, northern Taiwan, and convert it to produce ABF substrates...
Friday 22 January 2021
Pegatron sees slowdown in orders for iPhone 12 mini
Pegatron has seen a slowdown in orders for the iPhone 12 mini as sales of the model in the US and Europe are affected negatively by the COVID-19 pandemic, according to industry sou...
Thursday 21 January 2021
No capacity overbooking seen for high-end PCB products
Downstream clients have neither registered overly-high inventory levels for high-end PCB products nor overbooked capacity at PCB makers, as they are still striving to satisfy strong...
Thursday 21 January 2021
Qualcomm rolls out new 7nm 5G smartphone chip
Qualcomm has rolled out its new Snapdragon 870 series to further enhance its 5G smartphone chip lineup. The new 5G chip is built using TSMC's 7nm process technology.
Thursday 21 January 2021
MediaTek launches 6nm 5G SoC chips
MediaTek has unveiled its new Dimensity 1200 and 1100 5G smartphone SoC series built using 6nm process technology.
Wednesday 20 January 2021
CHPT, WinWay land major test interface orders for 5G handset SoCs
Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and WinWay Technology have both obtained major orders for MediaTek's new-generation 5G SoC chips slated...
Wednesday 20 January 2021
Taiwan server makers eyeing double-digit increases for 2021 shipments
Taiwan-based server makers including Quanta Computer, Inventec, Wiwynn, Mitac Computing Technology and Foxconn Technology are optimistic about their business prospects this year with...
Tuesday 19 January 2021
CHT earmarks NT$300 million for AIoT project in Kaohsiung
Chunghwa Telecom (CHT) has announced a NT$300 million (US$10.71 million) investment project that will establish basic telecom infrastructure, cloud servers and 5G networks in an AIoT...
Tuesday 19 January 2021
FET to ramp up 5G penetration rate to 20-30% in 2021
Far EasTone Telecommunications (FET) expects to see the user number of its 5G services to top one million or 20-30% of its total mobile subscribers by year-end 2021, after having...
Tuesday 19 January 2021
High-end ABF substrates in increasingly short supply for HPC, server chips
The supply of more lucrative high-end ABF substrates for use in HPC, server and 5G networking chips has been increasingly short of demand due partly to insufficient yield rates at...
Tuesday 19 January 2021
Lead times extend for wirebonding packaging equipment
Delivery lead times for wirebonding packaging equipment have extended to over six months, according to industry sources in Taiwan.
Tuesday 19 January 2021
Semiconductor firms up investments
The semiconductor industry has seen some major players committing significant sums for R&D, such as TSMC announcing to inject a record-high capex of up to US$28 billion in 2021...
Monday 18 January 2021
Leatec may raise quotes for ceramic substrates
Taiwan-based Leatec Fine Ceramics, a dedicated maker of aluminum and ceramic substrates needed for manufacturing chip resistors, is mulling raising its quotes in the wake of a recent...
Monday 18 January 2021
Inventec teams up with Affirmed Networks to develop 5G smart factory solutions
Inventec has said that it is developing 5G smart manufacturing solutions in cooperation with Affirmed Networks, a Microsoft subsidiary, which plays a platform and application software...
Monday 18 January 2021
Dell optimistic about emerging technology development in 2021, says company CTO
Dell is optimistic about the development of quantum technologies, heterogeneous architecture of semiconductors, 5G and edge computing in 2021, according to company CTO John Roese.