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The imminent arrival of the 5G era promises great business opportunities for various sectors
IN THE NEWS
Friday 26 February 2021
K&S expects miniLED backlight applications to grow exponentially
Singapore-based semiconductor packaging equipment vendor K&S has seen strong influx of orders for wire bonders for logic ICs and memory chips with delivery lead times extending...
Friday 26 February 2021
MediaTek wins more TSMC support to boost 5G chip shipments
MediaTek has obtained sufficient 6nm and 7nm process capacity at TSMC, which will allow the mobile SoC specialist to boost its 5G chip shipments in 2021, according to industry sour...
Friday 26 February 2021
Samsung begins mass production of datacenter SSD for hyperscale environments
Samsung Electronics has announced mass production of its most advanced line of datacenter SSDs - the PM9A3 E1.S - which fully complies with the Open Compute Project (OCP) NVMe Cloud...
Wednesday 24 February 2021
High-capacitance MLCC prices set to rise
MLCC vendors including Samsung Electro-Mechanics (Semco) and TDK are likely to raise their quotes for high-capacitance MLCCs in response to stronger-than-expected demand for 5G handset...
Wednesday 24 February 2021
Contract PCB drilling service: Q&A with Key Ware CEO Chen Po-ying
Taiwan suppliers of high-end IC substrates, HDI boards, rigid PCBs with high layer counts and flexible PCBs are expected to have another busy year in 2021 after benefiting from pandemic-induced...
Tuesday 23 February 2021
MediaTek keen to maintain momentum in 5G SoC market
Having seen its revenues hit a record high of over US$10 billion in 2020, MediaTek is lookking to cash in on the momentum to push the sale of its next-generation 5G SoC solutions,...
Tuesday 23 February 2021
IDMs may evaluate more outsourcing
IDM vendors may consider outsourcing more of their production starting 2022, with Taiwan-based contract chipmakers being among the beneficiaries, according to industry sources.
Monday 22 February 2021
Chipmakers placing extra orders for BT substrates amid tight supply
As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity...
Monday 22 February 2021
Qualcomm gearing up to cement capacity support from Taiwan partners
Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
Friday 19 February 2021
Kioxia, Western Digital announce 6th-gen 3D flash memory
Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.
Friday 19 February 2021
Taiwan protective component makers post record January revenues
Thinking Electronic Industrial, Polytronics Technology and Fuzetec Technology, which make circuit protection components for handsets, notebooks and game consoles, all saw their January...
Friday 19 February 2021
MLCC material maker PDC sees order visibility extended for 5G applications
Prosperity Dielectrics Company (PDC), which mainly supplies MLCCs and related ceramic powders, has utilized over 90% of production capacity with clear order visibility extended to...
Friday 19 February 2021
HDI PCB makers see robust orders for non-handset applications
HDI PCB manufacturers have enjoyed a strong influx of orders for non-handset applications, with order visibility extended to April-May, allowing them to expect a strong first-half...
Thursday 18 February 2021
Global 5G smartphone shipments to approach 550 million units in 2021
Worldwide 5G smartphone shipments are expected to grow drastically to nearly 550 million units in 2021, and supply chain players will benefit as a result, according to market sourc...
Thursday 18 February 2021
Smartphone vendors upbeat about midrange 5G models
Smartphone vendors are upbeat about the midrange segment of the 5G phone market which is set to grow robustly in 2021.