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Monday 9 December 2019
Smart glasses may replace smartphones, says Jorjin chairman
Smart glasses enabled by AR/MR technologies may gradually replace smartphones, with such a trend beginning to emerge in 2023 according to Tom Liang, chairman for both Taiwan-based...
Friday 6 December 2019
LTCC to be mainstream packaging material for mmWave modules
The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...
Friday 6 December 2019
Taiwan assigns 4.8-4.9GHz as dedicated 5G band for special purposes
The Taiwan government has decided to designate frequency band of 4.8-4.9GHz with bandwidth of 100MHz as a 5G band dedicated to use by the public and private sectors for special purposes...
Friday 6 December 2019
Taiwan IC backend sector to see growth in 2H19 thanks to 5G, says Digitimes Research
Despite the ongoing US-China trade tensions, Taiwan's IC packaging and testing industry is still expected to see second-half 2019 revenues grow from the first half thanks to rising...
Friday 6 December 2019
Prospects bright for silicon wafer suppliers, fab toolmakers
Taiwan-based silicon wafer suppliers and fab toolmakers, particularly those in the supply chain of TSMC, have enjoyed a ramp-up in orders recently and become optimistic about their...
Friday 6 December 2019
Smart AR glasses shipments to rise significantly in 2023, says Digitimes Research
As 5G penetration rate is expected to reach 50% in 2023, smart augmented reality (AR) glasses will begin entering the consumer market, according to Digitimes Research.
Friday 6 December 2019
AUO loses Motorola foldable Razr OLED orders to Chinese peers
Motorola has switched orders for flexible AMOLED panels for its new foldable smartphones to Chinese suppliers BOE Technology and China Star Optoelectronics Technology (CSOT) from...
Thursday 5 December 2019
Highlights of the day: 5G to see intense competition in midrange phone segment
Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models...
Thursday 5 December 2019
Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
Thursday 5 December 2019
Midrange 5G handset chips market to heat up in 1H20
The main battlefield in the 5G mobile chip market is expected to shift from flagship models to mostly midrange ones in the first half of 2020, as around 70% of over 200 million 5G...
Thursday 5 December 2019
Qualcomm intros new 5G SoC lineup
Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...
Wednesday 4 December 2019
MPI, LCP materials for smartphone antennas to coexist
Modified polyimide (MPI) and liquid crystal polymer (LCP) materials for smartphone antennas are expected to coexist, with the former being adopted mainly for Android models, and the...
Wednesday 4 December 2019
China telecom carriers and smartphone vendors gear up for 5G
With the arrival of 5G commercialization, China-based telecom carriers and smartphone vendors are expanding their services and releasing new products in pursuit of new business opp...
Wednesday 4 December 2019
Demand for retired battery packs used in 5G base stations in China takes off
As China is actively constructing its 5G infrastructure, demand is picking up for retired LFP (lithium iron phosphate) and ternary battery packs for use as reserve energy storage...
Wednesday 4 December 2019
CHPT obtains major orders for 5G chips
Chunghwa Precision Test Tech (CHPT) has obtained orders for test interfaces for 5G smartphone chips from the world's first-tier fabless chipmakers, and is poised to enjoy a strong...