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Friday 15 November 2019
ShunSin to ramp up capex in 2020 for SiP capacity expansion
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...
Friday 15 November 2019
HDI boards to enter new wave of growth in 5G, IoT era
Supply of HDI (high-density interconnect) boards has fallen short of demand in the second half of 2019, with Taiwan makers having to reschedule shipments to fulfill mounting orders...
Friday 15 November 2019
Foxconn to invest NT$10 billion in Asia Pacific Telecom
Foxconn Electronics has announced that it will invest NT$10 billion (US$327.23 million) for new shares to be issued by Asia Pacific Telecom (APT) through private placement for development...
Friday 15 November 2019
Korea 5G service subscribers to top 5 million by year-end 2019
The number of 5G service subscribers in South Korea is expected to reach over five million by the end of 2019, a significant growth from four million at the end of July, according...
Thursday 14 November 2019
Foxconn moving to transform into technology services provider
Foxconn Technology Group will step up transforming into a provider of technology services by deepening deployments in electric vehicle, smart heath care and robot industries while...
Thursday 14 November 2019
Asustek expects up to 5% PC sales decrease in 4Q19
Asustek Computer expects to post flat growth or an up to 5% sequential decrease in PC sales in the fourth quarter, while sales of its component products including motherboards and...
Thursday 14 November 2019
Backend specialist ShunSin sees 3Q19 profits hit 13-quarter high
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, has reported net profit shot up 115.7% sequentially to a 13-quarter high of NT$268 million (US$8.78 million)...
Thursday 14 November 2019
TSMC to build advanced packaging fab in northern Taiwan in 2020
TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...
Thursday 14 November 2019
Samsung growing 5G network equipment biz
Samsung Electronics has managed to become a leading provider of 5G network equipment, with its global market share reaching nearly 28% in the first half of 2019, according to Daijun...
Thursday 14 November 2019
China smartphone AP shipments – 3Q 2019
Third-quarter-2019 smartphone AP shipments to China-based vendors came to 210 million units, down 1.8% on quarter and 9.4% on year.
Thursday 14 November 2019
TSMC, UMC to allocate more 12-inch fab capacity for display driver IC
TSMC and UMC are set to allocate more of their available 12-inch fab capacities for the fabrication of display driver ICs in 2020 to satisfy growing demand for applications such as...
Wednesday 13 November 2019
Power Logic seeing demand for graphics cards pick up
Cooling fan maker Power Logic has seen orders for graphics cards pick up substantially in the second half of 2019, and expects the order pull-in momentum to carry on through 2020.
Wednesday 13 November 2019
Nan Ya set to expand ABF substrate capacity in 2020
Nan Ya PCB has disclosed plans to invest an additional US$48 million in its factory in Kunshan, China, where the Taiwan-based company will expand ABF substrate production capacity...
Wednesday 13 November 2019
Wi-Fi 6 to share spotlight with 5G
A recent Wi-Fi Alliance (WFA) announcement saying that it has granted an Wi-Fi Certified 6 verification for Samsung Electronics' Galaxy Note 10 heralds the arrival of a high-speed...
Wednesday 13 November 2019
TSMC board approves US$6.6 billion for advanced process capacity
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...