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IN THE NEWS
Wednesday 23 January 2019
HiSilicon reportedly demanding 20-30% more capacity at KYEC
King Yuan Electronics (KYEC) has been requested by Huawei's semiconductor subsidiary HiSilicon to provide 20-30% more of the testing house's available production capacity in the first...
Tuesday 22 January 2019
TCA chairman warns IT players of political factors
Chairman of Pegatron and Taipei Computer Association (TCA) TH Tung, commenting on several countries considering banning the use of Huawei equipment, has said IT players worldwide...
Monday 14 January 2019
2018 review and 2019 outlook: PCB makers see new applications as growth driver
Taiwan PCB makers enjoyed strong growth in 2018 in shipments of their flexible boards, rigid-flex boards and substrate-like PCBs to new application sectors of datacenter servers and...
Friday 11 January 2019
Lackluster iPhone sales seen to affect Taiwan export, economy
In a rare move, Taiwan's top economic planner has said lackluster sales of new iPhones can be blamed partly on the devices' lack of innovations, which may directly impact revenue...
Friday 11 January 2019
Chipmakers gearing up to develop 802.11ax chip solutions
Qualcomm and MediaTek have both introduced their new 802.11ax chip solutions to support Wi-Fi 6 devices, seeking to secure a preemptive presence in both enterprise and household network...
Thursday 3 January 2019
Chipmakers keen to roll out NPU-based AI mobile SoCs
Discrete NPU (neural processing unit) is increasingly incorporated by chipmakers including Huawei HiSilicon, Qualcomm and MediaTek into their mobile chip solutions to execute AI computing...
Wednesday 2 January 2019
China top-4 smartphone vendors to maintain lead in home market in 2019
China's top-four leading smartphone vendors - Huawei, Xiaomi, Oppo and Vivo - are expected to be able to maintain their leaderships in their domestic market in 2019, as they will...
Thursday 27 December 2018
China OSAT firms foraying into higher-end packaging fields
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
Wednesday 26 December 2018
Huawei to be first to adopt TSMC EUV process, says report
Huawei has become the second-largest client of Taiwan Semiconductor Manufacturing Company (TSMC), and will be the first company adopting the pure-play foundry's extreme ultraviolet...
Wednesday 26 December 2018
Huawei to launch memorial versions for Mate 20 Pro, Nova 4
Huawei plans to launch a special edition each for its Mate 20 Pro and Nova 4 smartphones on January 1, 2019 to mark its achievement of shipping 200 million handsets in 2018.
Tuesday 25 December 2018
Huawei ships over 200 million handsets in 2018
Huawei has shipped over 200 million smartphones, including Honor-brand models, so far in 2018, surpassing a total of 153 million units shipped a year earlier, according to a company...
Tuesday 25 December 2018
Apple, Huawei make gains in Taiwan handset market in November
Apple and Huawei managed to ramp up their shares in Taiwan's handset market in November, during which total handset sales were down 3.6% on month and 4.8% on year to 618,000 units,...
Tuesday 25 December 2018
IC vendors keen to expand 5G R&D teams
Major IC vendors are fast expanding their 5G chip R&D teams seeking to roll out optimal solutions for customers as soon as possible, and Taiwan has become one of their favorite...
Wednesday 19 December 2018
Huawei, Xiaomi expect 2019 smartphone shipments to surge over 20%
Despite slack demand in China's smartphone market and unclear global outlook, China-based vendors Huawei and Xiaomi have estimated their smartphone shipments for 2019 to surge over...
Tuesday 18 December 2018
China PCB firms may see 5G opportunities affected by trade war
China-based PCB makers are eyeing bright business prospects for 2019, bolstered by numerous 5G base stations actively under construction in the country and their close partnerships...