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Monday 7 September 2026
Anthropic IPO set to put AI governance under public-market scrutiny
Anthropic is moving toward a potential blockbuster stock-market debut this fall, but the company's unusual governance structure could become an important issue for investors alongside its growth prospects.
Monday 7 September 2026
Chicony Power's August revenue dips as AI server and satellite demand strengthens
Chicony Power Technology Co. said its August revenue slipped as a memory shortage hit demand for notebook power supplies. Still, stronger orders for AI server and satellite communications power signaled broader growth opportunities for global technology supply chains and future data center investment.
Monday 7 September 2026
Foxconn revenue climbs on AI server demand, outlook improves
Foxconn said August sales rose sharply from a year earlier as demand for AI servers and related hardware continued to lift its cloud and networking business. The latest update suggests the global electronics supply chain remains supported, even as investors closely watch shifts in trade, policy, and consumer demand.
Monday 7 September 2026
Machine builders flood SEMICON 2026 to grow local chip tools
Taiwan's machinery industry is pushing to turn its semiconductor advantage into a domestic equipment supply chain, as more than 100 member companies join SEMICON Taiwan 2026 and the Taiwan Association of Machinery Industry (TAMI) calls for broader industry upgrading. The association voiced that appeal at a forum on September 3, saying Taiwan should leverage its semiconductor strength to lift traditional industries and continue nurturing a homegrown semiconductor equipment supply chain without relying on overseas sources.
Monday 7 September 2026
India roundup: India expands chip ambitions with full Semicon 2.0 notification

India's technology sector is gaining momentum across semiconductors, connectivity, AI payments, PCs, tablets and refurbished smartphones, as policy support and local manufacturing attract investment. However, supply-chain diversification, margin pressure, cautious demand and VinFast's manufacturing pause highlight challenges facing India's broader technology ambitions.

Monday 7 September 2026
Acer hedges memory price shock with local AI, diversification
Acer Chairman and CEO Jason Chen said Taiwan is not only a global hub for AI hardware manufacturing and technology, but also an important source of capital, as many firms issue bonds to raise funds. He said Acer has already issued bonds worth NT$20 billion (US$630.7 million), adding that "Taiwan's money" is not only benefiting the local market but is spreading around the world.
Sunday 6 September 2026
Tongtai doubles semiconductor orders on AI data-center demand
Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent years. The group is extending its traditional machine tool expertise into hard and brittle material processing, advanced packaging, and smart manufacturing production-line solutions required for semiconductor fabrication.
Saturday 5 September 2026
Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics
Excitement is growing among investors and the public over the rising capabilities of humanoid robots. Yet as robot makers seek to turn their lab-built innovations into real-world commercial tools, one key bottleneck has emerged: safety.
Saturday 5 September 2026
SiPh, optical lens demand ignite laser race
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already under way. As optical makers move into co-packaged optics (CPO), the source and capability of laser equipment are becoming critical to whether they can secure market share.
Saturday 5 September 2026
Google TPU splits training, inference as CPU becomes next focus
As AI model training, inference, and AI agent workloads continue to grow, AI accelerators are increasingly being optimized for different tasks. Amin Vahdat, Google's senior vice president and chief technologist for AI and infrastructure, said at SEMICON Taiwan 2026 that if a specific workload reaches sufficient scale and investment in custom chips is economically viable, Google could develop additional dedicated chips for different computing needs.
Saturday 5 September 2026
Adata expands AI business with TRUSTA, Industrial brands
ADATA Technology said it will integrate the products, technologies and solutions of its TRUSTA and ADATA Industrial brands to target enterprise servers, edge computing, system integration, smart homes, mobile devices and wearables. This comes as AI infrastructure, edge computing and smart systems accelerate. The memory module maker aims to expand AI and intelligent application opportunities by focusing on business use cases.
Friday 4 September 2026
The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom
A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future of artificial intelligence (AI).
Friday 4 September 2026
Lite-On makes US$170 million strategic investment in DCX for AI cooling push
Lite-On Technology announced a strategic investment in Polish liquid cooling solutions provider DCX Polska, also known as DCX Liquid Cooling Systems. The deal will give Lite-On approximately a 25% stake in DCX upon completion, with a total transaction value of roughly US$176 million.
Friday 4 September 2026
Ennostar accelerates AI optical communications with micro LED
Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai, associate vice president of the company's Advanced R&D Center, said micro LED's short-distance optical transmission advantages have already been proven, with mass production now the main hurdle.
Friday 4 September 2026
China Motor unit Greentrans launches Taiwan-made quadruped robots
China Motor Corp. subsidiary Greentrans unveiled its next-generation quadruped robots, GT5X and GT3X, at SEMICON Taiwan 2026 amid growing demand for AI applications, smart semiconductor fabs and unmanned operations. The company said the two models are designed to build Taiwan's core robotics technologies and advance local production across the supply chain.
Friday 4 September 2026
Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners to dismantle organizational silos or face crippling inefficiencies, top industry executives said at SEMICON Taiwan 2026.
Thursday 3 September 2026
Niching validates 500-ton press for large heat spreaders
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said larger stamping equipment, tighter plating control, and future liquid-cooling technologies are being developed to support chips that generate more heat in data centers worldwide.
Thursday 3 September 2026
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift is increasing the need for metrology, inspection, and failure analysis, and Zeiss is planning a semiconductor innovation center in northern Taiwan to support validation and application development.
Thursday 3 September 2026
Win Semiconductors unveils 0.1μm GaN for AI, satellite links
Taiwanese compound semiconductor maker WIN Semiconductors said on September 1, 2026, that compound semiconductors are the backbone of AI and satellite communications, as it unveiled 0.1μm GaN technology aimed at higher-speed transmission. Senior associate vice president Chuck Huang made the remarks at the NExT Forum.
Thursday 3 September 2026
TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in AI performance may depend as much on manufacturing breakthroughs as on chip design, with supply chains and costs likely to change.
Thursday 3 September 2026
JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times
JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed transmission, and high-power products. The connector and cable maker said visibility now stretched into 2027, and in some cases into 2028, even as tight supply and longer lead times for key components continued to constrain near-term delivery.
Wednesday 2 September 2026
Nvidia and Micron top NT$4.4T in Taiwan investment
On the eve of the opening of SEMICON Taiwan 2026, the Ministry of Economic Affairs (MOEA) hosted the Semicon Network Summit, where President Ching-Te Lai said Nvidia invests and procures more than NT$3 trillion (US$94.4 billion) a year in Taiwan. He added that Micron has invested more than NT$1.4 trillion cumulatively, while AMD has expanded its Taiwan R&D and investment to more than NT$300 billion.
Wednesday 2 September 2026
Semicon Taiwan 2026 to test cloud AI investment boom
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon Taiwan 2026 may serve as the ultimate litmus test for this debate.
Wednesday 2 September 2026
India reportedly readies AI agent payments on UPI, its national payment rails
India is preparing a framework that would allow AI agents to make small digital payments without requiring user approval for every transaction, three sources familiar with the matter told Reuters. This would be a step that would put one of the world's largest payment networks behind agentic commerce.
Wednesday 2 September 2026
Apple's M6, M5 Ultra break rule tying process to chip strength
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer process is used only in the entry-level Mac mini, while the 3-nanometer M5 Ultra is officially billed as the "most powerful M-series chip yet."