In 2024, numerous Japanese and foreign semiconductor manufacturers will commence mass production at newly constructed wafer fabrication facilities in Japan. Industry sources claim...
After TSMC announced a delay of its planned utilization of the second fab in Arizona for 1-2 years, Samsung Electronics, which is also planning to produce advanced chips in the United...
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
TSMC, which only increases production capacity in response to significant customer orders, has recently established a production expansion strategy aimed at attaining 2nm GAA. Apple...
A significant ramp-up in CoWoS production capacity at TSMC is anticipated to propel server companies' AI server sales to new heights in 2024, according to industry sources.
Rapidus, a Japanese company building a semiconductor factory in Chitose City, Hokkaido, Japan, said the construction progress is going smoothly despite the tight schedule. The company...
Although Samsung Electronics was the first to mass produce 3nm chips, they are not as profitable as TSMC since they have not secured big customers yet. Samsung Electronics is trying...
With TSMC and ASE Holdings (ASEH) gearing up to build additional fab capacities for advanced packaging, relevant supply chain participants are optimistic about growth driven by their...
The semiconductor industry in Kyushu, Japan, is gradually recovering, with IC production value exceeding JPY1 trillion (US$68 billion) from January to November 2023.
TSMC and Samsung Electronics are gearing up for a chiplet mass production race. Both industry giants are set to materialize the commercialization of UCIe (Universal Chiplet Interconnect...
Taiwan Semiconductor Manufacturing Company (TSMC) recently disclosed its overseas expansion progress and plans in its earnings report conference on January 18 and expressed interest...
