TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...

In addition to Republican Presidential Candidate Donald Trump demanding Taiwan to "give back" more for its safety amid the geopolitical uncertainties, the United States has reportedly...

Since taking the helm in February 2021, Intel CEO Pat Gelsinger has grappled with mounting losses at the company's foundry division. A critical challenge is establishing Intel Foundry...

SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...

Advanced Micro-fabrication Equipment (AMEC), a China-based semiconductor equipment manufacturer, has emerged as a formidable competitor to Applied Materials, Lam Research, and other...

At the close of 2023, Innolux shuttered its 5.5-generation LCD panel facility. Reports suggest that potential buyers for this plant include Micron and TSMC. Recently, TSMC has reportedly...

The semiconductor foundry industry's first-half results and second-half outlook reveal a growing divide between the dominant players and those struggling to keep up. As expected,...

Taiwan's tech giants, such as TSMC, are expanding globally to mitigate risks from the US-China trade war and geopolitical tensions, facing challenges from regional language and cultural...

These are the most-read DIGITIMES Asia stories in the week of August 5 – August 9.

TSMC demonstrated strong growth momentum in July 2024 amidst the slow recovery of the semiconductor market.

TSMC has reported revenue of NT$256.95 billion (US$7.94 billion) for July 2024, up 23.6% sequentially and 44.7% year over year.

Intel, once a titan of innovation in the tech world, now faces significant challenges in a fiercely competitive semiconductor market.

Black Sesame Technologies and Horizon Robotics, two China-based developers of smart driving chips, have recently filed for IPO on the Hong Kong Stock Exchange.

TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.

SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...