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TSMC updates
Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.
IN THE NEWS
Tuesday 20 June 2023
Global pursuit of net-zero emissions sparks concerns about possible greenflation
As the world is pursuing net-zero carbon emissions, there has been a drastic surge in demand for green power and net-zero emission raw materials, pushing up their supply and construction...
Tuesday 20 June 2023
The implicit value of government- and industry-backed clustering
In the era of globalization, economic scale and efficiency are crucial factors in production and manufacturing, and Taiwan, with its limited land and dense population, has maximized...
Tuesday 20 June 2023
TSMC dominates AI chip manufacturing
TSMC is expected to continue its leadership in wafer foundry with strong momentum coming from AI chips using its 7nm and more advanced manufacturing nodes. TSMC is making Nvidia's...
Monday 19 June 2023
TSMC sees major clients restart order placements for 2024, advanced process utilization rebounding
TSMC has seen its capacity utilization rates for advanced processes below 7nm rebound slowly since June, and is poised to embrace a new wave of chip demand growth in 2024 as major...
Monday 19 June 2023
Autonomy and regionalization jeopardize the "neutrality" underpinning chip industry growth
As geopolitical competition and the concept of national security gain a technological dimension, fueled by US-China rivalry and the post-pandemic supply chain disruption, semiconductors,...
Friday 16 June 2023
AMD backend partners gearing up for new processors
TSMC, ASE Technology and Tongfu Microelectronics (TFME), as well as test interface specialists WinWay Technology and Chunghwa Precision Test Tech (CHPT) are all gearing up for shipments...
Thursday 15 June 2023
TSMC rumored to be one of Arm's anchor investors
According to Reuters, citing sources, silicon IP vendor Arm is in talk with at least ten companies to bring one or more anchor investors in Arm's initial public offering...
Thursday 15 June 2023
3D DRAM to see clear development direction in next 2-3 years
Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former...
Wednesday 14 June 2023
TSMC CoWoS attracts orders from major HPC and network processor vendors
AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,
Tuesday 13 June 2023
Taiwan chipmakers see promising demand for AI HPC chips
Taiwanese foundries, OSATs, and other chipmakers are bracing for a surge in demand for AI high-performance computing (HPC) processors from US-based fabless vendors, such as Advanced...
Monday 12 June 2023
Strong reliability analysis demand for advanced packaging buoys iST revenue
Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...
Monday 12 June 2023
Taiwan academia gearing up to help TSMC maintain leading edges
In helping TSMC maintain its leading edge, the government has approved funding support for a spate of R&D projects undertaken by academic research teams, aiming to fill related...
Monday 12 June 2023
Alchip reiterates close collaboration with US clients
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has reiterated its close collaboration with significant North American clients, which will become evident in the third...
Monday 12 June 2023
TSMC on track to double CoWoS capacity for AI GPU/HPC chips
With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
Monday 12 June 2023
SoIC technology enhances TSMC cooperation with OSAT players
TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip...