Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...

TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...

Christophe Fouquet, who has been named ASML's next CEO, will fly to Taiwan to meet with TSMC CEO CC Wei later this week before heading to Samsung Electronics' headquarters in South...

Tokyo Electron Limited (TEL), a prominent Japan-based semiconductor equipment manufacturer, is set to raise the salaries of all new employees by approximately 40% starting in April...

These are the most-read DIGITIMES Asia stories during the first week of 2024 (Jan 2-Jan 5):

Former Bosch Semiconductor plant manager Christian Koitzsch confirmed that he is now president of TSMC's European subsidiary, European Semiconductor Manufacturing Company (ESMC)

Generative AI was behind Nvidia's 240% surge in market cap in 2023, and the effect also trickled down to foundry manufacturers and packaging & testing service providers in the...

TSMC will host an investor meeting on January 18, marking the return of its physical conference after nearly four years of conference calls. The upcoming investor meeting will be...

A massive earthquake rocked the Noto area of Ishikawa Prefecture, Japan, on January 1, 2024. It was Japan's third most powerful earthquake since 2010. The primary cities hit were...

In 1989, Intel initially contracted TSMC to manufacture its products. F.C. Tseng, former vice chairman of TSMC, stated at a public event in Taiwan, "I knew this was Intel's conspiracy...

Over the past year, the global semiconductor industry has experienced lackluster demands in the downstream electronics sector. AI and geopolitical uncertainties have been driving...

These are the most-read DIGITIMES Asia stories during the last week of 2023 (Dec 25-Dec 29):

When reviewing the semiconductor industry in 2023, the complex US-China tech war has become an unavoidable topic for the industry's development. Over the past few years, the Biden...

At the close of 2023, it's reported that TSMC and Samsung will delay the mass production of 4nm chips at their new fabs in the US from 2024 to 2025, posing a challenge to the Biden...

Package+, a Taiwanese startup pioneering circular economy solutions for packaging, is aiming to bring its model across Southeast Asia after gaining momentum in its home market.