Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...

TSMC is already exploring the feasibility of a third fab in Japan, having just agreed with the Japanese government to construct its second fab in the country, according to industry...

Chinese EV maker Li Auto has strengthened its capabilities in chip development and is starting to hunt international talents. Media reported that the company is establishing a team...

Speculation has emerged in the chipmaking sector that Chinese pure-play foundries, such as Huahong Group and Semiconductor Manufacturing International (SMIC), are contemplating price...

The semiconductor industry is expected to rebound in 2024, but the pace of recovery will vary from sector to sector and company to company, according to industry sources.

While positive about their revenue performance returning to a growth track with high expectations for an economic upswing in 2024, most IC design houses in Taiwan continue to face...

At the recently concluded 2023 China International Semiconductor Summit held in Shanghai, senior executives from JCET and TSMC both emphasized the role of advanced packaging, yet...

Individual and collaborative efforts of TSMC and MediaTek are to mark Taiwan's representation at the upcoming 2024 International Solid-State Circuits Conference (ISSCC).

More Chinese electric vehicle (EV) businesses are developing advanced sub-7nm chips in-house and are looking to Taiwan for ASIC and foundry partners, according to industry sources...

Fab toolmaker All Ring Tech, which is reportedly involved in the supply chain for TSMC's chip-on-wafer-on-substrate (CoWoS) packaging, is expected to post significant revenue growth...

With the ongoing US-China tensions, Huawei exemplified its ability to make 7nm chips without EUV equipment, and chip guru Burn Lin believes it's not surprising for Huawei to achieve...

TSMC not only offers advanced process manufacturing but also its advanced packaging for the recently released Microsoft Azure Maia 100 AI accelerator, according to industry sources...

Global opportunities in the generative AI (GenAI) application market have exploded with the rise of ChatGPT, leading to a substantial increase in demand for AI-related hardware and...

Following a November 15 decision from Germany's Federal Constitutional Court against the transferring of EUR60 billion - granted during the Covid-19 pandemic but unspent in fiscal...

With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024,...