TSMC has confirmed intentions to establish a joint venture fab in Germany, but aims for a high shareholding to prevent production capacity from being controlled. The Taiwan-based...
TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate...
TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.
TSMC is contemplating a 3 to 6 percent price increase for its advanced process manufacturing beginning in January 2024, according to sources at IC design houses. The price increases...
"We are at the beginning of a new computing era: accelerated computing and generative AI," said Nvidia CEO Jensen Huang in a press Q&A at Computex 2023. Huang discussed Nvidia's...
After months of negotiations, Taiwan and the U.S. signed the first agreement under the U.S.-Taiwan Initiative on 21st-Century Trade on June 1 in Washington D.C. It outlines practices...
Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric...
Taiwan's semiconductor supply chain has "fine-tuned" production plans for a major artificial intelligence (AI) chip client in order to satisfy demand in time, according to industry...
Nvidia's next-generation AI chip will continue to be manufactured by TSMC, said company CEO Jensen Huang in response to market concerns regarding the processor vendor's partnership...
The European Union (EU) has been seeking deeper synergy with Taiwan's semiconductor ecosystem as it pursues greater autonomy in the sector. As a part of this effort, the EU-Taiwan...
Takeshi Kataoka, SVP and GM of Renesas Electronics' automotive solutions is in Taiwan for the second time this year and will deliver a remark at a Computex 2023 forum on Friday (June...
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
