Ansys has achieved certification of its cutting-edge multiphysics signoff solutions for TSMC's advanced N3 and N4 process technologies, according to the EDA company. This enables...

Taiwan's semiconductor materials distributors including Topco Scientific, Wah Lee Industrial, Topco Technologies, and Chang Wah Electromaterials are all upbeat about their sales in...

TSMC has reported revenue grew 0.9% sequentially and 19.8% on year to NT$112.36 billion (US$4.06 billion) in May 2021.

Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...

Taiwan-based pure-play foundries continue to see customers pull in orders despite concerns about overbooking, and will see their fab capacity stay extremely tight throughout 2021,...

Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Technology Group, has announced suspension of its fab operations in Taiwan for two days...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D...

TSMC's just-unveiled InFO_B packaging technology designed for smartphones enables DRAM stacking flexibility at contract manufacturers, and has received positive feedback from handset...

Rising foundry and backend manufacturing costs have prompted Taiwan's IC design houses to raise their chip prices, which will buoy their sales performance in the second quarter of...

A site for COVID-19 rapid testing has been set up at Taiwan's Hsinchu Science Park (HSP) to provide one-stop services from rapid screening for diagnosing COVID-19, highly specific...

TSMC is gearing up expansion of its capacity in response to strong demand from diverse sectors. According to the foundry's CEO, TSMC...

TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.

NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...

With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...

TSMC at its ongoing technology symposium held online has unveiled its latest innovations in advanced logic technology, specialty technologies, and the additions of its 3DFabric advanced...