MediaTek has introduced a new smartphone application processor series built on TSMC's second-generation 4nm process technology, and expects smartphones powered by the new chips to...

Automotive chips are on track for manufacturing process upgrades, with 40nm technology likely to replace 90nm as the mainstream process node in five years, according to industry so...

In response to sharp order cuts by downstream clients, an increasing number of smaller IC designers in Taiwan, especially those focusing more on PC-related chip solutions, have canceled...

Despite TSMC's robust sales in the past few years and estimated strong performance in 2023, geopolitical tensions will continue to influence the foundry's decision in capacity expansion...

MediaTek chairman Ming-Kai Tsai has noted that we often overestimate the short-term benefits and underestimate the long-term business opportunities. In 1998 when he started his business,...

TSMC has put its capacity expansion focus on 3nm process manufacturing and the foundry's advanced wafer fab in the US, according to sources at fab toolmakers.

IC design houses have failed to negotiate lower foundry quotes for the first half of 2023 with TSMC and United Microelectronics (UMC), as the former foundry maintains its plan for...

With semiconductor inventory woes intensifying at supply chains, even TSMC cannot withstand the subsequent order-cutting storm, as many of its top-10 clients have cut more orders...

TSMC has announced the Open Innovation Platform (OIP) 3DFabric Alliance to help customers achieve fast implementation of silicon and system-level innovations and enable next-generation...

IC distributor WPG is looking to grow its presence in non-Greater China markets, with plans to set up new branch offices in North America and Southeast Asia to serve its customers...

Tougher US controls of semiconductor tech exports to China have considerably increased the availability of fab tools available and brought up the fab toolmakers' inventory levels,...

Nvidia CEO Jensen Huang is now in Taiwan meeting TSMC and other Taiwan-based suppliers, as well as customers, hoping to work together to go through difficult times facing the industry...

As the semiconductor industry once again frets over the future of Moore's Law, the notion of chiplets has gained traction, especially as the technology has come to be prominently...

Both TSMC and Samsung Electronics are seeing their production scale for 3nm chips constrained due to difficulty in having good control of orders from big clients, and their capacity...

TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...