IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...

It will become a new normal for chip vendors to offer higher prices to win more capacity support from foundry partners, now that global shortages of automotive chips are further compounded...

Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...

TSMC will issue a total of NT$21.1 billion (US$743.2 million) in unsecured bonds to finance new facility establishment and equipment purchases, according to a resolution approved...

Taiwan-based pure-play foundries are already in talks with clients about contracts for 2022, and intend to implement a floating pricing policy amid tight capacity, according to industry...

AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized memory chip designs and IPs, has developed a new heterogeneous integrated technology named VHM...

Taiwan's IC design houses will have no other choice but to directly pass increased costs to downstream clients if their foundry partners raise quotes again in the second half of the...

Samsung Electronics and TSMC will see their combined capex account for as high as 43% of the worldwide semiconductor industry capital spending this year, according to IC Insights'...

TSMC, United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) continue to run at full capacity for their 28nm and...

Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.

TSMC has seen its production capacity during the second quarter filled by a strong pull-in of orders for 5G, HPC and automotive electronics chips, according to industry sources.

The Southern Taiwan Science Park (STSP) Administration is enlisting more semiconductor upstream materials and equipment vendors to further strengthen the core IC manufacturing ecosystem...

Scientech, a provider of silicon wafer reclaim services and chipmaking equipment, is expected to post a double-digit revenue increase in 2021, according to market sources.

Part of TSMC's 5nm and 7nm process capacity for Apple has been released as the US vendor is transitioning from old to new offerings, with the foundry capacity soon shared out by other...

With the US trade restrictions on Semiconductor Manufacturing International (SMIC) reportedly easing, the China-based pure-play foundry is striving to regain orders particularly those...