SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth Flash (HBF), a next-generation storage technology.The announcement coincides with the opening of 'FMS (Future of Memory and Storage) 2026,' held at the Santa Clara Convention Center in California from August 4 to 6 (local time). The company is set to present HBF as a key technology to overcome memory bottlenecks in the AI era through keynote speeches and panel discussions during the event.HBF technology is a new memory layer between HBM and SSDs. It enables high-speed data transfer similar to HBM while significantly expanding capacity by leveraging NAND technology. With the expansion of AI inference driving a surge in data volumes to process, HBF is gaining attention as a technology that simultaneously resolves bandwidth and capacity scalability challenges.This milestone comes about six months after launching the consortium in February this year, following the initial standardization partnership with Sandisk in August 2025. Capacity specifications cover up to 512GB based on two stack configurations (8-high and 16-high NAND dies). Bandwidth is categorized into three grades (Grade1~3), delivering scalable performance from approximately 0.4TB/s to 3.0TB/s.A key highlight is the interconnect linking HBF technology and processors. HBF technology adopts UCIe, an industry standard connection interface, laying the groundwork to flexibly integrate HBF technology across different processor types, including GPUs and CPUs.The standard also outlines 1. connection interfaces and electrical characteristics, 2. reliability and packaging guidelines for HBF die stack process, 3. software I/O guidelines.The specification was disclosed through the Open Compute Project (OCP), world's largest open data center technology initiative, positioning it as an open standard for the entire industry rather than a proprietary technology.SK hynix plans to leverage this release to expand the adoption of HBF technology in the AI storage market and foster the surrounding ecosystem. With Google and Tenstorrent currently participating in the HBF consortium, the consortium aims to expand its reach while enhancing technical maturity and market acceptance based on open collaboration.On the opening day of FMS 2026 (August 4, local time), SK hynix Executive Vice President Kim Chun-sung (Head of Solution Development) and Vice President Kang Uk-song (Head of Next Generation Product Planning) will deliver a joint keynote address, titled 'Orchestrating Efficient AI Infrastructure through Tiered Memory in the Era of Agentic AI.'As Agentic AI rapidly commercializes, the volume of data to process is surging alongside growing demands for higher speed and efficiency. Recognizing that a single memory type cannot address these complex challenges, both speakers will present the necessity and future direction of a next-generation architecture based on 'Tiered Memory' a framework that connects and optimizes diverse memory types into a unified system.On August 6, SK hynix Vice President Lim Eui-cheol (Head of Solution AT), Sandisk Vice President Rajeev Nagabhirava and Google DeepMind Senior Staff Engineer Xiaoyu Ma will join a panel discussion titled 'Breaking the Memory Wall with High Bandwidth Flash.' Bringing together key leaders across memory, storage and AI, the session will examine fundamental shifts in memory architecture across AI infrastructure and highlight the potential and role of HBF as a transformative solution.Furthermore, SK hynix will host an exhibition booth throughout FMS 2026, featuring a Partnership Zone, a Next-Generation Tech Zone and Tech Sessions.Notably, the company will publicly reveal for the first time its tenth-generation (V10) 375-layer 4D NAND wafer and products, which are currently under development. The 375-layer 4D NAND improves performance per watt by 2.5 times compared to the previous generation, making it optimized for AI infrastructure environments like data centers that demand high power efficiency and performance. The company plans to initiate mass production of high-performance, high capacity eSSDs based on the 375-layer 4D NAND early next year to reinforce its leadership in the AI NAND market.SK hynix will also display a versatile product lineup spanning mobile, PC, automotive and robotics, showcasing the company's competitive edge in memory technology and its collaborative achievements with customers in the AI era."With the rapid spread of AI applications, we are at a point where overall data processing structures must be redesigned," said SK hynix Executive Vice President and Head of Solution Development Kim Chun-sung, adding, "Through HBF, SK hynix will expand the boundaries between memory and storage and contribute to building new architectures that enhance overall system efficiency."SK hynix exhibition booth at FMS 2026. SK hynix

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data center environments. Leveraging CXL technology, the MXC chip enables customers to build memory infrastructure with higher capacity, improved resource utilization, and greater flexibility.The CXL 3.2 MXC complies with CXL Type 3 specifications, including both CXL.mem and CXL.io protocols. It is designed with PCIe 6.x and CXL 3.2 protocol support, delivering data transfer rates of up to 64？GT/s. The chip integrates dual DDR5 memory controllers that support up to 8000？MT/s DDR5 memory. By converting host-side CXL memory requests into DDR commands in real time, it enables efficient data exchange between the host and backend memory, effectively breaking through the memory capacity limits of traditional servers.Additionally, the chip integrates PCIe 6.x PHY, DDR5 PHY, dual RISC-V processor subsystems, and a comprehensive set of management interfaces. It supports multiple CXL memory expansion form factors, including PCIe AIC cards and EDSFF modules, providing critical support for emerging memory applications such as memory expansion, pooling, and tiered memory architectures."The trial production of the CXL 3.2 MXC chip marks an important milestone in Montage Technology's pursuit of CXL innovation and commercialization," said Stephen Tai, President at Montage Technology. "As memory demands continue to surge in the AI era, we are providing our customers with high-bandwidth, large-capacity, and highly reliable memory expansion solutions, accelerating the large-scale adoption of CXL in data center and AI infrastructure."In addition to the chip, Montage Technology provides a complete software development kit (SDK) along with analysis and testing tools to help customers accelerate product development, compatibility validation, and mass production. The CXL 3.2 MXC has already been integrated into next-generation CXL products by leading memory module manufacturers, including Samsung and SK hynix, with initial validation successfully completed. The solution is designed to align with leading server platforms, including Intel Xeon and AMD EPYC, to ensure broad interoperability and optimal performance.Customer and Partner Feedback:Jangseok Choi, VP of Memory Product Planning at Samsung Electronics stated: "The combination of CXL 3.2 MXC with DDR5 memory technology offers data center customers a solution that balances performance and capacity. Our collaboration validates the value of CXL in increasing system memory capacity and resource utilization, and provides additional options for next-generation AI infrastructure."Uksong Kang, Head of Next Gen Product Planning&Std at SK hynix noted: "With the rapid adoption of large language models and generative AI, memory has become a critical factor in system performance. Montage Technology's MXC product demonstrates strong potential for supporting high-capacity memory expansion and resource sharing. We look forward to deeper collaboration in ecosystem validation and product innovation."Dr. Debendra Das Sharma, Senior Fellow and Chief I/O Architect at Intel remarked: "AI, next-gen cloud systems, and today's industry economics are reshaping server memory architecture and driving demand for CXL. Montage Technology's CXL 3.2 MXC demonstrates how the maturing CXL ecosystem delivers protocol support, compatibility, and performance, helping to unlock the memory expansion capabilities of next-generation Intel Xeon platforms."Amit Goel, corporate vice president, Compute and Enterprise AI Platform Solutions Engineering, AMD added: "AI and data center workloads are driving continuous evolution of system architecture, making memory a key factor in performance and scalability. We look forward to our continued collaboration with Montage Technology on CXL technologies to deliver a foundation for building more flexible and efficient memory architectures."Upcoming Events:Montage Technology will showcase its CXL 3.2 MXC solutions at the CXL DevCon on August 3, 2026, at the Santa Clara Marriott, and at the FMS (Future of Memory and Storage) exhibition from August 4–6, 2026, at the Santa Clara Convention Center (Booth #845), both in Santa Clara, USA. We warmly invite our customers, industry peers, and partners to visit our booth for in-depth exchanges on industry trends and potential collaboration opportunities.Montage Technology Announces Industry-First Trial Production of CXL 3.2 MXC Chip. Credit: Montage Technology

？Connected and digitized vehicles, machines, and energy systems place new demands on electronics. From now on, electronics must not only deliver high-performance but also detect cyberattacks, contain disruptions, and enable secure updates. Cyber resilience is therefore becoming a key factor for trust, availability, and market success. electronica 2026, taking place in Munich from November 10 to 13, will showcase the technologies that are essential for this.？Industrial systems, vehicles, and energy systems are increasingly evolving into networked electronic systems that are controlled, updated, and secured via software. Security mechanisms can therefore no longer be added as an afterthought but must instead be integrated right from the start into the system design, particularly for interfaces, updates, and software-defined functions.？At the same time, customers, regulators and operators expect solid proof of the security and updatability of electronic systems. "As the world's leading electronics trade fair, electronica 2026 in Munich brings together key players from across the entire value chain. In doing so, it creates a framework for addressing cybersecurity not in isolation, but as a shared architectural challenge for the electronics industry", explains Caroline Pannier, Exhibition Director of electronica.？Studies show growing pressure to act？Recent studies show how important an issue this is. The ENISA Threat Landscape 2025 report, for example, identifies attacks on public administration and the transport sector as the most common targets of cyberattacks, with phishing being the most frequently used method. In many cases, hackers target companies' operational technology (OT).？However, according to a PwC study, only about 15 percent of German companies have so far invested specifically in proactive security and resilience measures. The vast majority remain reactive: Investments are only made after incidents occur or as part of regular updates, without a systematic transformation concept for prevention.？Increasing regulation of cybersecurity？To encourage companies to take action and integrate security into products from the outset, the European Union has enacted the Cyber Resilience Act (CRA). It specifically regulates products that companies place on the European market. Among other things, it requires that products with digital components remain secure throughout their expected service life and address vulnerabilities throughout their lifecycle. It covers a wide range of electronic products, not just internet-enabled devices, but essentially all products with a direct or indirect logical or physical connection to a device or network.？Effectively countering cyberattacks？As a result, the CRA makes security a key development requirement. At the same time, AI-based systems give rise to new risks: data poisoning, model poisoning, and adversarial attacks can manipulate AI models and lead to incorrect decisions. Developers are responding to this with "security by design"—that is, with security mechanisms integrated from the outset into the architecture, secure firmware, and verifiable updates.？At the component level, this includes a hardware root of trust, Secure Boot, and Trusted Platform Modules (TPMs). Secure microcontrollers (MCUs) implement security functions directly within the device, ensuring, for example, that only authenticated firmware or signed code is executed during system startup.？Exhibitors showcase relevant technologies？At electronica, numerous exhibitors will present their innovations and solutions for resilient electronics. Infineon, for example, will address the issue of cyber resilience with, among other things, its "Optiga" security solutions for embedded security. In the context of secure, connected devices, Renesas primarily offers its secure "RA" microcontrollers, including isolated cryptographic operations, secure key storage, Arm TrustZone technology, and protection measures against side-channel attacks. Texas Instruments is expanding its product portfolio with its AM263x Sitara MCUs, providing, among other things, Secure Boot, cryptographic keys, and a hardware security module.？electronica as a platform for resilient electronics？The supporting program at electronica will also focus on cyber resilience, for example in the Cyber Security Forum and in a series of presentations and workshops on the Cyber Resilience Act. Industry experts will provide insights into the latest technologies as well as practical approaches and strategies for resilient electronic products. With this framework, electronica 2026 will provide developers, technical decision-makers, and CEOs with concrete guidance on how to make their companies more resilient against cyberattacks.