DEKRA's Automotive EMC Laboratory in Taiwan has been officially approved by Stellantis, making it the third DEKRA site worldwide alongside Italy and Korea. This milestone underscores DEKRA's pivotal role in the global automotive EMC testing landscape.Stellantis, one of the world's largest automotive groups, operates a rigorous laboratory approval program to ensure partners meet the highest technical standards. With this approval, DEKRA Taiwan is now authorized to provide EMC testing for 16 Stellantis brands, including Chrysler, Citroen, Fiat, Opel, and Peugeot. The recognition allows DEKRA to deliver reliable EMC testing support to the global supply chain, helping OEMs and suppliers accelerate product validation, reduce time-to-market, and benefit from localized expertise in the Asia-Pacific region.The Stellantis approval adds to DEKRA's extensive portfolio of OEM recognitions worldwide. In Taiwan, DEKRA's Automotive EMC Laboratory is also approved to provide testing services for GM, Volkswagen, and Jaguar & Land Rover. Meanwhile, DEKRA Korea's EMC Laboratory is recognized by Ford, GM, and Stellantis. Together, these approvals highlight DEKRA's breadth and depth in serving global automotive manufacturers, and reinforce the group's ability to combine its worldwide laboratory network with regional expertise to provide comprehensive local support."We are honored to receive Stellantis' recognition. This approval is a strong endorsement of our team's expertise and commitment, and it empowers DEKRA Taiwan to better support customers in automotive electronics, intelligent mobility, and electric vehicles. Our focus is on helping supply chain partners speed up validation, shorten time-to-market, and strengthen their global competitiveness," said Aaron Lee, Managing Director of DEKRA Taiwan.DEKRA Taiwan's Automotive EMC laboratory has developed a strong reputation for serving international OEMs, with capabilities spanning intelligent transportation systems, wireless communication, and electric vehicles. The new Stellantis approval further strengthens its strategic role within DEKRA's global laboratory network and ensures full alignment with international technical standards.Beyond individual testing projects, DEKRA delivers comprehensive one-stop EMC services. These include EMC testing, wireless certification, OEM specification verification, and Global Market Access (GMA) support. With combined automotive and military EMC testing capabilities, DEKRA helps clients efficiently meet OEM requirements, streamline validation, and accelerate entry into global markets.DEKRA Taiwan's Automotive EMC Laboratory, approved by Stellantis, supporting EMC testing for global automotive OEMs.

With the widespread adoption of AIoT (Artificial Intelligence and Internet of Things) applications—from smart home devices to smart manufacturing, connected vehicles, smart cities, infrastructure and defense systems—the reliance of digital devices on flash memory for code storage has rapidly expanded. Memory is no longer just a medium for data storage; it now serves as the carrier for firmware, the repository for AI models, and the guardian of identity and authorization data. Ensuring security of flash memory directly determines the trustworthiness of the devices themselves.Risks from Real World Applications-A smart doorbell was compromised and used for remote surveillance of households by hackers.-A smart camera product line was infected with malware due to poor memory protection, causing large-scale corporate network breaches.-A battlefield drone was hijacked. Investigation revealed its unprotected flash memory exposed flight parameters and credentials.When memory becomes the convergence point for both data and instructions, a single breach can collapse all layers of defense.The Changing Role of Memory in AI SystemsThe introduction of AI, especially in edge devices, has made the role of memory even more critical. Today, memory not only stores data but also holds AI model parameters and behavioral decision logic. The requirements for memory integrity and non-repudiation have increased significantly. If AI models are tampered with, it can lead to erroneous decisions or even malicious behavior.Moreover, AI-driven real-time responses demand that memory supports lower latency and higher confidentiality. Traditional security designs focused solely on data protection can no longer meet the needs of modern devices.The Challenge of Compliance and the Surge of StandardsGlobal regulations around IoT and industrial device cybersecurity are intensifying. The EU's Cyber Resilience Act, the U.S. IoT Cybersecurity Improvement Act, ISO 21434 for automotive systems, and IEC 62443 for industrial control systems all require strong confidentiality and data integrity—even at the memory level. Flash memory must now address both functional safety and cybersecurity challenges.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Rethinking Memory Security AssumptionsHistorically, memory was treated as a peripheral component, with security left to the main controller. But today's attackers use physical access tools, firmware injections, and interface-level attacks to exploit memory. Flash memory must now adopt active defense mechanisms, including:- Hardware-level access control- Data encryption and firmware authentication- Event logging and anomaly detection- Logic-level separation and multi-factor verificationRedefining the Role of Secure Flash MemoryTo truly counter next-generation risks, flash memory should integrate secure logic circuits, providing secure boot, firmware authentication, key management, encryption engines, and access control. Such designs greatly reduce the risk of edge devices being compromised, controlled, or having their data stolen.In product design, special emphasis shall be placed on the concept of 'establishing a root of trust' through Secure Boot and key storage mechanisms. This ensures that every device boot starts from trusted code, preventing malicious firmware implants. Key storage shall be implemented in a pure hardware architecture, isolating sensitive information in inaccessible secure zones, significantly enhancing both physical and logical security.For firmware security, compliance to firmware authentication and resilience design standards such as NIST SP 800-193. This means not only verifying firmware integrity at boot, but also automatically recovering to a safe state in the event of an attack or anomaly, ensuring continuous device operation and protection from malicious software.Furthermore, secure storage solutions shall use a pure hardware architecture, requiring no external software or controller assistance, maintaining high security and performance even in harsh environments.To address supply chain security challenges, advanced digital signature technology is needed, ensuring that every firmware and software update from the manufacturer to the end device can be verified for source and integrity, providing comprehensive secure supply chain support.To meet post-quantum threats, advanced encryption standards such as CNSA 2.0 (Commercial National Security Algorithm Suite 2.0) compliance is necessary, ensuring that the software update architecture complies with the latest international cybersecurity regulations and meets the needs of high-security applications in government, defense, and automotive sectors.Winbond W77Q / W77T Secure Solutions and Industry PracticeAs a provider of secure logic circuit flash memory solutions, our products have been successfully adopted across diverse applications, including computer peripherals, video conferencing equipment, servers, AI edge servers, and automotive modules. Our designs maintain logical compatibility with existing market architectures to ensure smooth integration and low migration cost.Our solutions integrate LMS (Leighton-Micali Signature) advanced digital signature technology for PQC (post-quantum cryptography) needs.Our security architecture is also certified under leading global standards including Common Criteria (CC), FIPS 140-3, SESIP, PSA, IEC 62443, ISO 21434, and ISO 26262—offering customers a reliable and future-ready foundation.Safeguarding Human-Centered Trust at the Technological EdgeIn the AIoT era, memory security is no longer just about storage—it is the foundation of system-wide trust. From household devices to tactical drones, memory holds more than data; it protects privacy, drives enterprises, and underpins societal resilience.As a Secure Flash Memory solution provider with dedicated logic design, we understand the profound responsibility behind technology. Our solutions offer downward compatibility with mainstream architectures, while meeting stringent global security standards.True innovation is not just about what we can do—but what we can trust. We are committed to embedding security into every smart node and collaborating with partners, developers, and standards bodies to ensure technology continues to serve human values.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.This year's one-day seminars will center on live product demonstrations of Sycamore, xMEMS' revolutionary thin and lightweight full-range MEMS loudspeaker, and cooling, the world's first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can't go.Attendees will experience:1) AI glasses featuring Sycamore speakers and cooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear2) Next-gen headphones featuring full-range Sycamore, paired with cooling to deliver the world's first active earcup ventilation3) SSD thermal management featuring cooling for higher sustained data transfers4) Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing cooling at both chip and system levelsIn addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and cooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics."AI is changing how we interface with devices while also increasing processor and thermal loads," said Joseph Jiang, CEO of xMEMS Labs. "At xMEMS Live Asia, we'll demonstrate how Sycamore and cooling technologies are enabling a new generation of thinner and lighter-weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance."Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!For more information about xMEMS and its solid-state solutions, visit xmems.com.Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and cooling on September 16 in Taipei and September 18 in Shenzhen.

Power modules have undergone a significant transformation- from simple power sources into critical enablers of system scalability, performance, and energy efficiency. This evolution is driven by the increasing demand for energy resilience, industrial transformation and enhancement. MEAN WELL, the global leader in standard power supply solutions, will adopt an application-oriented approach and work in close collaboration with distributors to showcase the effectiveness of their diversified product portfolios in practical applications at the upcoming Automation Taipei 2025.Partnering with distributors to develop complete solutions for automation, green energyTony Hsieh, Section Manager of MEAN WELL's Technical Service Center, indicated that the company's focus at this exhibition is on automation and green energy applications. Distributors will leverage their expertise in automation applications to incorporate MEAN WELL's green energy and backup power products.Hsieh further noted that the company's product designs follow cross-industry standards, efficiently fulfilling the application requirements of distributors in their specific sectors. In the field of humanoid robotics, MEAN WELL provides an array of charging power options, including wall-mounted designs, high-power density models, and fanless or fan-equipped configurations. These technologies can be easily adapted for various scenarios, including outdoor applications. Moreover, they support CAN bus communication and system-level integration, ensuring a stable power supply.The characteristics offer a broader range of collaborative models between MEAN WELL and its distribution partners. Partners leverage their technical expertise and capabilities to integrate MEAN WELL's standard products and related components as a foundational element in their offering, in addition to traditional product sales. Furthermore, by applying their professional integration capabilities—tailored to specific application scenarios—they co-develop comprehensive solutions that deliver significant added value.At Automation Taipei 2025, factory automation specialist YAU-YIH Enterprise will present a complete industrial robotic arm display solution powered by MEAN WELL's automation-oriented power supplies. RiKO, specialist in smart lighting control, will showcase the integration of MEAN WELL's Matter wireless and DALI wired dimming controllers with its proprietary sensors for use in industrial and commercial automation scenarios. JIDIEN will exhibit its most recent XDR and XTR series DIN-rail power supplies, as well as the next-generation mobile energy storage system, the NTN-5K, highlighting its advancements in energy storage applications and power integration.MEAN WELL's distributors will present backup power solutions for energy applications. Integrating redundant power supplies with control modules allows automation systems to securely retain operational progress, document work steps, and ensure a consistent power supply during outages, thereby reducing equipment loss and downtime expenses.Hsieh stated that MEAN WELL's target applications prioritize energy conservation, green energy and smart systems. These technologies prioritize high-efficiency energy conversion, support a variety of communication protocols, and enable remote monitoring. They can be integrated with other products to enhance energy storage and feedback systems in both grid-connected and off-grid setups, effectively fulfilling the stability and intelligent energy demands of modern automation systems. This presentation leverages distributors' expert integration capabilities, combining MEAN WELL power modules with green energy and backup products to create a unified system that provides significant value-added services to end customers.The simultaneous release of key products aims to greatly improve industrial control and energy storage applications solutionsMEAN WELL will exhibit a variety of key products at this exhibition, in addition to the two target applications. These products include the XDR series DIN-rail power modules, the BIC-2200 bidirectional power supply, the LOP-200/300 ultra-thin PCB power supplies, and other solutions that have garnered significant industry attention.The XDR, XDR-E, and XTR represent significant enhancements to MEAN WELL's DIN-rail power supply product line, effectively tackling spatial limitations, thermal management, and communication needs within the industrial and automation sectors. The three products are distinctly categorized: the XDR serves as the premium flagship with superior performance and extensive communication capabilities; the XDR-E presents a budget-friendly alternative; and the XTR accommodates three-phase input, rendering it appropriate for substantial loads and extended usage. series can function at full capacity at 60 degrees Celsius. These products meet international safety standards such as CB, TUV, UL, CE, and UKCA, with some models offering explosion-proof and maritime safety certifications.The BIC-2200 is a bidirectional AC/DC power supply designed to support various energy storage applications by facilitating both charging and discharging operations. It can be paralleled with a maximum of five units for a total output of 11kW, delivering 2200W of power per unit in a 1U ultra-slim rack-mount design. It possesses a bidirectional conversion efficiency of 93% and switching rates of one millisecond. Furthermore, it has an optional CAN bus interface for connection with energy management systems. This product is TUV/UL 62368-1 and CE certified, and adheres to the IEC 62477-1 grid-connection standard. It includes comprehensive protective measures, including islanding protection, overvoltage, overload, short-circuit, and overtemperature safeguards, rendering it appropriate for battery manufacturing and energy scheduling applications like vehicle-to-vehicle (V2G) systems.The LOP-200/300 series is an ultra-thin, high-power PCB-mounted power supply, measuring 4×2×1 inches and around 25mm in thickness. They are offered in 200W and 300W variants, featuring a maximum output capacity of 150% and an output voltage range of 12-54V. They can operate reliably at altitudes of up to 5,000 meters and within a temperature range of -40 to 80 degrees Celsius. The LOP-200/300 series has obtained numerous international safety certifications, including IEC 62368-1, IEC 60601-1, and IEC 61558-1/60335-1. They demonstrate a conversion efficiency of up to 94%, and a leakage current of 500µA, and an integrated auxiliary power supply of 12V/0.5A. The entire series comes with a three-year warranty.Product and application solution partner: MEAN WELL and distributors building a complete value chainAt Automation Taipei 2025, MEAN WELL will present the outcomes of its strategic evolution into a comprehensive product and application solutions partner. Distributors can leverage their specialized expertise, together with MEAN WELL's extensive standardized product line, to create a full value chain from product to application. Hsieh indicated that driven by a triadic strategy of module standardization, application orientation, and customization support, MEAN WELL is moving beyond the traditional role of a power supply manufacturer and evolving into an application-driven power solution partner. In the future, MEAN WELL will enhance its flexible integration and application extension capabilities across automation, energy storage, AI computing, medical care, and high-density equipment. Through close collaboration with industry partners, the company aims to deliver efficient, safe, and stable smart solutions.Caption: XTR Series Ultra-Thin, High-Efficiency, and Durable DIN Rail Power Supply.Caption: XDR-E Next-Generation Ultra-Thin DIN Rail Power Supply.

Taiwan has officially transitioned into a super-aged society. The swiftly increasing older demographic and the labor force deficit have resulted in a significant scarcity of nursing personnel. By 2030, it is projected that the global demand for nursing personnel will rise by 5.5 million to 7.4 million, necessitating an increased patient care burden on medical professionals.Simultaneously, the quality standards of contemporary medical care are perpetually advancing, while the nursing operational procedures have become increasingly intricate and burdensome, hence augmenting the workload and time constraints faced by nursing personnel. Confronted with multiple problems, medical institutions must devise ways that sustain high-quality care while alleviating the pressure on nursing personnel. In response, Far Eastern Memorial Hospital (FEMH) implemented the ASUS VivoWatch smart band to significantly enhance nursing efficiency and service quality.The aging population affects medical care: Smart wearables helpLiu, Cai-wen (transliterated from Chinese), supervisor of the FEMH Nursing Department, stated that the ASUS VivoWatch, a wearable produced by ASUS, can automatically measure patients' vital indicators such as heart rate, blood pressure, and blood oxygen levels. It transfers this data to the hospital system in real time using its built-in Bluetooth module, allowing for continuous 24-hour physiological monitoring. Furthermore, the device boasts a pleasant and lightweight design, suitable for extended usage, which can substantially reduce discomfort and limit interference with patients' daily activities. The FEMH Information Technology Department has partnered with the ASUS team to link the wearable device to the hospital's information system, incorporating it with the early warning system to provide an automated health risk assessment process. Upon detecting abnormal vital signs in a patient, an alert notification can be promptly generated to improve care response efficiency and ensure patient safety.Liu stated that this solution effectively addressed numerous clinical pain points. Firstly, nursing workers are no longer required to measure physiological data during the night to prevent disrupting patients' sleep. Secondly, the wearable device autonomously captures physiological data, alleviating the burden on nursing staff regarding manual measurement and documentation; thirdly, high-frequency automatic monitoring, in conjunction with an early warning system, facilitates the medical team in identifying early indicators of deteriorating conditions, thereby enhancing patient safety. This smart wearable is being utilized in the VIP and general acute wards at FEMH, serving inpatients aged 18 and above. An Institutional Review Board (IRB) has authorized the assessment of the proposal's ethical criteria and safety.Clinical advantages are reinforced in a variety of ways, resulting in a win-win situation for both patients and nursesThe efficiency of FEMH nursing operations has been substantially improved by the implementation of ASUS VivoWatch wearable devices. The automated measurement and data recording capabilities allow nursing staff to focus on patient care and emergency interventions, thereby achieving the objective of "minimizing pressure and workload." The ASUS VivoWatch wearable is seamlessly incorporated with the EWS system, allowing the nursing team to promptly identify abnormal patient signs. This integration reduces the occurrence of abrupt deterioration incidents and improves patient safety. The real-time update function of physiological data boosts the quality of care by enhancing the speed and accuracy of decision-making for the medical team. Additionally, patients are less frequently disturbed during sleep by traditional measurement methods, which strengthens hospital comfort and recovery outcomes.Liu noted that FEMH and ASUS will continue to expand the use of the wearable device across wards and for patients with various diseases, while also improving technology integration. Simultaneously, they will promote the standardization of smart care by using technology to simplify consistent nursing operational procedures, so boosting overall medical service quality and the hospital's potential for long-term development. It is hoped that by combining clinical nursing experience with technical innovation, we would be able to handle the caregiving challenges posed by an aging population and attain the long-term care aim of "nursing personnel and technology collaborating," Liu concluded.

Users in industrial control and info-communication fields are placing growing importance on the durability and reliability of power supplies. However, legacy power supply units (PSUs) are facing unprecedented challenges due to the trend towards more compact devices and increasing business focus on ESG performance.These industrial are also setting increasingly stringent requirements for PSU performance and size, driven by corporate ESG goals and environmental sustainability performance. MEAN WELL, a leading global supplier of standard PSU products, has launched the next iteration of its classic SE-1000 series that has been a best-seller for 20 years. The all-new next-generation LRS-1200 series features a smaller footprint and higher conversion efficiency while retaining its famed high reliability design. The new product offers a superior solution for mid- to high-power applications that require high energy efficiency and compact form factors.LRS-1200 Embodies Next-Generation PSU Design through High-Efficiency, Reliability, Compact Footprint, and Carbon ReductionThe LRS-1200 is based on the SE-1000 and draws on the high reliability design characteristic of MEAN WELL. Product volume was reduced by a staggering 49% through extensive optimizations and conversion efficiency was improved by 6% to reach up to 94%. Product carbon footprint evaluation found that each LRS-1200 PSU produced 13.30 kg CO₂ of carbon emissions, a 48.02% decreased compared to the 25.58 kg CO₂e of SE-1000. It therefore satisfies the demanding requirements for a compact footprint, energy efficiency, and sustainability in modern applications. The product supports an ultra-wide input voltage range of 180 ~ 305 Vac and an operating temperature range of -30 to +70 °C. It can also operate reliably at altitudes of 5,000 meters above sea level and in unstable power grids. A peak output of 150% is supported to cater for high instantaneous loads from starting motors, demonstrating the product's superb environmental adaptability and application flexibility. A 3-year warranty and lightweight design reduces system installation and operating costs even further. For budget-sensitive customers or large-scale deployments, it offers a highly cost-effective and environmentally-friendly power supply solution.Recognized in Multiple Industries and ApplicationsLRS-1200 has been certified by multiple international certification bodies. These included IEC/EN/UL 62368-1 for information devices as well as IEC/EN IEC 61558-1 and IEC/EN 61558-2 16 for industrial control applications. National safety certifications include CB, UL, DEKRA, RCM, CQC, BSMI, EAC, CE and UKCA. These not only provide assurance of safety during equipment operations but also ensure compatibility with all types of industrial equipment around the world. The peak output of 150% is particularly well suited to industrial automation and electromechanical systems with high instantaneous loads. The LRS-1200 has already been introduced in a number of applications encompassing industrial control systems, new energy devices, and cooling modules. Customer feedback has been generally positive. The new product has demonstrated clear advantages over legacy products in terms of flexibility on space-saving installations and power efficiency, further boosting its over cost-effectiveness and application value.Towards Smart Power and One-Stop SolutionsIn the future, MEAN WELL will continue to uphold the core strategy of "4S3H" by strengthening its system integration capability and the competitiveness of its products. "4S" stands for Software, System, Solution, and Service with an emphasis on software-hardware integration and application-oriented development; "3H" emphasizes high added value, high cost-effectiveness, and high output by upgrading the technical sophistication and range of applications for standard products. With the launch of the LRS-1200 high-power, compact PSU, MEAN WELL will continue to release more high power density, compact footprint, high efficiency, and smart solutions, aiming to deliver a one-stop, high-value, high-performance PSU service model.At the same time, MEAN WELL consolidates its R&D resources in Taiwan and China, and collaborating with ESG-aligned partners to co-develop product bundles featuring smart control and system scalability. These will have widespread applications in the industrial automation, LED lighting, medical, energy and information fields. All new products will undergo multi-national safety certifications to ensure compliance and readiness for global markets, enabling MEAN WELL to continue delivering stable, reliable, and sustainable PSU solutions.The next-gen LRS-1200 series offers higher efficiency in a smaller size, with MEAN WELL's trusted reliability - ideal for compact, high-power applicationsPhoto: MEAN WELL

YMIN today announced its next-generation conductive polymer tantalum capacitors designed to address the growing challenges of power integrity and system reliability in enterprise solid-state drives (SSDs). As AI, machine learning, and big data workloads drive unprecedented performance demands in data centers, ensuring stable power delivery and data integrity has become mission-critical for storage devices.Enterprise SSDs operate continuously under high-performance workloads, often in harsh environments, making them vulnerable to risks such as sudden power loss, voltage instability, and component degradation. One of the most critical issues is the potential loss of cached data during unexpected outages. YMIN's capacitors deliver high capacitance and rapid discharge capability, enabling complete cache write-back within milliseconds and safeguarding valuable data against power interruptions.High-frequency current stress during intensive I/O operations can trigger voltage fluctuations that cause bit errors or damage to SSD components. YMIN's low-ESR conductive polymer tantalum capacitors effectively suppress power rail noise, reduce ripple voltage, and ensure stable power delivery to critical storage components, even under heavy load conditions.Reliability is equally essential in 24/7 enterprise environments where SSDs must withstand elevated temperatures, vibration, and limited space. YMIN's capacitors are engineered for high reliability, exceptional thermal and mechanical resilience, and long operational life. Their compact form factor offers high capacitance density, making them ideal for space-constrained SSD designs while supporting frequent charge-discharge cycles without performance degradation.By combining robust energy storage, superior filtering capabilities, and environmental durability, YMIN's conductive polymer tantalum capacitors - as advanced SSD capacitors - provide a reliable solution for enhancing SSD power architectures. This innovation helps enterprise storage systems maintain data security, improve system stability, and achieve long-term operational efficiency in the demanding era of AI and big data.Author: Shanghai Yongming Electronics Co., Ltd.Contact: ymin-sale@ymin.comSolid State Driver (SSD)New tantalum capacitor with ultra-high capacitance densitySSD capacitor recommendation from YMIN

As cloud computing and data center industries accelerate the adoption of open architecture and open firmware, the traditional firmware ecosystem is undergoing deep restructuring.AMI and Taiwan's ODMs Join Forces to Build the Next-Generation InfrastructureOpen architecture has shifted from a technical option to an industry mainstream. Kenneth Tao, Director of Business Development at American Megatrends International (AMI), emphasizes that the company constantly adjusts its strategy and product roadmap to align with industry evolution, positioning itself as an "open architecture builder" that provides truly adoptable open-source platforms.From IP Code to Open Source: AMI Responds Precisely to Industry TransformationAs CSPs increasingly collaborate directly with ODMs, the industry's structure has changed significantly. Tao explains that Cloud Service Providers (CSPs) are no longer merely purchasing off-the-shelf products - they now seek greater control over product definition and resources, gradually establishing maintainable proprietary platforms. Many CSPs come from open-source ecosystems and prefer building platforms using their own open firmware frameworks to gain greater control and differentiation.AMI has long-standing ties with the Open Compute Project (OCP), having collaborated since the early days of OCP's promotion of open hardware specifications. Recognizing the widespread adoption of OCP-compliant servers and the push for standardized hardware production by ODMs, AMI proactively established corresponding firmware standards and validation processes. It also participates in multiple working groups to convert standards into product development guidelines, accelerating customer adoption. Notably, AMI became the first independent BIOS vendor to receive OCP S.A.F.E. designation, helping ODMs/OEMs provide firmware security and code quality assurance to end users.Based on this foundation, AMI introduced open platforms such as MegaRAC Community Edition and Aptio Community Edition, helping customers swiftly implement open-source strategies. In this evolving ecosystem, AMI plays the role of "infrastructure provider at the firmware layer," creating a stable and scalable base. This allows clients to integrate their own IPs and pursue differentiated development. Tao emphasizes that this is not simply a technical decision - it reflects a systematic transformation responding to the needs of the value chain. AMI has evolved from a traditional IP vendor into a builder of open architecture committed to delivering a maintainable, multi-scenario firmware platform.Transforming from Proprietary Firmware to Open Architecture: A Major ChallengeTao acknowledges that this transition is a major undertaking. The biggest hurdle is the varying definitions and expectations of "open source" across industry players. CSPs want different ODM platforms to share the same firmware base to ensure consistency in testing, maintenance, and deployment. ODMs, meanwhile, must meet both CSPs' open-source demands and diverse customization requirements from enterprise clients, facing dual pressures.On the technical side, challenges abound - OpenBMC differs significantly from AMI's traditional IP BMC architecture. AMI's previous development environment centered around Debian. OpenBMC, however, is based on the Yocto framework, which complicates integration.To solve these issues, AMI developed the "OneTree Architecture," which manages multiple system codebases in a unified way, establishing a standardized and scalable open firmware foundation. This allows customers to rapidly develop and extend proprietary features while minimizing integration and maintenance costs. AMI also adopts a strategy of "Open Source Base + Commercial Value-Added Modules." The open base offers a standard framework for rapid deployment, while proprietary IP modules are selectable based on needs, enhancing differentiation and market competitiveness.Accelerating ODM Transformation with AMI's Open Platforms: Reducing Maintenance Costs and Boosting CompetitivenessMany ODMs have already implemented AMI's open solutions. Tao points out two major benefits for ODMs. First, AMI's pre-built open architectures allow for seamless integration with hardware platforms, shortening development and validation cycles. Second, they reduce maintenance burdens, as both OpenBMC and BIOS are complex systems requiring continuous updates and significant manpower for security management. With AMI's support and standardized open platform, ODMs can minimize their maintenance costs.Looking Ahead: Full Strategic Deployment Across Four PillarsFor future planning, Tao shares that AMI will strategically invest in four key areas: "Talent Development", "Toolchain", "System-Level Management Support", and "Validation Platforms." To address the shortage of senior firmware engineers in Taiwan, AMI has formed a dedicated training team, offering modular development interfaces for seasoned engineers and complete training and certification processes for newcomers, accelerating client team growth.Simultaneously, AMI continues to develop its OneTree Development Studio tools for building a code environment, firmware update tool, and DCM multi-server/rack management, extending open architecture from single-server to rack-level to meet centralized management needs for large-scale cloud and AI infrastructures.Additionally, AMI plans to promote the "Meridian Triple-Win Validation Platform," which pre-validates ODM hardware platforms using its own open-source code. This enables CSPs to directly select hardware and firmware combinations that match their needs and improve consistency in firmware experience. For ODMs, obtaining AMI certification expands market opportunities, while AMI broadens its platform coverage, achieving a win-win-win for CSPs, ODMs, and AMI.United with Taiwan's ODMs: From Manufacturers to DefinersObserving recent industry developments, Tao believes Taiwan's ODMs and system integrators have shifted from passive manufacturers to frontline product definers. They now directly understand customer needs and provide rapid feedback for design and supply chains.He highlights three advantages Taiwan companies bring to the OCP/SRI ecosystem: direct connections to global cloud/AI clients, high development flexibility, and the potential to evolve from ODMs to OEMs or even service providers.AMI's relationship with ODM clients has transformed into a partnership in facing end customers. By leveraging mutual insights into both market and design, collaboration improves product development efficiency and alignment. Tao concludes by stressing that open source is not about "passing the baton to the community," but a joint effort in maintenance and implementation, balancing technical openness with business value. The fusion of Taiwan's ODMs and AMI will become a best-practice model for rolling out open system architectures.As open architecture becomes mainstream, those able to provide stable infrastructure, professional integration, and ongoing support will play a pivotal role in the new ecosystem. AMI will continue to serve as a strong backbone for Taiwan's industry as it transitions toward open source, with deep firmware expertise and access to global ecosystem resources.Kenneth Tao, Director of Business Development at AMI

The year 2025 marks a pivotal moment in the accelerated adoption of artificial intelligence (AI). The rapid uptake of intelligent terminals—such as AI PCs, AI smartphones, and AI servers—has fueled the rise of innovative applications, including generative AI, autonomous driving, AI glasses, and embodied AI. Amid this evolution, storage systems have emerged from the background to take the center stage, serving as a key underpinning for enhancing AI experiences and driving systemic transformation.In the face of the high demands of bandwidth, power consumption, latency, capacity and dimension across diverse AI-driven scenarios, significant breakthroughs have been achieved in new-generation high performance storage technologies like LPDDR5X/DDR5, QLC NAND, LPCAMM, and CXL. Integrated innovations in chip design, controller algorithms, and packaging and testing processes are propelling the industry into a new phase of AI-driven transformation.In this dynamic context, the "Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum)", co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., is scheduled to be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel.GMIF2025 is scheduled to take place on September 24–25, 2025, at the Renaissance Shenzhen Bay HotelPhoto: Shenzhen Memory Industry AssociationUnder the theme of "AI Applications, Innovation Empowered", the summit will delve into three key topics, specifically emerging trends in storage technologies, real-world AI applications, and collaborative innovation across the storage industry chain. Representative enterprises across all segments of storage ecosystem, comprising wafer IDM manufacturers, controller and module suppliers, packaging and testing providers, and AI platform vendors, will come together to collectively explore innovation pathways and ecosystem development in the AI era. The key focal points of GMIF2025 include:Trends and Roadmaps of Storage Technologies:Centered on AI-driven storage innovations, the summit will explore industrial progresses in forefront technologies, and further map out the trajectory for storage's enhanced value in the evolving compute architecture.New Opportunities in Storage Driven by AI Applications:Focusing on core AI-based scenarios such as AI PCs, AI smartphones, AI servers, generative AI, autonomous driving, AI glasses and embodied AI, the summit will address emerging storage requirements in terms of performance, power consumption, capacity and form factor, and explore innovation at the intersection of technology and application.Collaborative Innovation Across the Industry Chain:In the context of post-globalization supply chain restructuring, the summit will concentrate on strategic collaboration across the storage industry chain to bridge supply-demand gaps and cultivate a resilient, efficient, and innovation-driven global ecosystem.GMIF2025 Agenda OverviewPhoto: Shenzhen Memory Industry AssociationIndustry Breakdown of Attendees: Based on GMIF2024 DataPhoto: Shenzhen Memory Industry AssociationGMIF2024, successfully held last year, brought together over 30 core industry enterprises for keynote presentations, featured 33 exhibiting companies showcasing more than 150 innovative products, and presented 38 annual awards. The event garnered over 680 million impressions across all channels, attracted more than 1,400 professional attendees, and received widespread acclaim from both industry and the public.During GMIF2024, global live broadcast of memory trends by brands achieved a cumulative viewership of over 76,000 and total exposure exceeding 1 million.Highlights from GMIF2024Photo: Shenzhen Memory Industry AssociationAnnual Awards & Industry RankingsTo recognize and celebrate outstanding enterprises for their remarkable contributions to innovation and development in the global memory industry, GMIF2025 will continue to honor exemplary companies across five award categories: Industry Contribution Award, Terminal Application Award, Solution Award, Technology Innovation Award, and Market Service Award. In addition, the Shenzhen Memory Industry Association (SMIA), in collaboration with the School of Integrated Circuits at Peking University and JWinsights (Shanghai) Technology Co., Ltd., will unveil the highly anticipated Memory Industry Ranking during the summit.Looking back at GMIF2024, a distinguished group of enterprises—including Micron, Western Digital, Solidigm, CXMT, YMTC, GigaDevice, Intel, Arm, Rockchip, UNISOC, Allwinner Technology, Silergy, Victory Giant Technology, Silicon Motion, BIWIN, Skyverse, QUANXING Technology, POWEV, KingSpec, Hemei Jingyi, Tongfang, Weibu Information, SIXUNITED, Heyan Technology, Attach Point Intelligent Equipment, OKN Technology, InnoGrit, Tytantest, iWISEETEC, MICROFROM, Konsemi, LKAUTO, Maxwell, RORZE, ExTripod Electronics, EPS, LANYI, and many others—were recognized with the 2024 Annual Awards for their outstanding contributions to the storage and memory industry.Feedback from Previous AttendeesPhoto: Shenzhen Memory Industry AssociationJoin us at the Fourth GMIF2025 Innovation Summit on September 24-25, 2025, in Shenzhen! Click the link below to register now and secure your seat.Registration link: https://jsj.top/f/KQLpk0

Rugged embedded computer brand - Cincoze's Red Dot Award-winning MXM GPU computer series (GM-1100) has the high performance, compact design, and expansion flexibility that make it the ideal choice for space-constrained Edge AI applications. The GM-1100 series supports the latest 14th Gen. Intel Core processors and NVIDIA MXM GPU modules, providing the ultimate computing performance and graphics processing capabilities for real-time decision-making and high-speed AI Edge computing. The GM-1100 is only 260 x 200 x 85 mm, but it maximizes expansion flexibility and can easily meet the application needs of multiple vertical industries, especially in transportation, manufacturing, and defense.Transportation: Improving Safety and FlowTransportation: Improving safety and flowAirport E-gates and X-ray scanners, powered by the GM-1100, enhance customs clearance efficiency and aid in automating security checks. The GM-1100 efficiently handles multiple tasks simultaneously, performing image processing and real-time analysis by leveraging the combined power of the CPU and GPU. It offers native rich I/O and expandable I/O to support LAN, COM, USB, and DIO interfaces, for flexible connectivity with peripherals such as cameras, passport readers, and gate controllers. Its wide temperature design (-40°C to 70°C), combined with its fanless architecture, can effectively overcome the challenges of high temperatures and dust when installed in an electrical enclosure. It effectively achieves fast and accurate identity recognition and prohibited goods detection, optimizing customs clearance efficiency and overall safety.Manufacturing: Boosting Efficiency and YieldManufacturing: Boosting efficiency and yieldAutomated optical inspection (AOI) and robotic bin-picking systems benefit from the powerful performance and rapid data transfer of the GM-1100, making it an optimal computing solution. The potent AI inference capabilities of the MXM GPU enable swift and precise identification of product defects and object location, significantly boosting inspection and overall operational efficiency. The high-speed I/O interfaces, including up to 10GbE LAN, 20Gbps USB 3.2 Type-C, and an M.2 Key M slot for expansion with high-speed NVMe SSDs, fully meet the high-speed transmission and extensive storage requirements of high-resolution image processing. To address the challenges in installation environments with high electromagnetic interference, the GM-1100 adheres to industrial-grade EMC standards. It has successfully obtained CE, UKCA, and FCC certifications, and complies with ICES-003 Class A level. It supports multiple installation methods, such as wall, side, DIN rail, and VESA, for enhanced deployment flexibility.Defense: Enhancing Intelligence and ReconnaissanceDefense: Enhancing intelligence and reconnaissanceMilitary reconnaissance and information gathering can leverage the rugged design and efficient computing of the GM-1100. Its MXM GPU module enables high-speed parallel computing for real-time image analysis and terrain recognition, facilitating battlefield map construction and mission assessment. The built-in M.2 Key B expansion slot supports a GNSS module for high-precision positioning. Its wide voltage design (9-48V) allows flexible installation in military vehicles, surface vessels, and other mobile equipment, and it is equipped with an IGN (Power Ignition Sensing) delayed power on/off function that prevents system damage and data loss from temporary shutdowns or unstable power. Having passed the MIL-STD-810H shock and vibration test and E-mark vehicle certification ensures the stable operation of the GM-1100 in harsh environments, making it a reliable computing core for military defense systems.