SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth memory(HBM) package for next-generation HBM products.Heat management has become a critical challenge as HBM technology advances with higher stacking and faster speeds to cater to the surging demand for AI data processing.The efficient management of power density in the Die-to-Die Physical Layer (D2D PHY) - the interface connecting HBM and GPU - has emerged as a key factor defining the competitiveness of next-generation HBM.With the iHBM solution, the company has taken a structural approach to addressing the heat management issue. Existing HBM products rely on an indirect cooling method that draws heat away through the core die. In contrast, the iHBM solution places ICEs directly in the D2D PHY area where heat concentration is the highest, creating an additional 'heat dissipation path'. This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.The company's mass-production capabilities also serves as a key advantage. SK hynix's Wafer Level Packaging(WLP) process, based on its market-proven Mass Reflow Molded Underfill(MR-MUF) technology, enables stable high-volume production of iHBM-equipped chips. Furthermore, the solution offers high design compatibility with existing System-in-Package(SiP) architectures, allowing customers to adopt the new thermal technology with minimal design adjustments.Through the iHBM solution, slated for deployment in next-generation HBM products, including HBM5, SK hynix aims to increase the stability and operational efficiency of HPCs, AI data centers by meeting heat management standards required in high-density and high-bandwidth environments."iHBM is an optimal solution for thermal management, combining our memory design capabilities with advanced packaging technology," said Kangwook Lee, Senior Vice President and Head of PKG Development at SK hynix, adding "The company will cement its AI memory leadership by taking preemptive steps to offer values needed in the AI environment for its customers."

As Artificial Intelligence (AI) applications rapidly expand from cloud computing to edge computing, smart manufacturing, networking equipment, and AI PCs, stable and high-efficiency power supply has become the critical foundation for AI system operations. FSP Group will make a major appearance at COMPUTEX 2026 under the theme "Powering AI Together," showcase to  comprehensively demonstrate its AI power solution layout from data centers to end-user devices.Collaborating with Global ICT LeadersThis year, FSP Group has joined forces with multiple AI and Information and Communications Technology (ICT) leaders to demonstrate application results. Partners include Advantech, AIC, ARBOR, Chenbro, CyberTAN, UNEEC, Intel, SPARKLE, Trust5 intelligence and Uniwill.Through live system demonstrations, FSP will showcase how its power solutions are successfully integrated into AI servers, industrial PCs, and smart devices, further driving the rapid implementation of AI business applications.Focusing on Critical Power Infrastructure in the AI EraThis exhibition showcases FSP's AI power solution portfolio spanning from data centers to end devices, focusing on the critical power infrastructure driving the AI era, including: Data Center Power Shelf, Battery Backup Unit (BBU) Shelf, Networking Power Solutions, CRPS Solutions, Industrial PC (IPC) Power Solutions, USB PD Fast Charging Solutions, Grid Resilience Solutions, AI PC Power Solutions.These exhibits fully demonstrate FSP's comprehensive technical strength from core infrastructure to terminal applications.High-Performance Computing and Edge AI ApplicationsData center solutions focus on AI servers and High-Performance Computing (HPC) applications, providing high-efficiency and reliable power support tailored for high-power, high-density, and redundancy requirements. Meanwhile, networking and edge computing applications cover diverse scenarios including PoE switches, network switches, embedded systems, and edge AI servers, aiming to meet the power demands of various AI architectures."Micro Customization" as a Core Competitive EdgeFSP stated that in the face of rapid AI market development and diversified application needs, the company continues to leverage "Micro Customization" as its core competitive advantage. By providing highly flexible and reliable power solutions tailored to different application scenarios, FSP helps customers shorten development cycles and enhance system stability and market competitiveness.Complete Layout for High-End Consumer and Retail MarketsIn addition, FSP showcased a variety of products tailored for AI workstations. This impressive lineup features high-wattage power supplies such as the CANNON 3300W, the TWINS PRO 1400W ATX(PS2) redundant power supply, the high-power TWINS CRPS 3200W redundant power supply, and the 80 PLUS Titanium-certified MEGA TI 1650W White Edition. On the chassis front, FSP introduced multiple 4U Tower/Rack hybrid AI chassis, alongside the S210 chassis, specifically designed for compact performance and certified with NVIDIA SFF READY.  Providing a complete solution from power supply to chassis cooling, this display fully demonstrates FSP's comprehensive product layout in both enterprise-level applications and high-end consumer markets.With the rapid advancement of AI applications, power supplies have evolved from backstage components to the critical core of system performance and stability. Through COMPUTEX 2026, FSP Group will further demonstrate its technical prowess and industrial layout in the AI power sector.For more information on FSP products, please visit.

With the first phase of the European Union's Cyber Resilience Act (CRA) set to take effect imminently, German-based automated cybersecurity compliance provider ONEKEY, together with its Taiwanese local partner Trinity Technologies, notes that the CRA elevates product cybersecurity from a "one-time audit" to a "long-term governance" framework. Its review documentation and reporting processes are subject to an extremely rigorous compliance framework. To this end, ONEKEY and Trinity Technologies jointly recommend that Taiwanese ICT companies prepare early, leveraging localized professional support and automation tools to complete verification, and transform compliance pressures into market competitiveness.Cybersecurity Management Obligations Extend from Shipment to the Entire Lifecycle, Making Reporting Mechanisms a New Challenge for EnterprisesThe CRA will first implement vulnerability reporting and response mechanisms on September 11, 2026, and will take full effect on December 11, 2027. At that time, companies that have not achieved compliance will not only face substantial fines but may also see their products banned from sale in European countries. The CRA requires that all "Products with Digital Elements" (PwDE) fully incorporate cybersecurity management during planning, design, development, and maintenance, and address vulnerabilities throughout the entire product lifecycle. Consequently, most information and communications technology (ICT) supply chains—including smart home devices, connected devices, industrial control products, automotive electronics, and software solutions—are directly facing the impact of CRA regulations.Although the CRA is set to take effect in early September, a survey by ONEKEY reveals that as many as 68% of companies remain unfamiliar with the specific details of the CRA. ONEKEY notes that most manufacturers face four common misconceptions regarding the CRA regulations. First is a misjudgment of the implementation timeline, overlooking the fact that the "24-hour vulnerability reporting obligation" will take effect on September 11, 2026;second is a misunderstanding of responsibility, failing to elevate product safety to the level of "product governance"; third is a lack of compliance evidence, as a single penetration test is no longer sufficient to meet EU audits; and finally, manufacturers must be responsible for the overall safety of their products, which means the entire product supply chain must also comply with the CRA regulations.Five-Step Guide for Manufacturers to Build a Reproducible Operational Model, Starting with a Product Line InventoryJan Wendenburg, CEO of ONEKEY, stated: "We are at a turning point where global products face stringent cybersecurity requirements. With the EU's implementation of the CRA, cybersecurity is no longer a 'nice-to-have' for products, but rather a 'passport' for entering the European market. Many manufacturers possess world-class hardware engineering capabilities, but when faced with complex software supply chains, they often lack real-time, auditable transparency. ONEKEY's mission is to help clients bridge compliance gaps, guiding them from a 'good enough' approach toward full lifecycle cybersecurity governance."To transform this situation, ONEKEY leverages integrated platform technology to weave SBOM automation, vulnerability prioritization, impact assessment, and compliance guidance throughout the entire product lifecycle. This helps manufacturers establish a monitoring system ready for audits at any time, fundamentally resolving compliance challenges. Currently, ONEKEY has assisted global giants in Taiwan—including and ZyXEL—in aligning with CRA compliance requirements. Leveraging its extensive experience in CRA compliance, ONEKEY recommends that manufacturers follow these five steps to progressively achieve CRA compliance, thereby creating a repeatable compliance operating model. This transforms product "compliance" into a powerful competitive advantage, enabling them to seize the initiative in the European market. 1. Assess the product portfolio: Prioritize identifying which networking equipment, industrial computers, or IoT devices will be sold in the European market after 2026 and 2027. 2. Comprehensively establish a Software Bill of Materials (SBOM): For the aforementioned products, create an SBOM by scanning source code and binary code, ensuring it includes legacy firmware and vendor-provided firmware.3. Establish a Product Security Incident Response Team (PSIRT) process: Ensure that a dedicated team can assess the scope of impact within 24 hours of a vulnerability disclosure, fulfill reporting obligations, and proactively implement remediation.4. Implement "Shift-Left" Development: Integrate binary analysis and SBOM checks into every software development and firmware release cycle as a final pre-shipment verification.5. Turn Evidence into a Marketing Asset: Encourage the public disclosure of these automated detection results and compliance evidence to demonstrate product security as a key differentiator to European buyers.Incorporating AI Compliance Pathways Aiming for 100% Certainty into Automated TestingRegarding the application of AI in automated testing technology, ONEKEY emphasizes that while AI adoption certainly improves efficiency, it must also adhere to non-negotiable standards of determinism for cybersecurity compliance. Unlike the generative AI commonly found in the market today—which is prone to "hallucinations" or misjudgments—the AI models adopted by ONEKEY focus on the auditability and accuracy of results. Wendenburg stated, "In the realm of legal compliance, 'mostly correct' is 'wrong.' When EU auditors request proof of compliance, vendors cannot provide a result that is merely a guess generated by AI."To implement "Responsible AI," ONEKEY's technical architecture combines in-depth binary static analysis with rigorously validated deterministic algorithms. This means that every decision made by the system—whether scanning firmware, generating an SBOM, or matching against CRA regulatory requirements—is backed by clear logical reasoning and technical evidence. This approach ensures the system does not produce false regulatory determinations, preventing enterprises from falling into compliance traps due to AI false positives and even facing unnecessary legal litigation risks.Wendenburg emphasized that cybersecurity compliance requires not an AI that writes poetry, but a digital audit assistant with a high degree of "certainty." Through this rigorous technical approach, ONEKKEY assists Taiwanese companies in navigating the complex provisions of the CRA to produce legally valid compliance evidence that withstands official EU verification, reducing the error rate in regulatory judgments to near zero and fundamentally protecting the company's market reputation and operational rights.Trinity Technologies Strengthens Localized Technical Support to Help Manufacturers Become Trusted Security Partners in the EUChen Zhaoren, founder of ONEKEY's Taiwanese partner Trinity  Technologies, pointed out that as a global hub for the ICT industry , time has become the most pressing cost factor for enterprises in Taiwan as the EU's CRA regulations are set to take effect. He observed that while Taiwanese contract manufacturers have traditionally relied on "fast delivery" and "value for money" as their core competitive advantages, future market dynamics will shift toward "Secure by Design" and "supply chain transparency." Currently, EU brands have begun formally shifting the responsibility for providing Software Bill of Materials (SBOM), vulnerability reporting obligations, and up to five years of security maintenance to their Taiwanese supply chain partners. This means that Taiwanese manufacturers can no longer remain on the sidelines of this compliance wave.To help enterprises navigate these stringent regulatory hurdles, Trinity  Technologies is committed to localizing world-class tools like ONEKEY to assist Taiwanese companies in reshaping their R&D and quality assurance management processes. Through comprehensive protection technologies that integrate source code and binary firmware, Trinity  Technologies helps manufacturers establish automated compliance evidence chains and vulnerability response mechanisms without sacrificing cost-effectiveness. This not only accelerates clients' procurement review processes but also helps Taiwanese manufacturers transition from mere hardware suppliers to "security strategic partners" trusted long-term by the EU market, enabling them to withstand low-cost competitors in a regulation-driven competitive environment.Smart Compliance Wizard and Fast Start Program  Helping Enterprises Simplify Processes and Accurately Identify GapsTo help clients quickly grasp, organize, and implement the CRA regulations, ONEKEY has launched the "CRA Fast Start" acceleration program—specifically designed for equipment, machine, and system manufacturers—to assist companies unsure where to begin. Through automated software, the program addresses three key areas—readiness assessment, systematic vulnerability management, and 24/7 continuous monitoring—to guide companies step-by-step in identifying gaps in their existing processes and precisely pinpointing discrepancies with compliance standards.Additionally, ONEKKEY actively participates in the EU-funded Digital Europe program "CRA Compliance Wizard" and has integrated it into its products to provide automated guided workflows. Customers need only upload firmware binary files; the system automatically analyzes vulnerabilities and compares them against regulatory requirements, guiding enterprises through technical and organizational questions to generate a CRA-compliant "Statement of Compliance" and audit trail with a single click. This streamlines the previously cumbersome process of manually creating documents—which required significant legal and engineering resources—transforming it into an intelligent software tool that simplifies regulatory compliance in daily operations.If addressing EU CRA regulations is likened to a military campaign, "CRA Fast Start" serves as a "training and advisory program" that helps enterprises inventory their resources, formulate strategies, and build a defense system; meanwhile, the "Compliance Wizard" is the "intelligent detection weapon" used by R&D and QA personnel in actual operations to scan for product vulnerabilities, accurately answer regulatory questions, and generate certificates of compliance. The two complement each other, not only simplifying complex processes but also helping manufacturers transform compliance costs into a strategic advantage for entering the European market.Actively Preparing for the Phase 1 Deadline: Turning Compliance Pressure into a Strategic Advantage for Entering EuropeAs the September 11 deadline for the first phase of vulnerability reporting obligations draws near, Taiwanese ICT manufacturers can no longer afford to sit on the sidelines. The entry into force of the CRA not only signifies a comprehensive raising of the EU's product cybersecurity standards but also marks a survival-of-the-fittest test of supply chain resilience. Faced with extremely complex review documents and the stringent 24-hour reporting deadline, traditional manual response models can no longer meet compliance requirements. If manufacturers fail to promptly establish an automated vulnerability management and continuous monitoring system, they not only face the legal risk of product withdrawal from the market but may also lose their competitive edge as EU brands reshape their supply chains.Amid this tidal wave of compliance, the first step in proactive preparation lies in implementing a "product safety incident response team," "shifting security left," and "supply chain transparency." Through ONEKEY's automated compliance tools and Trinity Technologies' localized professional support, enterprises can start by inventorying their product lines to rapidly build highly reliable SBOMs and technical evidence chains. This transformation effort should not be viewed as a burdensome "compliance tax", but rather as a "market passport" for building international trust and countering low-cost competition. By taking action now and leveraging automation to bridge process gaps, companies can confidently turn regulatory challenges into a powerful moat for deepening their presence in the European market when the new regulations take effect in 2026.ONEKEY and Trinity Technologies meet to discuss CRA compliance solutions. Credit: DIGITIMESONEKEY CEO Jan Wendenburg explains CRA regulations and strategies for Taiwanese ICT companies. Credit: DIGITIMES

As generative AI and intelligent applications continue expanding from cloud infrastructure into real-world environments, demand is rapidly increasing for Edge AI platforms capable of delivering real-time computing, low latency, space efficiency, and long-term operational stability. At COMPUTEX 2026, Shuttle Inc. will showcase a series of Edge AI computing platforms powered by Intel Core Ultra processors, highlighting AI-ready edge computing systems designed to accelerate practical AI deployment across commercial and industrial environments.As AI applications continue expanding into retail, healthcare, smart manufacturing, and visual computing environments, Shuttle continues to focus on compact and deployment-ready Edge AI platforms designed for different spaces and operational requirements.At COMPUTEX 2026, Shuttle will present Edge AI platforms ranging from compact 1-liter systems to expandable 5-liter AI workstations, supporting workloads including visual AI, intelligent analytics, digital signage, healthcare applications, agentic AI workflows, and industrial automation.Among the featured systems, the DB860 supports multi-display output and rich I/O connectivity for digital signage, retail analytics, and control center applications. The XB860G2 provides PCIe Gen5 expansion capability for GPU and AI accelerator integration targeting advanced visual analytics workloads. The ultra-compact NT20H delivers up to 99 TOPS AI performance for space-constrained edge deployments, while the fanless BPCAR03 industrial platform is designed for smart factory and AIoT environments requiring wide-temperature support and long-term reliability.In addition to hardware platforms, Shuttle will also demonstrate several Edge AI deployment scenarios across commercial and industrial environments during COMPUTEX 2026.Experience the future of Edge AI with Shuttle at COMPUTEX 2026! We warmly invite our industry partners to join us from June 2–5 at the Taipei Nangang Exhibition Center, Hall 2, 4F (Booth R0114). Connect with our team and explore our latest solutions in action. Click here to book your exclusive meeting or download our newest product highlights today!

Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe Technology Symposium.This exhibition highlights the successful collaboration between GUC and VSORA, combining advanced AI architecture with leading-edge ASIC implementation and packaging technologies to deliver a high-performance, scalable inference solution for data center workloads.Enabling advanced AI inference through close collaborationJotunn8 is VSORA's flagship AI inference processor, purpose-built for inference workloads. It delivers ultra-low latency and very high throughput by addressing the memory wall bottleneck, enabling cost-efficient deployment of large-scale AI models.GUC provided comprehensive turnkey ASIC services for Jotunn8, managing the full implementationfrom netlist to manufacturing. The project demonstrates GUC's expertise in complex system integration, including: Advanced chiplet architecture design and integration, High-bandwidth memory integration with HBM3E PHY and controller, 2.5D die-to-die connectivity using GUC's 17.2 Gbps GLink-2.5D interconnect, Advanced packaging implementation leveraging TSMC CoWoSR-S technology (3x reticle size), Implementation on TSMC's 5nm process node,Full-system co- optimization of signal, power, and thermal integrity (SI/PI/TI), Power and IR optimization to enhance overall system efficiency.This collaboration underscores GUC's capability to deliver complex AI and HPC ASICs with optimized performance, power, and scalability.Leveraging a strong ecosystem with TSMCJotunn8 also reflects the strength of GUC's long-standing collaboration with TSMC. As a key partner in TSMC Open Innovation PlatformR (OIP) ecosystem, GUC enables customers to efficiently adopt advanced process nodes and packaging technologies, bridging innovative architectures with leading-edge manufacturing.By leveraging TSMC's advanced CoWoSR packaging and 5nm process technologies, GUC ensureshigh-quality silicon execution and a reliable path to production for demanding AI applications."We are proud to showcase Jotunn8 at the TSMC Europe Technology Symposium. This achievement highlights our strong collaboration with VSORA and demonstrates GUC's ability to bring complex AI processors to silicon using advanced process and packaging technologies," — said Patrick Wang, Senior Vice President and Chief Revenue Officer at GUC."Jotunn8 is designed to unlock a new level of efficiency and scalability for AI inference. Our collaboration with GUC has been key in successfully translating this architecture into a highperformance silicon solution,"— said Khaled Maalej CEO of VSORA.Driving next-generation data center AIThrough this collaboration, GUC and VSORA address the growing demand for high-performance,energy-efficient AI inference in hyperscale data centers. Jotunn8 enables new levels of throughput and latency optimization, supporting large-scale AI deployment across cloud and enterprise environments.

iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical AI platforms. At COMPUTEX 2026 (June 2–5), iCatch will showcase its latest PAISB solutions at Booth #R0826, Nangang Exhibition Center Hall 2, 4F.As Physical AI systems rapidly evolve, developers are increasingly challenged by the complexity of multi-sensor synchronization, high-bandwidth data ingest, and image quality tuning, which often diverts resources away from core AI development. iCatch's PAISB platform directly addresses this challenge by introducing a hardware-accelerated, HSB-aligned imaging pipeline that enables deterministic, low-latency data transfer into NVIDIA GPU platforms. By offloading sensor ingest, synchronization, and imaging processing into a dedicated ASIC, PAISB allows developers to focus on AI model innovation and system-level applications, positioning iCatch as a key enabler within the NVIDIA Holoscan ecosystem for next-generation robotics, autonomous systems, and Physical AI deployments.At COMPUTEX 2026, iCatch will demonstrate two key PAISB platforms that highlight this capability. The PAISB-E1 (1GbE) can run stereo vision applications on NVIDIA platforms, designed for smart actuators and dexterous robotic manipulation requiring precise depth perception and real-time responsiveness. In parallel, the PAISB-E10 Proto-ES (10GbE) will showcase Tele/Wide imaging with EIS on NVIDIA platforms, targeting humanoid robot edge platforms and robotic factory simulation server environments. These demonstrations illustrate how PAISB enables time-aligned, high-bandwidth multi-sensor streaming while simplifying system integration."PAISB represents a key milestone in iCatch's Physical AI platform strategy," said Weber Hsu, President of iCatch Technology. "As the first HSB-aligned Imaging ASIC, PAISB enables AI developers to focus on model innovation by abstracting sensor-level complexity. We are committed to building the sensor infrastructure layer that accelerates Physical AI deployment across robotics and autonomous systems."iCatch invites industry partners and developers to visit the booth at COMPUTEX 2026 to experience live PAISB demonstrations and explore collaboration opportunities. Learn more about PAISB and Schedule a meeting or request information.

The perfect fusion of the world’s smallest fan and advanced thermal-optimized SSD technology for AI computing applications.Datotek Inc., a provider of high-performance storage and memory solutions, will showcase its latest AI-driven storage technologies at COMPUTEX 2026 in Taipei. As one of the SSD manufacturers and DRAM manufacturers focusing on AI storage innovation, Datotek will present PCIe Gen5 NVMe SSDs, memory modules, portable SSDs, and advanced SSD heatsink innovations designed for AI computing, edge AI applications, and high-performance systems.The company continues to strengthen the integration between AI technologies and high-speed storage architecture. By combining PCIe Gen5 SSD, NVMe SSD, memory modules, and intelligent thermal management technologies, Datotek aims to deliver faster, smarter, and more intuitive storage experiences for creators, professionals, gamers, and AI users.At COMPUTEX 2026, Datotek will present a wide range of AI storage and high-performance computing solutions, including PCIe Gen5 NVMe SSDs, portable SSD solutions, memory module technologies, and SSD heatsink designs optimized for AI PCs, gaming systems, creator workflows, and edge AI environments.New M.2 2280 PCIe Gen5 SSD Active Cooler: 1cm thin with extreme cooling. Credit: Datotek Inc.One of the key highlights of this year's exhibition is the debut of the "ARES AEROFIN" active SSD Heatsink solution, designed for the extreme thermal demands generated by PCIe Gen5 NVMe SSD platforms and AI-intensive workloads. The advanced cooling system combines an ultra-slim active cooling architecture, Skived Fin high-density fin technology, and a micro cooling fan to effectively reduce thermal throttling, maintain SSD stability, and improve long-term system reliability under sustained high-load operation.With an industry-leading thickness of only 1 cm and a lightweight 20 g design, ARES AEROFIN delivers a compact yet highly efficient SSD cooling solution for high-performance PCs, gaming platforms, AI computing systems, and content creation environments. Designed for AI workloads, 8K video editing, AAA gaming, and professional creator applications, the active heatsink significantly improves thermal efficiency while maintaining stable PCIe Gen5 NVMe SSD performance.Exploded view detailing the cooler module's tech & specs. Credit: Datotek Inc.In addition to performance innovation, Datotek continues to advance intuitive AI storage and portable SSD solutions that simplify data management and improve accessibility. By integrating user-centric design with high-speed storage and memory module technologies, the company aims to accelerate the adoption of AI-powered storage in everyday applications.Under intensive operating conditions, Gen5 NVMe SSD temperatures can rapidly increase and impact system stability. Equipped with the ARES AEROFIN heatsink, SSD peak temperatures can be reduced to as low as 42.6°C and stabilized at approximately 38°C during extended operation. This thermal performance enables PCIe Gen5 NVMe SSDs to sustain ultra-high-speed performance of up to 14,000 MB/s read and 12,000 MB/s write speeds without throttling, helping extend SSD lifespan and supporting more sustainable storage operation.Datotek remains committed to its core philosophy of "Technology Innovation" and "Sustainable Development." In addition to advancing SSD, NVMe, PCIe, memory module, and AI storage technologies, the company continues to promote green supply chain practices, intelligent cooling innovation, and environmentally responsible product development. Moving forward, Datotek will collaborate with global ecosystem partners to accelerate smarter and more sustainable digital transformation in the AI era.Visitors are welcome to explore Datotek's latest AI storage, PCIe Gen5 NVMe SSD, portable SSD, memory module, and advanced SSD heatsink innovations at Booth I1124, Taipei Nangang Exhibition Center, from June 2-5, 2026 during COMPUTEX 2026. For more information, please visit Datotek Official Website and Datotek Facebook Page.

As global electricity demand accelerates - driven by rapid AI computing growth, rising corporate decarbonization commitments, and increasing focus on grid stability - the power supply industry is evolving from standalone components into a foundational enabler of energy efficiency and intelligent system management. In response to this transformation, MEAN WELL, a leading global brand in standard power supplies, will present a comprehensive portfolio of solutions at COMPUTEX 2026. The showcase will extend beyond traditional power products to include smart lighting and integrated energy management systems, designed to help enterprises enhance energy efficiency, strengthen operational resilience, and advance intelligent and sustainable development.A key highlight of MEAN WELL's exhibition is system integration. In addition to power supply solutions, the company integrates controllers, communication interfaces, sensors, and energy management platforms into a unified hardware–software architecture. This holistic approach addresses diverse application needs across smart manufacturing, energy management, device networking, and operational optimization. Among the featured products, the BIC-5K series of bidirectional power supplies will stand out. Compared with the previous 2.2kW model, the BIC-5K significantly enhances power capacity to meet the growing demands of high-capacity residential energy storage systems as well as small- to medium-scale commercial storage applications. It is designed to support evolving grid compliance requirements, enabling bidirectional energy flow and Vehicle-to-Grid (V2G) applications. By facilitating flexible energy exchange among electric vehicles, energy storage systems, and the power grid, the series contributes to a more adaptive and resilient power distribution framework.Historically, bidirectional power supplies were primarily used in battery manufacturing for formation and capacity testing, enabling energy recovery during charge–discharge cycles and reducing energy waste in production environments. However, as global energy demand rises - particularly from AI data centers and other high-power applications—the role of bidirectional solutions is expanding beyond manufacturing into buildings, commercial facilities, and distributed energy systems. The introduction of the BIC-5K series reflects this shift, addressing the growing need for energy storage infrastructure, power distribution flexibility, and integrated energy management while enhancing overall system efficiency and adaptability.MEAN WELL will also showcase the XDR series rail power supplies and NSP series chassis power supplies, designed for applications in industrial machinery, automated production lines, medical equipment, and intelligent building systems. Both product lines emphasize high efficiency, wide operating temperature ranges, compact design, and robust peak power capability. These characteristics ensure stable and reliable power delivery in space-constrained environments while maintaining performance under extreme temperatures and sudden high-load conditions.Key advantages: (1)High efficiency, reducing power conversion losses and heat generation, thereby lowering overall electricity costs. (2)Wide operating temperature ranges, ensuring reliable performance in demanding environments such as industrial sites, outdoor installations, and high-temperature control cabinets. (3)Compact design, enabling system designers to optimize space utilization, increase layout flexibility and reduce material consumption. (4)Peak power capability, supporting short-term high-load demands—such as motor startup or sudden load surges—without requiring oversized power systems, thereby improving cost efficiency.By reducing energy consumption and enhancing conversion efficiency, these solutions help organizations lower carbon emissions and operational costs, aligning with ESG objectives and global sustainability trends. The design philosophy also contributes to reduced procurement expenses and lower lifecycle operating costs for end users. In this context, the XDR and NSP series represent more than incremental advancements in power supply technology; they offer a practical pathway for enterprises to strengthen competitiveness while advancing sustainable development goals.MEAN WELL will further demonstrate its solution-oriented strategy through a smart lighting kit based on the DALI-2 standard. The system integrates LED drivers, controllers, touch panels, and sensors to enable dimming control, color temperature adjustment, group management, scene configuration, and automated functions such as occupancy-based activation and automatic shutoff. This integrated approach supports both energy conservation and user comfort, making a well-suited for commercial offices, public facilities, and smart building environments.In addition to lighting solutions, MEAN WELL - together with its ESG partners - has introduced the EOS (Energy Operating System) energy management platform to provide organizations with intelligent power management capabilities. The platform integrates power supply equipment, smart meters, environmental sensors, and energy storage systems, enabling enterprises to monitor electricity consumption by floor, production line, and time period. Through comprehensive data analysis, organizations can develop optimized energy strategies, refine consumption behaviors, and improve overall operational efficiency. From system planning and equipment deployment to performance optimization and execution, MEAN WELL delivers integrated power, energy storage, and energy management solutions to support the establishment of a complete smart energy framework.Driven by the increasing global demand for electricity - particularly from AI applications - alongside the growing imperatives of energy conservation, carbon reduction, and sustainable development, MEAN WELL remains committed to advancing power technology innovation. By integrating control systems, communication interfaces, smart lighting, and energy management platforms, the company provides comprehensive, high-efficiency solutions that enhance enterprise competitiveness and energy performance.At COMPUTEX 2026, MEAN WELL will showcase the BIC-5K, XDR, and NSP product lines, along with integrated system solutions, highlighting the company's latest advancements in intelligent energy services and high-value-added technologies.

Founded in 1986, PANJIT Group is approaching a major milestone: its 40th anniversary. In an exclusive interview, founder and Group President Jason Fang reflected on the company's entrepreneurial journey, which began shortly after completing his military service, when he launched a red-brick manufacturing business specializing in tunnel kiln technology that later became the largest brick factory in southern Taiwan.Looking back on those early years, Jason Fang believes entrepreneurship is built on respecting professional expertise, building the right values within an organization, and fulfilling corporate social responsibility. These principles laid the foundation for PANJIT's evolution into a leading Integrated Device Manufacturer (IDM) in the power semiconductor industry, with capabilities spanning wafer fabrication, packaging, and testing.Like any enduring enterprise, PANJIT's journey came with its share of challenges. Along the way, a key source of the company's strength has been the close partnership between Jason Fang and his brother, Chairman & CEO Jeff Fang. With complementary leadership styles and strong execution capabilities, the two brothers have worked side by side for four decades, guiding PANJIT through every stage of its growth.Turning the Vision of "Power Semiconductors as the Backbone of Industry" into RealityPANJIT was founded during Taiwan's rapid industrial transformation in the 1980s, when the economy was shifting from traditional manufacturing toward a rapidly growing technology sector. Recognizing the long-term potential of foundational electronic components, Jason Fang chose to enter the power semiconductor industry despite having little prior experience in the field.He believed that every electronic device ultimately depends on efficient power components, viewing power semiconductors as the backbone of modern electronics. The vision, that power semiconductors would become the backbone of the modern electronics industry, became the driving philosophy behind PANJIT's development. Through the collective efforts of Jeff Fang and the entire PANJIT team, has steadily become reality over the past forty years.In its early days, PANJIT entered the market through packaging technologies for fundamental components such as power diodes. Technical support initially came through a Korean supply chain connected to Fairchild Semiconductor, allowing the company to begin as an OEM supplier serving the European home appliance market.Through close collaboration with customers, PANJIT gradually established its quality systems, manufacturing foundation, and domestic supply chain ecosystem, strengthening its operational capabilities and building a solid foothold in the market.Three Key Milestones Behind PANJIT's Rise in Automotive and Data Center Power SemiconductorsThe first came during the Y2K era around 2000, when rapid growth in ICT products and compact consumer electronics accelerated the industry's shift from through-hole components to surface-mount devices (SMD). Recognizing this trend early, PANJIT imported advanced equipment from Switzerland and quickly expanded into the SMD segment, capturing its first major growth opportunity.The second milestone came during the COVID-19 pandemic in 2020. Surging demand for notebooks and electronic devices placed heavy pressure on semiconductor supply chains, making capacity expansion a top industry priority. PANJIT accelerated expansion at its Xuzhou manufacturing base while restructuring its solar panel business to refocus resources on core semiconductor operations. As Jason Fang described it, the company chose to "rise again from where it once faced setbacks."The third turning point emerged from tightening global automotive semiconductor supply chains beginning in 2024, often referred to by the media as the "Nexperia supply disruption." During this period, PANJIT successfully transitioned from a secondary supplier to a primary sourcing partner for many customers. By providing stable supply, competitive pricing, and strong manufacturing support, the company rapidly expanded its automotive power semiconductor business, with automotive applications accounting for approximately 40% of revenue, while further advancing into AI data center and medium- to high-voltage DC power solutions.Expanding the PANJIT Brand in the Global MarketPANJIT's expanding presence in the global automotive supply chain began taking shape as early as 2018, when increasing numbers of Tier 1 automotive customers approached the company in search of additional sourcing partners. This opportunity also highlighted the need to further strengthen product quality and manufacturing systems.While PANJIT's earlier business focused primarily on consumer electronics, automotive applications required a much higher level of reliability and quality assurance. To meet these standards, PANJIT worked with a German team in Europe to establish automotive-grade quality and manufacturing systems, rebuilding its quality management framework over two years.Beginning in 2020, PANJIT significantly increased investment in automotive and high-performance power semiconductor technologies. Through its R&D teams, the company expanded product lines compatible with leading European solutions while investing approximately USD 300 million between 2020 and 2023 to strengthen its competitiveness in the automotive market.By 2024, PANJIT had further expanded its third-generation semiconductor portfolio to include silicon carbide (SiC) products, addressing growing demand from AI data centers and next-generation infrastructure applications. With a strong focus on automotive and AI-related medium- and high-voltage DC power solutions, the PANJIT brand has steadily gained recognition in the global market.At the same time, PANJIT continued expanding its global manufacturing footprint while strengthening Taiwan as its core R&D and advanced packaging hub through manufacturing sites in Kaohsiung. To enhance supply chain flexibility amid evolving geopolitical conditions, the company launched a new packaging production line in the Philippines in 2023. In 2025, PANJIT further expanded its global operations by acquiring a 95% stake in TOREX Vietnam Semiconductor Co., Ltd., including its manufacturing facility. These expansions further strengthened production flexibility, regional capacity allocation, and diversified sourcing options for customers worldwide.PANJIT Advancing into New Frontiers to Power the FutureBuilt upon four decades of steady development, PANJIT is now preparing for its next phase by expanding its international product portfolio, advancing technology capabilities, and cultivating global talent resources to further elevate the PANJIT brand worldwide.Looking ahead, Jason Fang identified three key strategic markets for the company's future development: continued expansion across Europe and the United States, deeper operations within China's increasingly self-sufficient semiconductor ecosystem, and broader opportunities in Japan through collaboration with customers, suppliers, and industry partners.Beyond business expansion, Jason and Jeff Fang also hope to build long-term partnerships with organizations that share similar values while supporting the revitalization and future growth of Japanese industry through collaboration and mutual success.Guided by its vision to "Power the Future," PANJIT continues to expand its global brand presence across the Americas, China, and Japan as the company moves confidently toward its next forty years of growth and innovation.PANJIT Group executives and guests from around the world celebrated its 40th anniversary. Credit: PANJIT

As Large Language Model (LLM) reasoning capabilities continue to evolve, AI Agents have officially surpassed passive "Copilots" to become the core of global digital transformation. These agents are now capable of autonomous planning, multi-step execution, and real-time strategic adjustments, marking a shift in how organisations approach digital transformation. According to MarketsandMarkets' "AI Agents Market Report (2025–2030)," the global AI Agent market is projected to experience explosive growth over the next five years, reflecting widespread enterprise adoption.At AI Expo Taiwan 2026, this shift was a central theme across the event, with multiple organisations highlighting agent-based architectures. HCLTech was among those presenting its perspective under the theme "Are You Agent-Native Yet?". The company showcased a suite of solutions tailored for semiconductor manufacturing and financial services aimed at helping enterprises operationalise AI agents and integrate them into core business processes.Commenting on the evolving AI landscape, Terry Tai, Country Leader of HCLTech Taiwan, noted that "under the traditional Copilot model, humans act as coordinators, giving specific instructions via chat interfaces for AI to execute. In the AI Agent era, however, these agents take a high-level objective, autonomously plan, orchestrate tools, and iteratively complete tasks. Humans have transitioned from coordinators to supervisors and are no longer bogged down by tedious intermediate steps.""The real shift comes down to reasoning capability," said Alan Flower, Executive Vice President and Global Head of Cloud and AI Labs at HCLTech. "It's what allows the latest Frontier models to work through complex intermediate steps, with agentic frameworks enabling shared knowledge across the new multi-model, multi-agent solution domain.As organisations move to AI-Native approaches, it's becoming clear that this isn't just a technology change, it's a cultural transformation as organizations re-engineer their core value streams to be augmented and delivered by agentic AI. You need to think about the responsibilities you are prepared to delegate to AI, retain human-in-the-loop, or allow fully autonomous human-on-the-loop approaches. You need to reskill and train your workforce; teach them to assemble teams of AI agents to whom they will delegate work. For example, software engineers now need to describe software, and delegate the coding to agents, not write all of it themselves."Solving Smart Manufacturing Pain Points: HCLTech Kinetic AI.InspectTaiwan's semiconductor and high-tech industries lead the world, yet traditional facility inspections still struggle with high labor costs and significant safety risks. For instance, in a semiconductor wafer fab, engineers can spend considerable time merely complying with gowning and entry protocols before addressing a single device malfunction. These logistical delays represent a significant, yet often overlooked, hidden cost for high-tech manufacturers.HCLTech featured Kinetic AI.Inspect at the expo, a solution specifically designed to address these pain points. HCLTech builds "Hybrid Inspection Fleets" using quadrupeds (robot dogs) and drones, integrated with 3D reality capture and real-time AI analysis. This solution, already deployed by a leading global aircraft manufacturer, has delivered significant results: reducing unplanned downtime by 30%, increasing inspection frequency by 30x, and boosting post-processing productivity by up to 95%.Flower pointed out that with Kinetic AI.Inspect, if a robot dog detects an anomaly, it doesn't just sound an alarm; it can autonomously trigger an ERP system check for spare parts. If no stock is found, it automatically generates a Purchase Order (PO) to initiate the repair process. This Agent-Native flexibility is something traditional, stationary IoT sensors cannot achieve.Tai added that these applications extend across all manufacturing sectors, including steel, petrochemicals, and offshore wind power, where reducing on-site human risk is critical. Many Taiwanese firms expressed strong interest at the event and are currently planning Proof of Concepts (PoC).Implementing Agentic SDLC with HCLTech AI ForceBeyond manufacturing, HCLTech introduced the AI Force platform for the software-heavy tech sector. This platform supports the full Agentic SDLC (Software Development Life Cycle), covering automated requirement documentation, API specification architecture, and code refactoring. Internal benchmarks show a 30% increase in development speed, a 45% boost in testing efficiency, and a 60% acceleration in legacy application modernization. As a TSMC Design Center Alliance (DCA) partner, HCLTech also applies AI to semiconductor R&D, automating specification interpretation and test plan generation to maximize engineering throughput."When you look at the B2B Accounts Payable landscape, the scale is enormous - in Taiwan alone it's worth around USD 215 billion annually. Yet much of it still runs on manual processes, with global Straight-Through Processing rates sitting at just 32.6%," said Tai."What we're seeing is a shift. By applying specialised agents to tasks like data extraction and duplicate payment detection, it's possible to move beyond those constraints. In some cases, STP rates are rising above 80%, invoice processing costs are dropping by more than 60%, and duplicate payments are falling to under 1%."With over 200,000 employees globally, HCLTech operates innovation labs in the US, UK, Germany, India, and Singapore. In late 2025, HCLTech partnered with NVIDIA to launch an AI Lab focused on scaling Physical AI and cognitive robotics for industrial use. By assessing technical maturity and data readiness, HCLTech continues to help enterprises explore and incubate new technology use cases as their primary AI transformation partner.To find out more, please visit HCLTech.HCLTech at AI Expo Taiwan 2026. Credit: HCLTech