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Tuesday 22 September 2026
AT&S Unveils Strategy to Drive AI Growth
Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering key insights into the company's strategic positioning under China's evolving economic framework...
Tuesday 22 September 2026
AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
Critical infrastructure across power generation, petrochemicals, and manufacturing plays a vital role in industrial operations. As equipment ages, ongoing maintenance and safety management become increasingly urgent...
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
Tuesday 22 September 2026
Macronix Secure Memories Build Hardware Defenses for EU CRA
In the fiercely competitive European and global markets, high-end applications such as automotive electronics, industrial control, networking equipment, and AI data centers face increasingly stringent requirements for supply chain transparency and device identity recognition...
Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026
Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing, with a particular focus on its latest Tecnoflon FFKM innovations, at SEMICON Taiwan 2026.
Monday 21 September 2026
GMIF 2026 Agenda Unveiled: Tech Giants on Lineup
On September 23, the 5th Global Memory Innovation Forum (GMIF2026) will convene at the Renaissance Shenzhen Bay Hotel...
Friday 18 September 2026
SK hynix Launches 'SK hynix Ventures' in Silicon Valley
SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of its corporate venture capital (CVC) brand, "SK hynix Ventures," aimed at expanding strategic partnerships within the global AI ecosystem and securing future innovative technologies.
Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement solutions, has introduced a breakthrough GHz-class, massively parallel bandwidth testing technology in collaboration with AUO Corporation...
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment. The next challenge is turning these technologies into scalable, high-yield production.
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY, REDEFINED.," the company showcased a broader switching technology portfolio at booth K3168 and demonstrated its transition from a traditional relay supplier to an advanced switching solution partner.