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Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
LITEON Technology will participate in COMPUTEX 2026, showcasing its AI infrastructure from cloud to edge and 5G. By connecting AI-RAN, intelligent surveillance, and smart city applications, LITEON is accelerating real-world AI adoption. It will also debut an industry leadership panel featuring NVIDIA and Infineon
Thursday 4 June 2026
PEGATRON and maxon Announce Strategic Collaboration at COMPUTEX 2026
PEGATRON Corporation (PEGATRON) announced a strategic collaboration with maxon, the Switzerland-based precision drive technology company. The two companies will jointly develop robotic joint drive technologies, motor modules, and integrated robotic systems. The collaboration will make its public debut at COMPUTEX 2026.At the exhibition, PEGATRON's  second-generation quadruped robot platform, SIMBA II, will integrate maxon's  High Efficiency Joint 90 (HEJ 90) system. PEGATRON said the collaboration focuses on motion control, sensing integration, and edge AI computing for autonomous systems, with the goal of improving robotic mobility and operational stability in complex environments.Headquartered in Switzerland, maxon specializes in precision motors and drive systems. Since its founding in 1961, the company has focused on high-precision electric drive technologies for applications including medical equipment, industrial automation, mobility systems, aerospace, and robotics. The HEJ 90 is a robotic joint module developed by maxon for robotics applications. It integrates the motor, gearbox, and control components into a single compact architecture while delivering high torque output and precise motion control.SIMBA II is PEGATRON's independently developed quadruped robotics platform. Built with a modular architecture, the system supports different sensor configurations and payload modules depending on deployment requirements. The platform also integrates edge AI computing capabilities for applications including smart inspection, industrial site monitoring, autonomous mobility, and AI development. With the integration of HEJ 90, SIMBA II further improves dynamic motion performance and platform stability across complex terrain conditions.PEGATRON stated that as AI, sensing, computing, and precision drive technologies continue to evolve, robotics is becoming an increasingly important direction for next-generation intelligent hardware. The collaboration with maxon also reflects PEGATRON's continued investment in robotics platforms and autonomous system technologies.From platform architecture and key modules to full system manufacturing, PEGATRON aims to build a more flexible and customizable robotics development framework capable of supporting different deployment environments and application requirements.Looking ahead, PEGATRON and maxon will continue expanding their collaboration in robotic drive modules and system development. By combining maxon's expertise in precision drive technologies with PEGATRON's strengths in design and manufacturing services, system development, and production management, the two companies aim to accelerate the adoption of intelligent mobile robots across industrial, commercial, and specialized applications.
Wednesday 3 June 2026
PEGATRON Accelerates the Future of AI Factories at COMPUTEX 2026
PEGATRON, a globally recognized total server solutions provider, today unveiled its next-generation AI infrastructure portfolio and AI factory validation framework at COMPUTEX 2026. Powered by NVIDIA Vera Rubin platform , NVIDIA HGX Rubin NVL8, and NVIDIA RTX PRO Servers, and aligned with the NVIDIA DSX AI factory reference design, Pegatron is advancing how AI factories are designed, validated, and deployed - from digital twin simulation to production-ready infrastructure.As an NVIDIA DSX ecosystem partner, Pegatron is extending AI infrastructure validation beyond traditional manufacturing by integrating SimReady digital twins and AI factory workflows into its server development and deployment process. Through the NVIDIA Omniverse DSX Blueprint Pegatron enables customers to simulate, validate, and optimize rack-scale AI infrastructure before deployment."AI factories require not only high-performance computing, but also end-to-end infrastructure intelligence,"said Gary Cheng, President & CEO of Pegatron."By leveraging NVIDIA DSX architecture, SimReady digital twins, and AI factory validation capabilities, Pegatron has strengthened both its manufacturing operations and AI infrastructure integration expertise. Together with NVIDIA, we aim to help customers simulate, validate, and optimize AI deployments, improving the scalability, reliability, and efficiency of next-generation AI data centers."NVIDIA Vera Rubin NVL72 Rack-Scale AI SupercomputerThe centerpiece of showcase is the NVIDIA Vera Rubin NVL72  Pegatron's RA4803-72N3, a fully liquid-cooled supercomputer built on the third-generation NVIDIA MGX rack design for seamless drop-in deployment into existing Blackwell data centers.Unified Fabric: Integrates 72 NVIDIA Rubin GPUs, 36 NVIDIA Vera CPUs, NVIDIA ConnectX-9 SuperNICs, and NVIDIA BlueField-4 DPUs. It scales up via NVIDIA NVLink 6 and scales out via NVIDIA Quantum-X800 InfiniBand or NVIDIA Spectrum-X Ethernet. Paired with NVIDIA Groq 3 LPX racks, it delivers ultra-fast trillion-parameter inference.TCO Optimization: Trains mixture-of-experts (MoE) models using 1/4th the GPUs, slashes token costs by 10X, and delivers 10X more tokens per megawatt compared to previous Blackwell architectures.NVIDIA Vera CPU: Purpose-built for agentic AI and reinforcement learning, completing workloads 50% faster with twice the efficiency of traditional CPUs.Scaling AI Factories with NVIDIA HGX Rubin NVL8Pegatron also introduced the AS210-2T1-8H3, a 2U fully liquid-cooled server based on NVIDIA HGX Rubin NVL8 with dual NVIDIA Vera CPUs or Intel Xeon 6 processors.The platform leverages NVIDIA Rubin GPUs, NVIDIA NVLink 6, NVIDIA ConnectX-9 SuperNICs, NVIDIA BlueField-4 DPUs, and NVIDIA Spectrum-X Ethernet to accelerate enterprise AI and HPC workloads.To support rack-scale deployments, Pegatron expanded the architecture into: RA4800-64H3 — supporting eight 2U systems per rack, up to 64 GPUs and 16 CPUs. RA4800-72H3 — supporting nine systems, up to 72 GPUs and 18 CPUs within a 48U liquid-cooled rack.Factory-Native NVIDIA DSX Integration and SimReady Digital TwinsBeyond hardware innovation, Pegatron showcased its NVIDIA DSX-aligned AI factory validation workflow, integrating digital twin simulation, thermal analysis, and full-load burn-in testing within the same manufacturing facility.Pegatron's L11 thermal lab combines Ansys Fluent CFD simulation, NVIDIA Omniverse digital twins, liquid cooling analysis, and power modeling to optimize AI factory infrastructure before deployment, while the L12 burn-in room validates every system at 100% TDP against DSX digital twin predictions prior to shipment.Using the NVIDIA AI Factory Digital Twin Pipeline Samples, Pegatron converts engineering data into SimReady OpenUSD assets for NVIDIA Omniverse DSX Blueprint environments, enabling customers to validate cooling, power, and rack-scale AI deployments before installation.Pegatron also highlighted PEGAVERSE, its AI-native manufacturing intelligence platform that combines simulation, factory telemetry, and AI-driven operational analysis to continuously optimize AI factory performance and efficiency.Experience the Future of AI Infrastructure at COMPUTEX 2026Pegatron invites customers, partners, and media representatives to explore its AI infrastructure and DSX-integrated digital twin ecosystem at COMPUTEX 2026.Date: June 2–5, 2026,Location: Taipei Nangang Exhibition Center Hall 1, 4F,Booth: L0104.
Tuesday 2 June 2026
Chenbro debuts its comprehensive rack solutions for AI at COMPUTEX
Leading server chassis manufacturer Chenbro makes a formidable appearance at COMPUTEX 2026 (June 2 to June 5). This year, Chenbro's exhibition flow is strategically designed around three core pillars: Business Development (AI Zone), Product R&D (R&D Zone), and Professional Manufacturing (Manufacturing Zone).The showcase fully highlights Chenbro's comprehensive end-to-end advantages, spanning from precise front-end business alignment and collaborative component design to high-value-added back-end manufacturing services. Furthermore, to address the massive demand fueled by the explosive growth of AI servers, Chenbro is unveiling its newly integrated "Rack Level Solution" for the very first time. Through live physical demonstrations on-site, Chenbro powerfully declares its determination and fruitful milestone achievements as it comprehensively advances into the mechanical components market.Blockbuster Debut: From Server Chassis to Rack Mechanical Integration, Expanding the Innovative Value of AI InfrastructureDriven by the rapid iteration of AI computing architectures, Chenbro officially ventured into the rack mechanical components business last year. Chenbro's CEO stated that industry trends and customer demands have clearly shifted from the "Server Level" to the "Rack Level." Embracing this trend, Chenbro has progressively expanded from traditional chassis to comprehensive rack-level solutions. The physical rack displayed at the exhibition fully demonstrates Chenbro's profound capabilities in mechanical design and manufacturing. With a deep understanding of thermal management technologies (including advanced liquid cooling solutions) and power configuration planning, Chenbro is able to start from the customers' system architecture requirements, translating complex technical demands into optimized mechanical design solutions. By co-developing rack mechanical integration solutions with clients, Chenbro helps accelerate the implementation and deployment of AI infrastructure. The CEO emphasized that amid this technological evolution, Chenbro is no longer solely focused on cost reduction (Cost down); instead, it aims to create higher value (Value up) through system-level collaborative design, truly realizing its strategic vision of becoming a "comprehensive mechanical solution partner."Closely Tracking AI Trends: Heavyweight Exhibition of Next-Generation NVIDIA MGX SolutionsIn the Off-The-Shelf (OTS) exhibition zone, Chenbro leverages modularity as its design foundation, demonstrating highly flexible configuration capabilities that fully cover four major application domains: AI, Cloud, Storage, and Edge computing. As a collaborator of NVIDIA MGX, Chenbro is publicly premiering its 1U NVIDIA Vera Rubin server chassis solution based on NVIDIA MGX, which supports the next-generation architecture. Simultaneously, it is exhibiting a full series of AI chassis products—including 1U, 2U, 4U, and 6U models—developed based on NVIDIA MGX architecture. This powerfully demonstrates Chenbro's top-tier development prowess in satisfying diverse market and customer application needs.Dual Engines of R&D and Smart Manufacturing: Innovative Collaborative Design and the Factory of the FutureTo highlight its ultimate efficiency from R&D to market realization, Chenbro showcases deep technological moats in both its JDM and OEM exhibition zones.Joint Design Manufacturing (JDM): The company displays high-U-count AI servers co-developed with clients, alongside a 21-inch chassis series compliant with OCP ORV3 specifications. By sharing its proprietary JPDP (Joint Product Design Process) and DFM (Design for Manufacturing) optimization mindsets, combined with tolerance analysis and around-the-clock technical services, Chenbro significantly enhances client collaboration efficiency and product stability.Original Equipment Manufacturing (OEM): This zone centers on "Chenbro's Factory of the Future," comprehensively introducing digital and automation technologies. By integrating big data analysis, AI, IoT, robotic arms, and AMR (Autonomous Mobile Robots), the exhibit perfectly demonstrates consistency in product quality and the maximized efficiency of its global localized production.Joining Forces: Building a Win-Win AI Server EcosystemAt this year's COMPUTEX, numerous leading global technology giants are also showcasing AI servers co-developed with Chenbro, fully validating Chenbro's pivotal position in the industry. CEO Corona Chen further pointed out that Chenbro will continue to deepen its partnerships with global CPU/GPU chip companies —such as NVIDIA, AMD, Intel, and Ampere—as well as its core clients, investing heavily in the R&D and manufacturing of next-generation high-end servers. Chenbro will keep exploring the blueprint driving the future of AI, committing to satisfying the diverse application demands of global data centers, and jointly creating a mutually beneficial and prosperous industry ecosystem.For more information , please visit.