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Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
LITEON Technology will participate in COMPUTEX 2026, showcasing its AI infrastructure from cloud to edge and 5G. By connecting AI-RAN, intelligent surveillance, and smart city applications, LITEON is accelerating real-world AI adoption. It will also debut an industry leadership panel featuring NVIDIA and Infineon
Wednesday 3 June 2026
PEGATRON Accelerates the Future of AI Factories at COMPUTEX 2026
PEGATRON, a globally recognized total server solutions provider, today unveiled its next-generation AI infrastructure portfolio and AI factory validation framework at COMPUTEX 2026. Powered by NVIDIA Vera Rubin platform , NVIDIA HGX Rubin NVL8, and NVIDIA RTX PRO Servers, and aligned with the NVIDIA DSX AI factory reference design, Pegatron is advancing how AI factories are designed, validated, and deployed - from digital twin simulation to production-ready infrastructure.As an NVIDIA DSX ecosystem partner, Pegatron is extending AI infrastructure validation beyond traditional manufacturing by integrating SimReady digital twins and AI factory workflows into its server development and deployment process. Through the NVIDIA Omniverse DSX Blueprint Pegatron enables customers to simulate, validate, and optimize rack-scale AI infrastructure before deployment."AI factories require not only high-performance computing, but also end-to-end infrastructure intelligence,"said Gary Cheng, President & CEO of Pegatron."By leveraging NVIDIA DSX architecture, SimReady digital twins, and AI factory validation capabilities, Pegatron has strengthened both its manufacturing operations and AI infrastructure integration expertise. Together with NVIDIA, we aim to help customers simulate, validate, and optimize AI deployments, improving the scalability, reliability, and efficiency of next-generation AI data centers."NVIDIA Vera Rubin NVL72 Rack-Scale AI SupercomputerThe centerpiece of showcase is the NVIDIA Vera Rubin NVL72  Pegatron's RA4803-72N3, a fully liquid-cooled supercomputer built on the third-generation NVIDIA MGX rack design for seamless drop-in deployment into existing Blackwell data centers.Unified Fabric: Integrates 72 NVIDIA Rubin GPUs, 36 NVIDIA Vera CPUs, NVIDIA ConnectX-9 SuperNICs, and NVIDIA BlueField-4 DPUs. It scales up via NVIDIA NVLink 6 and scales out via NVIDIA Quantum-X800 InfiniBand or NVIDIA Spectrum-X Ethernet. Paired with NVIDIA Groq 3 LPX racks, it delivers ultra-fast trillion-parameter inference.TCO Optimization: Trains mixture-of-experts (MoE) models using 1/4th the GPUs, slashes token costs by 10X, and delivers 10X more tokens per megawatt compared to previous Blackwell architectures.NVIDIA Vera CPU: Purpose-built for agentic AI and reinforcement learning, completing workloads 50% faster with twice the efficiency of traditional CPUs.Scaling AI Factories with NVIDIA HGX Rubin NVL8Pegatron also introduced the AS210-2T1-8H3, a 2U fully liquid-cooled server based on NVIDIA HGX Rubin NVL8 with dual NVIDIA Vera CPUs or Intel Xeon 6 processors.The platform leverages NVIDIA Rubin GPUs, NVIDIA NVLink 6, NVIDIA ConnectX-9 SuperNICs, NVIDIA BlueField-4 DPUs, and NVIDIA Spectrum-X Ethernet to accelerate enterprise AI and HPC workloads.To support rack-scale deployments, Pegatron expanded the architecture into: RA4800-64H3 — supporting eight 2U systems per rack, up to 64 GPUs and 16 CPUs. RA4800-72H3 — supporting nine systems, up to 72 GPUs and 18 CPUs within a 48U liquid-cooled rack.Factory-Native NVIDIA DSX Integration and SimReady Digital TwinsBeyond hardware innovation, Pegatron showcased its NVIDIA DSX-aligned AI factory validation workflow, integrating digital twin simulation, thermal analysis, and full-load burn-in testing within the same manufacturing facility.Pegatron's L11 thermal lab combines Ansys Fluent CFD simulation, NVIDIA Omniverse digital twins, liquid cooling analysis, and power modeling to optimize AI factory infrastructure before deployment, while the L12 burn-in room validates every system at 100% TDP against DSX digital twin predictions prior to shipment.Using the NVIDIA AI Factory Digital Twin Pipeline Samples, Pegatron converts engineering data into SimReady OpenUSD assets for NVIDIA Omniverse DSX Blueprint environments, enabling customers to validate cooling, power, and rack-scale AI deployments before installation.Pegatron also highlighted PEGAVERSE, its AI-native manufacturing intelligence platform that combines simulation, factory telemetry, and AI-driven operational analysis to continuously optimize AI factory performance and efficiency.Experience the Future of AI Infrastructure at COMPUTEX 2026Pegatron invites customers, partners, and media representatives to explore its AI infrastructure and DSX-integrated digital twin ecosystem at COMPUTEX 2026.Date: June 2–5, 2026,Location: Taipei Nangang Exhibition Center Hall 1, 4F,Booth: L0104.
Tuesday 2 June 2026
Chenbro debuts its comprehensive rack solutions for AI at COMPUTEX
Leading server chassis manufacturer Chenbro makes a formidable appearance at COMPUTEX 2026 (June 2 to June 5). This year, Chenbro's exhibition flow is strategically designed around three core pillars: Business Development (AI Zone), Product R&D (R&D Zone), and Professional Manufacturing (Manufacturing Zone).The showcase fully highlights Chenbro's comprehensive end-to-end advantages, spanning from precise front-end business alignment and collaborative component design to high-value-added back-end manufacturing services. Furthermore, to address the massive demand fueled by the explosive growth of AI servers, Chenbro is unveiling its newly integrated "Rack Level Solution" for the very first time. Through live physical demonstrations on-site, Chenbro powerfully declares its determination and fruitful milestone achievements as it comprehensively advances into the mechanical components market.Blockbuster Debut: From Server Chassis to Rack Mechanical Integration, Expanding the Innovative Value of AI InfrastructureDriven by the rapid iteration of AI computing architectures, Chenbro officially ventured into the rack mechanical components business last year. Chenbro's CEO stated that industry trends and customer demands have clearly shifted from the "Server Level" to the "Rack Level." Embracing this trend, Chenbro has progressively expanded from traditional chassis to comprehensive rack-level solutions. The physical rack displayed at the exhibition fully demonstrates Chenbro's profound capabilities in mechanical design and manufacturing. With a deep understanding of thermal management technologies (including advanced liquid cooling solutions) and power configuration planning, Chenbro is able to start from the customers' system architecture requirements, translating complex technical demands into optimized mechanical design solutions. By co-developing rack mechanical integration solutions with clients, Chenbro helps accelerate the implementation and deployment of AI infrastructure. The CEO emphasized that amid this technological evolution, Chenbro is no longer solely focused on cost reduction (Cost down); instead, it aims to create higher value (Value up) through system-level collaborative design, truly realizing its strategic vision of becoming a "comprehensive mechanical solution partner."Closely Tracking AI Trends: Heavyweight Exhibition of Next-Generation NVIDIA MGX SolutionsIn the Off-The-Shelf (OTS) exhibition zone, Chenbro leverages modularity as its design foundation, demonstrating highly flexible configuration capabilities that fully cover four major application domains: AI, Cloud, Storage, and Edge computing. As a collaborator of NVIDIA MGX, Chenbro is publicly premiering its 1U NVIDIA Vera Rubin server chassis solution based on NVIDIA MGX, which supports the next-generation architecture. Simultaneously, it is exhibiting a full series of AI chassis products—including 1U, 2U, 4U, and 6U models—developed based on NVIDIA MGX architecture. This powerfully demonstrates Chenbro's top-tier development prowess in satisfying diverse market and customer application needs.Dual Engines of R&D and Smart Manufacturing: Innovative Collaborative Design and the Factory of the FutureTo highlight its ultimate efficiency from R&D to market realization, Chenbro showcases deep technological moats in both its JDM and OEM exhibition zones.Joint Design Manufacturing (JDM): The company displays high-U-count AI servers co-developed with clients, alongside a 21-inch chassis series compliant with OCP ORV3 specifications. By sharing its proprietary JPDP (Joint Product Design Process) and DFM (Design for Manufacturing) optimization mindsets, combined with tolerance analysis and around-the-clock technical services, Chenbro significantly enhances client collaboration efficiency and product stability.Original Equipment Manufacturing (OEM): This zone centers on "Chenbro's Factory of the Future," comprehensively introducing digital and automation technologies. By integrating big data analysis, AI, IoT, robotic arms, and AMR (Autonomous Mobile Robots), the exhibit perfectly demonstrates consistency in product quality and the maximized efficiency of its global localized production.Joining Forces: Building a Win-Win AI Server EcosystemAt this year's COMPUTEX, numerous leading global technology giants are also showcasing AI servers co-developed with Chenbro, fully validating Chenbro's pivotal position in the industry. CEO Corona Chen further pointed out that Chenbro will continue to deepen its partnerships with global CPU/GPU chip companies —such as NVIDIA, AMD, Intel, and Ampere—as well as its core clients, investing heavily in the R&D and manufacturing of next-generation high-end servers. Chenbro will keep exploring the blueprint driving the future of AI, committing to satisfying the diverse application demands of global data centers, and jointly creating a mutually beneficial and prosperous industry ecosystem.For more information , please visit.
Tuesday 2 June 2026
PEGATRON Showcases AI Tech Maker Strategy at COMPUTEX 2026
PEGATRON Corporation ("PEGATRON") returns to COMPUTEX 2026 in Taipei for the second consecutive year. As a Tech Maker, the company integrates R&D, design, and manufacturing to help customers turn emerging technologies into production-ready products.AI is expanding beyond model training into enterprise and industrial applications. This shift shows that customers need not only computing performance, but also system integration, deployment flexibility, and long-term reliability. Through its AI Tech Maker strategy, PEGATRON turns compute, connectivity, sensing, and product design into deployable systems. PEGATRON will highlight three product areas in Computex: AI infrastructure for AI factories and high-performance computing; edge and industrial AI for manufacturing and communications; and physical AI platforms spanning robotics, drones, intelligent vehicles, and smart devices.Building AI Infrastructure for AI Factory and High-Performance ComputingLarge-scale AI deployment is driving new requirements for computing performance, networking bandwidth, thermal management, and system integration.At COMPUTEX 2026, PEGATRON presents a next-generation AI infrastructure portfolio that includes NVIDIA Vera Rubin NVL72, NVIDIA HGX Rubin NVL8, NVIDIA RTX PRO Server, and AMD Instinct MI355X and MI350P GPU server platforms. The solutions support enterprises and cloud service providers building next-generation AI Factory and high-performance computing environments.PEGATRON also showcases 400G, 800G, and 1.6T AI infrastructure switches designed for large-scale AI training and inference workloads requiring high-speed, low-latency data transmission. Open data center solutions compliant with Open Compute Project (OCP) standards are presented to improve scalability, deployment flexibility, and energy efficiency.The portfolio further integrates GPU servers, AI networking, liquid cooling, and full-rack system integration. This approach expands PEGATRON's role from hardware manufacturing toward comprehensive AI infrastructure platform deployment, helping customers shorten implementation cycles for generative AI, agentic AI, and enterprise AI applications.Bringing AI from Digital Twins to Edge ConnectivityAt the industrial AI layer, PEGATRON presents its PEGAVERSE portfolio, a smart manufacturing platform built around digital twins and agentic AI. The portfolio includes ARCHITECT for site planning, YODA for engineering knowledge training, and JEDI for intelligent manufacturing processes. These applications translate PEGATRON's manufacturing experience into repeatable and deliverable industrial AI offerings.In communications and edge AI, PEGATRON showcases next-generation 5G equipment, AI-RAN concepts, Wi-Fi 7 modules, and 6G antennas. The company is also integrating radio units (RUs) with NVIDIA DGX Spark, reflecting the growing convergence of AI compute and communications infrastructure.PEGATRON also presents its Scalable Central Computing Rack (SCCR) for smart mobility. As a vehicle central computing platform, SCCR integrates IVI, gateway, and ADAS functions, addressing the industry shift from distributed vehicle electronics toward centralized architectures and extending edge computing into mobility systems.Expanding Physical AI Across Ground and Aerial PlatformsAI is moving from data centers into physical environments, where autonomous systems must combine sensing, compute, and motion control to operate reliably in complex conditions. At COMPUTEX 2026, PEGATRON presents ground robot and aerial drone platforms that bring physical AI into mobility systems.SIMBA II, PEGATRON's next-generation quadruped robot platform, combines power electronics, mechanical design, sensing systems, and edge AI computing for inspection, monitoring, and automation tasks. Developed with Swiss precision drive specialist maxon, the platform integrates the HEJ 90 high-performance joint system to improve motion control and stability, while supporting real-time environment recognition and autonomous navigation.The G720 SOM+EVK and AI Companion Computer extend PEGATRON's edge computing and visual perception technologies to intelligent drone platforms. Built on MediaTek's MT8391 platform, they support ROS2 and MAVLink integration with flight control systems and mission workflows, enabling navigation, sensing, and real-time image processing. Vision perception and multi-camera imaging modules further support obstacle avoidance and environmental interpretation.Through its ground and aerial platforms, PEGATRON brings AI compute, sensing, and autonomous control into physical mobility systems, turning related technologies into deployable products.Bringing AI and Design into Smart Endpoint DevicesIn smart devices and user experience, PEGATRON applies its DMS model to combine industrial design, engineering, materials, and manufacturing into the product development process. The M16P Optimus modular laptop uses a modular architecture for key components such as the motherboard, I/O, keyboard, battery, and storage. The design allows flexible configuration based on customer requirements and supports easier maintenance, faster customization, and future platform upgrades.The award-winning Armo Emotion Sensing Game Handle brings sensing technology into interactive applications. It integrates heart rate, electrodermal activity, and temperature sensing to analyze physiological signals and adapt gameplay based on user conditions.In personal care, the PRIIo product line extends PEGATRON's design capabilities into everyday consumer applications. The products combine electronic control, sensing technology, and industrial design for facial and scalp care scenarios.PEGATRON said AI development is shifting from technology-led progress toward practical use. The key is turning innovation into products and systems that can operate reliably over time. The company will continue strengthening its productization and integration capabilities while working with global partners to support technology adoption across different environments.PEGATRON's COMPUTEX 2026 booth is located at L0104, 4F, Taipei Nangang Exhibition Center, Hall 1. Professional guided tours will be available during the show.