As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation technologies, from enterprise data centers (EDCs) and AI PCs to the Internet of Things (IoT) and 6G communications, require unprecedented bandwidth. However, as data rates climb, ensuring signal integrity during semiconductor testing becomes exponentially more difficult. Even slight impedance mismatches or signal degradation can trigger false failures, compromise yields and delay critical product launches.To address these fundamental industry challenges, Smiths Interconnect, a Molex company, has introduced the DaVinci Gen V test socket. Built upon a patented mechanical foundation, this fifth-generation coaxial test socket provides an out-of-the-box solution engineered to overcome impedance tuning and signal degradation hurdles. The product rigorously tests semiconductor chips during manufacturing to ensure they deliver ultra-reliable, lab-grade accuracy in high-volume production environments.Core Mechanical InnovationsThe performance of the DaVinci Gen V is rooted in its core mechanical innovations. A new signal cavity design allows for superior impedance control, establishing a cleaner and more reliable signal path. This is achieved through enhanced conductor-to-ground concentricity, which minimizes signal degradation and surpasses all previous DaVinci series models. The socket utilizes spring probe technology featuring a homogeneous alloy plated with gold to ensure better grounding. These precision probes deliver a consistent, stable contact resistance averaging as low as 33 milliohms and boast a long contact life that has been tested up to 500,000 insertions.Electrical Performance and Signal IntegrityThe electrical performance of the DaVinci Gen V sets a new benchmark for semiconductor validation. Designed to overcome the physical challenge of scaling impedance for next-generation chips, the socket supports staggering digital speeds. It enables unprecedented signaling speeds of up to 224Gbps PAM-4 for AI accelerators and speeds beyond 100 GHz for future 6G networks.In terms of RF characteristics, the DaVinci Gen V delivers a bandwidth greater than 84 GHz at a -1 dB insertion loss. The architecture utilizes a short signal path with a 4.90mm test height and the impedance can be precisely tuned to match the system or be defined as needed.Operational and Manufacturing AdvantagesBeyond raw speed, the DaVinci Gen V is engineered for streamlined, scalable manufacturing. The socket accommodates high co-planarity and features a tri-temp design capable of operating in extreme environments ranging from -55°C to 150°C. This robust mechanical performance ensures that the exact same socket can be utilized across manual test, bench test and high-volume manufacturing production test stages, guaranteeing consistency.Recognizing that modern integrated circuits are rapidly growing in complexity and size, the DaVinci Gen V was designed to easily accommodate an increase in next-generation ASIC (application specific integrated circuit) sizes. Despite this scalability, it maintains full compatibility with existing test hardware and PCB socket footprints. This backward compatibility allows manufacturers to transition effortlessly, saving costs, reducing development cycles and significantly accelerating time-to-market. The socket is also highly serviceable in the field, permitting the replacement of a single probe or the full array, and can be cleaned while the system is running using a cleaning surrogate.Target End Markets and Proven ApplicationsThe broad capabilities of the DaVinci Gen V make it well suited for a wide range of advanced semiconductor applications. Target end markets include data center processors such as CPUs and GPUs, AI accelerators and ASICs, high-performance computing and tensor processors, network switches and FPGA-based 224G SerDes devices, as well as autonomous vehicle and ADAS chips. As demand for higher bandwidth and faster data processing continues to grow, these applications require increasingly stringent testing accuracy and signal integrity performance.Its effectiveness in high-stakes, high-volume environments is already proven. Since the product's launch, Smiths Interconnect has secured a key program with a leading technology company to support their advanced AI GPU accelerator chips.Building on this initial success, the company was subsequently awarded a next-generation accelerator chip program with the same partner. This continued partnership  underscores the superior performance, innovation, and reliability of Smiths Interconnect’s test socket technology.The DaVinci Gen V test socket redefines high-speed semiconductor testing by combining advanced, patented insulated metal technology with precision impedance tuning. It effectively eliminates measurement errors while guaranteeing lab-grade accuracy and repeatability in robust production settings. By enabling the reliable validation of high-bandwidth devices, the DaVinci Gen V ensures that manufacturers are fully equipped to meet the performance demands and future-readiness requirements of tomorrow's most complex integrated circuits. Contact Smiths Interconnect  to learn more.DaVinci Gen V supports AI accelerators, GPUs and data center processors. Credit: Smiths Interconnect

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers.DIN-Rail Computers Zone: The Premier Solution for Machine VisionThe Machine Computing - MAGNET product line is engineered for machine vision. The flagship MD-3000 series of high-performance, scalable DIN-rail computers, and winner of the 2026 iF Design Award, will be on display, with live demonstrations of its highly modular system configuration and application flexibility. At just 150 mm in height, the MD-3000 Series fits seamlessly into production-line control cabinets. Powered by Intel Core desktop-class CPUs and supporting up to 96GB of DDR5 memory and dual NVMe SSDs, it effortlessly handles the high-speed image processing and storage demands of machine vision applications. The modular expansion architecture supports 2-, 4-, or 6-slot expansion decks for flexible addition of I/O interfaces, storage, and wireless modules. Wide temperature and wide voltage support, along with EN 61000-6-2/6-4 industrial EMC compliance, ensure stable operation even in high-interference environments.Industrial Panel PCs and Monitors Zone: Industrial HMI Blending Aesthetics and PerformanceThe Display Computing - CRYSTAL product line offers a diverse range of models with comprehensive options for computing performance, screen sizes, display ratios, and touch technologies. Applications span harsh indoor industrial environments, high-brightness outdoor settings, and open-frame installations for seamless equipment integration. Across the entire lineup, industrial-grade materials, wide temperature and wide voltage designs, and up to IP66-rated front panel protection provide reliable HMI solutions for demanding environments. The highlight is the new ultra-slim bezel industrial panel PC, the CV-200 Series, featuring a ≤ 3 mm ultra-thin bezel, Full HD resolution, a 178 degrees wide viewing angle, and anti-glare treatment, making it an ideal solution for efficient human-machine interaction and intelligent management in modern automated factories.GPU Embedded Computers Zone Meeting Every Level of Edge AI Demand. Credit: Cincoze Rugged Embedded Computers Zone: Solid Foundation for Diverse Harsh EnvironmentsThe Rugged Computing - DIAMOND product line is purpose-built for harsh industrial environments. Its six product series share core rugged standards, including wide temperature range, wide voltage input, and industrial-grade protection, and the entire lineup carries UL safety certification for internationally recognized reliability and safety. Customers can select the right model based on computing performance, expandability, form factor, power consumption, and industry certification requirements. The DX-1300 Series, the newest model launched in 2026, is a high-performance compact embedded computer that supports an Intel Arrow Lake-S Core Ultra 200S processor in a compact 242×173×75 mm chassis, making it easy to deploy in space-constrained environments for complex Edge AI workloads. The DX-1300 Series also offers extensive expansion capabilities, including diverse I/O options and built-in M.2 B/E Key slots, supporting equipment integration, data acquisition, and wireless communication.GPU Embedded Computers Zone: Meeting Every Level of Edge AI DemandThe GPU Computing -  GOLD product line features three series, each designed to meet a different tier of AI application needs. The GJ Series targets entry-level, Light AI applications, featuring NVIDIA Jetson SoM GPUs for low power consumption and efficient AI acceleration. The GM Series, which supports MXM GPU modules, is a popular choice for Medium AI and Edge AI applications. On display is the award-winning GM-1100 Series, recipient of the 2025 Red Dot Design Award and the 2026 Taiwan Excellence Award, combining powerful CPU and GPU performance, a compact form factor, and outstanding environmental adaptability for autonomous mobile equipment, automotive AI, and image recognition applications. The flagship GP Series supports up to two 300W high-end GPU cards and features three patented technologies for thermal management, expansion, and locking mechanisms, making it the top choice for Heavy AI applications. For more information, please visit www.cincoze.com, or contact us by email: info@cincoze.com. Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026. Credit: Cincoze

DATOTEK INTERNATIONAL CO., LTD., a Taiwan-based memory and storage manufacturer, showcased its latest AI-powered sustainable storage solutions and AI infrastructure technologies at COMPUTEX 2026 in Taipei under the exhibition theme "AI Together." The company presented a comprehensive portfolio of AI storage, edge AI computing, PCIe Gen5 SSD thermal management, USB4 portable SSDs, and next-generation memory products designed for both enterprise and consumer markets.As artificial intelligence continues to reshape global business, content creation, gaming, and digital workflows, storage has become a critical foundation of AI infrastructure. At COMPUTEX 2026, DATOTEK demonstrated how intelligent storage, AI-assisted data management, advanced cooling solutions, and sustainable product development can support the next generation of AI computing and intelligent storage innovation.Explore QTARS, our premium edge AI-assisted portable storage. Credit: Datotek Inc.AI Storage Solutions for Edge AI Computing and Intelligent Data ManagementAt Booth I1124 in the Component and Advanced Power Technology Zone, DATOTEK introduced the AI QTARS and AI QUASAR MagSafe Portable SSDs, two AI-powered storage solutions designed to bring intelligent data processing directly to users through edge AI computing. The devices integrate Generative AI applications, Retrieval-Augmented Generation (RAG) intelligent search, AI knowledge retrieval, multi-factor data encryption, S.M.A.R.T. 2.0 drive health monitoring, and intelligent document management.By combining AI-assisted workflows with high-speed USB4 connectivity, users can summarize documents, organize digital assets, retrieve information, and manage data with greater privacy, efficiency, and control. These portable SSDs are positioned for enterprise customers, system integrators, technology partners, creators, and mobile professionals seeking practical AI storage solutions for modern business and creative environments.The AI QTARS and AI QUASAR Portable SSDs also combine secure MagSafe-compatible attachment technology with a clean silver-white minimalist design, creating a storage platform that is both functional and accessible. This combination strengthens their appeal for buyers searching for AI portable SSD, USB4 SSD, edge AI storage, and smart external storage solutions.Advanced PCIe Gen5 Thermal Solutions for AI InfrastructureAs AI workloads continue to expand across data-intensive environments, thermal management has become essential for maintaining SSD reliability and performance. At COMPUTEX 2026, DATOTEK showcased the AEROFIN PCIe Gen5 SSD Active Cooling System, an advanced thermal solution engineered for AI workstations, high-performance gaming systems, content creation platforms, and enterprise computing environments.The AEROFIN solution combines an ultra-slim active cooling architecture, a high-density skived-fin heatsink design, and precision micro cooling fan technology to improve thermal dissipation efficiency. By minimizing thermal throttling and maintaining stable SSD performance under sustained workloads, AEROFIN helps enhance long-term stability, system reliability, and storage efficiency.For buyers searching for PCIe Gen5 SSD cooling solutions, Gen5 thermal management, AI workstation hardware, and enterprise storage infrastructure, AEROFIN delivers a compelling answer designed for the AI era. It also supports DATOTEK's positioning as a provider of performance-driven, sustainable hardware innovation.ARES Q4+ USB4 Portable SSD designed for professional creators. Credit: Datotek Inc.USB4 Portable SSD Designed for Professional CreatorsAt Booth L2006 in the Taiwan Excellence Pavilion, DATOTEK presented the ARES Q4+ USB4 Portable SSD, a premium high-speed storage solution for professional creators, videographers, photographers, and mobile professionals. Powered by USB4 Gen3x2, the ARES Q4+ delivers transfer speeds of up to 4,000 MB/s and is optimized for 4K and 8K video production, direct recording workflows, fast backup operations, and cross-platform content creation.The device features a durable aluminum alloy enclosure for structural protection and efficient heat dissipation, while its MagSafe-compatible magnetic attachment system improves convenience for mobile workflows. This makes the ARES Q4+ especially relevant for users and buyers searching for USB4 portable SSD, high-speed external SSD, creator storage, and MagSafe SSD solutions.As AI-assisted content creation becomes increasingly common, portable high-speed storage solutions remain essential for professionals seeking fast, reliable, and secure data management. The ARES Q4+ aligns with both B2B procurement needs and B2C premium product demand across international markets.DATO microSD cards deliver high-speed storage for gaming and mobile devices. Credit: Datotek Inc.High-Speed Memory Solutions for Gaming and Mobile DevicesAt Booth R0902 in the SD Association Pavilion, DATOTEK showcased its professional-grade microSD memory card portfolio for gaming, drones, smartphones, action cameras, and professional imaging devices. The microSD Express Card is built on PCIe Gen3x1 and NVMe architecture, delivering read and write speeds of up to 800 MB/s and 700 MB/s while maintaining backward compatibility with UHS-I devices.The microSD Advance+ Card supports capacities from 128GB to 1.5TB and complies with UHS-I U3 and V30 standards, making it suitable for 4K video recording, mobile content creation, drone applications, and professional photography. The microSD Lightning Card supports UHS-II technology and V60 video performance, delivering read speeds of up to 280 MB/s and write speeds of up to 180 MB/s for professional cameras, handheld gaming systems, and demanding multimedia workflows.Together, these products strengthen DATOTEK's visibility in search queries related to microSD Express, high-speed memory card, gaming storage, and mobile storage solutions. They also provide a broader product story that connects performance, portability, and application diversity.Sustainable AI Computing and the Future of Intelligent StorageBeyond performance innovation, sustainability remains a core pillar of DATOTEK's long-term strategy. The company continues to advance green supply chain initiatives, environmentally responsible product development, intelligent cooling innovation, and sustainable manufacturing practices throughout its memory and storage portfolio.As AI adoption accelerates worldwide, DATOTEK believes future storage technologies must be faster, smarter, more energy-efficient, and more environmentally responsible. By integrating AI-powered storage solutions with sustainable computing principles, the company is helping build a smarter and more sustainable digital future.AI Together: Accelerating Global Digital TransformationCOMPUTEX 2026 highlighted how collaboration across AI, storage, computing, and sustainability ecosystems can accelerate innovation worldwide. Guided by its core philosophy of Technology Innovation and Sustainable Development, DATOTEK remains committed to advancing AI-powered storage, intelligent memory technologies, enterprise AI infrastructure, and next-generation computing solutions.From AI portable SSDs and PCIe Gen5 thermal management systems to USB4 storage solutions and high-performance memory products, DATOTEK continues to empower creators, gamers, enterprises, distributors, and technology partners worldwide to unlock the full potential of the AI era. Visitors seeking AI-powered storage solutions, sustainable AI infrastructure, enterprise storage technologies, and next-generation memory products are invited to explore DATOTEK's innovations and discover how the company is shaping the future of intelligent storage. For more information, please visit Datotek Official Website and Datotek Facebook Page.