DEEPX ensures unmatched AI reliability with lower power, lower heat, and a total cost of ownership lower than even "free" chips.For Lokwon Kim, founder and CEO of DEEPX, this isn't just an ambition—it's a foundational requirement for the AI era. A veteran chip engineer who once led advanced silicon development at Apple, Broadcom, and Cisco, Kim sees the coming decade as a defining moment to push the boundaries of technology and shape the future of AI. While others play pricing games, Kim is focused on building what the next era demands: AI systems that are truly reliable."This white paper," Kim says, holding up a recently published technology report, "isn't about bragging rights. It's about proving that what we're building actually solves the real-world challenges faced by factories, cities, and robots—right now."Credit: DEEPXA new class of reliability for AI systemsWhile GPGPUs continue to dominate cloud-based AI training, Kim argues that the true era of AI begins not in server racks, but in the everyday devices people actually use. From smart cameras and robots to kiosks and industrial sensors, AI must be embedded where life happens—close to the user, and always on.And because these devices operate in power-constrained, fanless, and sometimes battery-driven environments, low power isn't a preference—it's a hard requirement. Cloud-bound GPUs are too big, too hot, and too power-hungry to meet this reality. On-device AI demands silicon that is lean, efficient, and reliable enough to run continuously—without overheating, without delay, and without failure."You can't afford to lose a single frame in a smart camera, miss a barcode in a warehouse, or stall a robot on an assembly line," Kim explains. "These moments define success or failure."GPGPU-based and many NPU competitor systems fail this test. With high power draw, significant heat generation, the need for active cooling, and cloud latency issues, they are fundamentally ill-suited for the always-on, low-power edge. In contrast, DEEPX's DX-M1 runs under 3W, stays below 80°C with no fan, and delivers GPU-class inference accuracy with zero latency dependency.Under identical test conditions, the DX-M1 outperformed competing NPUs by up to 84%, while maintaining 38.9°C lower operating temperatures, and being 4.3× smaller in die size.This is made possible by rejecting the brute-force SRAM-heavy approach and instead using a lean, on-chip SRAM + LPDDR5 DRAM architecture that enables:• Higher manufacturing yield• Lower field failure rates• Elimination of PCIe bottlenecks• 100+ FPS inference even on small embedded boardsDEEPX also developed its own quantization pipeline, IQ8™, preserving <1% accuracy loss across 170+ models."We've proven you can dramatically reduce power and memory without sacrificing output quality," Kim says.Credit: DEEPXReal customers. Real deployments. Real impact.Kim uses a powerful metaphor to describe the company's strategic position."If cloud AI is a deep ocean ruled by GPGPU-powered ships, then on-device AI is the shallow sea—close to land, full of opportunities, and hard to navigate with heavy hardware."GPGPU, he argues, is structurally unsuited to play in this space. Their business model and product architecture are simply too heavy to pivot to low-power, high-flexibility edge scenarios."They're like battleships," Kim says. "We're speedboats—faster, more agile, and able to handle 50 design changes while they do one."DEEPX isn't building in a vacuum. The DX-M1 is already being validated by major companies like Hyundai Robotics Lab, POSCO DX and LG Uplus, which rejected GPGPU-based designs due to energy, cost, and cooling concerns. The companies found that even "free" chips resulted in a higher total cost of ownership (TCO) than the DX-M1—once you add electricity bills, cooling systems, and field failure risks.According to Kim, "Some of our collaborations realized that switching to DX-M1 saves up to 94% in power and cooling costs over five years. And that savings scales exponentially when you deploy millions of devices."Building on this momentum, DEEPX is now entering full-scale mass production of the DX-M1, its first-generation NPU built on a cutting-edge 5nm process. Unlike many competitors still relying on 10–20nm nodes, DEEPX has achieved an industry-leading 90% yield at 5nm, setting the stage for dominant performance, efficiency, and scalability in the edge AI market.Looking beyond current deployments, DEEPX is now developing its next-generation chip, the DX-M2—a groundbreaking on-device AI processor designed to run LLMs under 5W. As large language model technology evolves, the field is beginning to split in two directions: one track continues to scale up LLMs in cloud data centers in pursuit of AGI; the other, more practical path focuses on lightweight, efficient models optimized for local inference—such as DeepSeek and Meta's LLaMA 4. DEEPX's DX-M2 is purpose-built for this second future.With ultra-low power consumption, high performance, and a silicon architecture tailored for real-world deployment, the DX-M2 will support LLMs like DeepSeek and LLaMA 4 directly at the edge—no cloud dependency required. Most notably, DX-M2 is being developed to become the first AI inference chip built on the leading-edge 2nm process—marking a new era of performance-per-watt leadership. In short, DX-M2 isn't just about running LLMs efficiently—it's about unlocking the next stage of intelligent devices, fully autonomous and truly local.Credit: DEEPXIf ARM defined the mobile era, DEEPX will define the AI EraLooking ahead, Kim positions DEEPX not as a challenger to cloud chip giants, but as the foundational platform for the AI edge—just as ARM once was for mobile."We're not chasing the cloud," he says. "We're building the stack that powers AI where it actually interacts with the real world—at the edge."In the 1990s, ARM changed the trajectory of computing by creating power-efficient, always-on architectures for mobile devices. That shift didn't just enable smartphones—it redefined how and where computing happens."History repeats itself," Kim says. "Just as ARM silently powered the mobile revolution, DEEPX is quietly laying the groundwork for the AI revolution—starting from the edge."His 10-year vision is bold: to make DEEPX the "next ARM" of AI systems, enabling AI to live in the real world—not the cloud. From autonomous robots and smart city kiosks to factory lines and security systems, DEEPX aims to become the default infrastructure where AI must run reliably, locally, and on minimal power.Everyone keeps asking about the IPO. Here's what Kim really thinks.With DEEPX gaining attention as South Korea's most promising AI semiconductor company, one question keeps coming up: When's the IPO? But for founder and CEO Lokwon Kim, the answer is clear—and measured."Going public isn't the objective itself—it's a strategic step we'll take when it aligns with our vision for sustainable success." Kim says. "Our real focus is building proof—reliable products, real deployments, actual revenue. A unicorn company is one that earns its valuation through execution—especially in semiconductors, where expectations are unforgiving. The bar is high, and we intend to meet it."That milestone, Kim asserts, is no longer far away. In other words, DEEPX isn't rushing for headlines—it's building for history. DEEPX isn't just designing chips—it's designing trust.In an AI-powered world where milliseconds can mean millions, reliability is everything. As AI moves from cloud to edge, from theory to infrastructure, the companies that will define the next decade aren't those chasing faster clocks—but those building systems that never fail."We're not here to ride a trend," Kim concludes. "We're here to solve the hardest problems—the ones that actually matter."Credit: DEEPXWhen Reliability Matters Most—Industry Leaders Choose DEEPXVisit DEEPX at booth 4F, L0409 from May 20-23 at Taipei Nangang Exhibition Center to witness firsthand how we're setting new standards for reliable on-device AI.For more information, you can follow DEEPX on social media or visit their official website.

To cultivate a stronger foundation of artificial intelligence (AI) talent and encourage greater investment in AI research and development, Taiwan's Ministry of Economic Affairs (MOEA) hosted the inaugural 'Best AI Award Competition,' culminating in the finals held on May 3, 2025, at the Taipei World Trade Center, Hall 1. This year's competition attracted participation from 1,253 teams spanning 36 countries. From this pool, 233 teams advanced to the finals, where they competed for gold, silver, and bronze awards, as well as honorable mentions, across the 'AI Application' and 'IC Design' categories. These categories were further divided into groups: Public Corporations, SMEs and Startups, Students, and International Teams.The Gold Award was bestowed upon eight winners: HiTRUSTpay, EYS3D Microelectronics, Daya Yoo, Jmem Tek, National Central University, National Taiwan University, Touch Lab (Philippines), and Arba Lab (UK).According to an MOEA press release, the 'Best AI Awards' aspires to be Taiwan's equivalent of the "Oscars for AI", embodying diversity, global reach, and a forward-looking vision. Its core objectives are to ignite the creativity of the next generation, foster stronger ties between academia and industry, and nurture a deeper pool of AI-savvy talent and innovative enterprises. Ultimately, the competition aims to drive the industrialization of AI and the adoption of AI across industries, thereby solidifying Taiwan's position in the AI landscape. The competition offers substantial prizes, with student group winners vying for up to NT$300,000 and winners in the enterprise open, startup and SME, and international groups competing for up to NT$1 million.Credit: MOEAAt the awards ceremony, Deputy Minister Ho Chin-tsang emphasized AI's accelerating transformation of the global industrial structure, impacting sectors from manufacturing and healthcare to finance and everyday services. He stressed the 'Best AI Awards' competition platform's crucial role in forging stronger links between talent development, technological applications, and industry demands. In response to the widespread anticipation for AI technologies, the MOEA seeks to foster a practical, application-oriented approach, encouraging innovative concepts to address real-world industry challenges. This strategy aims to continuously cultivate new talent and generate cutting-edge solutions within Taiwan's evolving AI ecosystem. Deputy Minister Ho also highlighted that the competition entries exemplify the fusion of AI technology with tangible needs and creative execution, showcasing the immense potential of translating innovative ideas into viable solutions. Looking ahead, the MOEA will sustain its commitment to facilitating the adoption of innovative solutions and maximizing their value through strategic policy initiatives and industry partnerships.Credit: MOEADirector-General Kuo Chao-chung of the MOEA's Department of Industrial Technology underscored the impressive international engagement of the inaugural Best AI Awards, attracting both enthusiastic domestic participation from enterprises and academic institutions and the involvement of 353 international professionals from 36 countries, including India, the Philippines, the United States, and the United Kingdom. This global participation establishes the competition as a vital platform for the international exchange of AI innovation. To expedite the industry's capacity building in AI talent and applications, the MOEA will not only continue to host the Best AI Awards but also leverage the pilot production capabilities of schools and research institutions to support businesses in design, new product development, and prototyping. Furthermore, the MOEA will collaborate with agencies such as the Small and Medium Enterprise Administration and the Industrial Development Administration to facilitate industry-wide AI transformation and develop practical AI expertise.Chiu Chui-hui, Director-General of the Industrial Development Administration, cited a report by the Artificial Intelligence Technology Foundation, which identifies the 'shortage of relevant technical talent' as Taiwan's primary obstacle to AI advancement. The Global Artificial Intelligence Index corroborates this, revealing that while Taiwan excels in infrastructure (ranking 4th), it faces challenges in talent (38th), research (27th), and commercialization (39th). Consequently, the Best AI Awards are designed to expedite the real-world application of AI and the cultivation of skilled professionals. Chiu emphasized the competition's significance as Taiwan's premier AI competition, characterized by its scale, prestigious awards, and high standards (with a highly selective 7.4% award rate). He expressed his hope for collaborative efforts across all sectors to broaden the adoption of AI and harness its power to drive industrial innovation.The 'Best AI Awards' entries spanned a diverse range of application areas, including information and communication technology (18.4%), manufacturing (16.2%), healthcare (15.9%), wholesale and retail (10.2%), education (8.6%), and finance (7.8%). This diversity not only underscores the application of cutting-edge technologies but also highlights the immense potential of AI to be successfully integrated into various industries.The gold medal winners' covered areas and their attempted solutions to problems are summarized as follows:CategoryTeamWork TitleDomainPain Points to SolveAIStudentNational Central UniversityRealization of Highly Flexible Production LinesManufacturing AutomationTraditional production lines are inflexible and struggle to adapt to rapidly changing and varied production needs.AI SME and StartupData YooFarmiSpaceFarmingEnhance the efficiency and management of agricultural production, and optimize agricultural resource allocationAI Public CompanyHiTRUSTpayVeri-id equipment id verification and real-time AI anti-scam/fraud serviceCybersecurity, FintechSolve device identity verification issues, and provide real-time prevention of financial fraud, thereby enhancing transaction security.AI_INTLTouchLab (Philippines)AI driven TOUCH System – Digitizing TouchDigitalization, human-machine interactionDigitize touch, enabling machines to understand and simulate tactile sensations, thereby enhancing the precision and scope of human-computer interaction.IC StudentNational Taiwan UniversityTernary-weight Transformer model software-hardware synergetic design and neural network accelerator IC design and implementationIC design, AI hardware accelerationDesign higher-performance, lower-power AI chips to accelerate the computation of Transformer models and improve the efficiency of AI applications.IC SME & StartupJmem TekArgusNPU – PQC security edge AI inference systemCybersecurity, Edge AI, AI IC designProvide AI inference capabilities with post-quantum security on edge devices to protect sensitive data and enable high-performance AI applicationsIC Public CompanyeYs3D MicroelectronAI Edge Computing Car Parking Management SystemSmart City Transportation ManagementUse edge AI to improve parking management efficiency, optimize the allocation of parking resources, and alleviate traffic congestion.IC_INTLArbaLab(UK)ArbaEdgeAI Edge ComputingRealizing high-performance AI computing on edge devices to reduce reliance on cloud computing, enhance response speed, and improve privacy protection.Source: MOEAThe winning entries of the 'Best AI Awards' showcased the dynamic development and diverse applications of AI technology, with particularly strong innovation evident in sectors such as healthcare and manufacturing, as well as in the burgeoning fields of AIoT and edge AI integration.The Ministry of Economic Affairs pointed out that looking ahead, it will continue to collaborate with industry, academia, and research institutions, hoping that the "Best AI Awards" can become an important annual platform to promote Taiwan's AI technology development, talent cultivation, and innovative applications, and to continuously discover more promising new talents. In addition, matchmaking events will also be held concurrently during the "COMPUTEX" exhibition every May, with plans to invite more than 20 domestic and foreign venture capitalists and buyers to participate, fostering in-depth exchanges and cooperation between participating teams and the industry, and further expanding the commercialization opportunities for AI innovative applications.Through this comprehensive strategy, the Ministry of Economic Affairs aims to expedite the creation of groundbreaking AI applications and the cultivation of interdisciplinary AI expertise, ultimately steering Taiwan toward its ambitious vision of becoming a globally recognized "AI Island". For the latest updates, follow the official LinkedIn page of the Best AI Awards.

In the post-epidemic era, changes in consumer behavior and the rapid expansion of chain businesses have brought new challenges to industries such as retail catering and medical care. In response to this trend, DataVan International Corporation, which has been deeply involved in the point-of-sales (POS) industry for many years, set "Smart Hotel" as its theme at Computex 2024 and showcased innovative products and solutions spanning the fields of smart catering, self-service, AI applications and more.DataVan International Corporation, established in POS products, has made significant progress in software development and customer base expansion in recent years. While continuing to delve into the retail and catering industry, the company has also extended its products into finance, healthcare, and other fields. Zhou Ji-Ping, Chairman of DataVan International Corporation, pointed out that advancements in AI technology have allowed POS products to become one of the fastest industrial equipment in adopting this technology.Take the catering industry as an example. The role played by the POS system in this field has evolved into an intelligent big data platform that connects all aspects. When customers order food from the front desk, the relevant information is not only transmitted to the kitchen and accounting department but will also be transmitted simultaneously to the head office systems. There, personnel in each department can carry out their respective tasks by classifying and distributing data.DataVan International Corporation Grows with Customers by Keeping POS Functions Up-to-dateZhou went on to illustrate that the functions and roles of POS systems have continued to evolve since inception. From the earliest function as a mere cashier, POS products have since evolved to handle accounting work and manage purchase, sale, and inventory of goods. Almost 20 years ago, POS began to undertake simple customer data collection and incorporate portable inventory equipment and network connectivity.In recent years, the addition of technologies, such as sensors, big data, and AI, has catapulted POS systems to the core operations of the retail and catering industry, assisting businesses in implementing the vision of precise data-driven operations. Throughout this process, DataVan International Corporation has applied its technical capabilities and design services to meet market needs by providing more advanced and comprehensive intelligent solutions to assist in customer transformation and promote digitalization for enterprises in varying fields.Recently, the company has been engaging in AI research and development in full force, as well as closely observing market trends to launch a series of solutions. Zhou expressed that the labor shortage caused by the declining birthrate continues to plague many sectors in Taiwan.Coupled with changes in people's behavior during the COVID-19 pandemic, the number of self-service and unmanned stores is increasing. Due to this trend, be it the catering, retail, hotel, gyms, or medical institution industries, they all require intelligent platforms that are intuitive, easy to operate, and highly integrated with various systems within their field to reduce labor requirements while meeting the requirements for management and service quality. At COMPUTEX 2024, DataVan International Corporation used "Smart Hotel" as its theme to demonstrate how the company's innovative solutions assist customers in creating comprehensive smart applications.DataVan International Corporation Builds Smart Hotel Application Scenarios to Showcase Technical CapabilitiesWhen entering the DataVan International Corporation booth, visitors are greeted by a self-service check-in machine. Travelers can quickly complete check-in procedures without waiting in line.The machine can identify and authenticate travelers quickly via Optical Character Recognition (OCR), complete the check-in process, and grant the key card efficiently. After entering the hotel, travelers can enjoy a convenient dining experience through the smart catering platform.The unmanned ordering machine supports multiple languages ​​and provides information through a detailed menu. Seamless integration of the ordering equipment with the back-end KDS (Kitchen Display System) drastically improves the efficiency and accuracy of meal delivery.In terms of entertainment and ticketing, DataVan International Corporation demonstrates the smart wristband solution developed in cooperation with Japan's Tensheng Company. Travelers only need to wear a stylish wristband to use the hotel's gym, swimming pool, and other facilities.The QR code on the wristband can be used for identification and bill payment, thereby eliminating the need to carry cash or credit cards. This innovative smart wristband is not limited to be used within hotels.It can also be connected to a wide variety of external systems to provide multiple services. For example, with the concert economy or sports events that have emerged in recent years, hotels can cooperate with event organizers to provide wristbands with electronic ticket functions connected to a ticketing system, allowing guests to quickly and seamlessly access event venues. The enjoyment of such convenient and unique experiences will create new business opportunities for hotels.Zhou said that AI technology plays a critical role in DataVan International Corporation's smart hotel scenarios. Travelers can interact with AI customer service at any time through voice, text, and video messaging to obtain information and services. AI customer service can also quickly understand user intentions, provide customized information, and greatly improve the quality and efficiency of services.In addition to understanding the high-quality experience in smart hotel scenarios enabled by forward-looking technology, DataVan International Corporation's POS and kiosk application solutions will also be on display at COMPUTEX 2024. The POS section features the Amber series that utilizes a 15.6-inch screen and is equipped with the 12th-generation Intel processor.The series features a thin and light casing design with a stylish aluminum alloy exterior that offers excellent performance. It also contains a unique easy-to-maintain design and smart cooling technology that greatly improve reliability and product life cycle. The Amber series is specifically designed for industries such as catering and retail that emphasize high requirements for the appearance and performance of POS terminals. It is DataVan International Corporation's blockbuster product in the high-end POS market.In terms of self-service kiosk solutions, a variety of products tailored for different scenarios will be on display with applications covering meal ordering, medical registration, transportation ticketing, and other fields. DataVan International Corporation's kiosk solution integrates advanced human-machine interaction technologies such as facial recognition, voice recognition, and touch controls to provide a smarter and more convenient self-service experience.From the exhibition content above, the company's technical strength and cross-industry cooperation results are evident. Looking forward to the future, Zhou pointed out that DataVan International Corporation will continue to improve its leading position through existing advantages.This includes launching a number of innovative products in the second half of 2024, such as the next-generation M-POS (mobile POS) solutions featuring a thin and stylish design, as well as self-service kiosk terminals that support multiple payment methods. In terms of software, cloud services will be launched in the existing smart business management platform to help companies accurately understand market trends through big data analysis and AI technology. As mentioned above, DataVan International Corporation will continue to lead the innovation of POS and kiosk with new technologies that strengthen the company's competitiveness in the new era and meet the transformation requirements of customers in various fields.Zhou Ji-Ping, Chairman of DataVan International Corporation, pointed out that advancements in AI technology has allowed POS products to become one of the fastest industrial equipment in adopting this technologyPhoto: DIGITIMESZhou Ji-Ping, Chairman of DataVan International Corporation, points out the practical applications of forward-looking technologies such as AI, big data, and sensors for the "smart hotel" scenario at COMPUTEX 2024Photo: DATAVANAt COMPUTEX 2024, DataVan International Corporation used "Smart Hotel" as its theme to demonstrate how the company's innovative solutions assist customers in creating comprehensive smart applicationsPhoto: DATAVANUnder the leadership of chairman Zhou Jiping and new general manager You Zhicheng with a construction background, DATAVAN will combine its electronic resources, construction resources, and hotel resources to strengthen IT software research and development, create a new smart technology service team, and create an international POS international blue ocean marketPhoto: DATAVANGeneral Manager You Zhicheng pointed out that in the future, DATAVAN will further expand into business fields such as smart management, smart buildings with efficient services with few people, and green building circular economy. The prospects are infinitely brightPhoto: DATAVAN

Inevitably, the adoption of generative AI and LLM (Large Language Model) has fueled more intelligence and efficiency in our lives and works than in the past decade.Moving forward, the demand for running AI and LLM at the edge devices is growing as it provides lower latency, higher privacy, and more flexibility. It is set to redefine the level of intelligence of smart devices as well as broaden the landscape of mobile scenarios.Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a series of on-device AI solutions powered by Qualcomm QCS8550 and QCM6490 processors from Qualcomm Technologies, Inc. The solutions are designed to satisfy compute-intensive application scenarios such as robotics, automated vehicles, video collaborations, smart retailing, etc., accelerating industrial digitalization and intelligent transformation.Flagship on-device AI solution powered by Qualcomm QCS8550 processorUtilizing the powerful Qualcomm QCS8550 processor, Fibocom's flagship on-device AI solution is designed to deliver strong performance and unparalleled multimedia capabilities. Equipped with an octa-core CPU and an Adreno 740 GPU, the solution can support up to 4 concurrent displays, and 8K video encoding and decoding. It serves as a strong core for industries requiring high-definition video playing, fast data analytics, and lower latency like automated vehicles, robotics, remote medical surgery, computer vision systems, live streaming, video conference systems, and more.Premium on-device AI solution powered by Qualcomm QCM6490 processors, piloting the high-end AIoT marketThe solution developed using the Qualcomm QCM6490 processor, features an octa-core processor with high-speed HVX (Hexagon Vector Extension) technology, and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera inputs. In addition, the solution is capable of allowing a maximum of 5 ISPs (Image Signal Processing) and up to 5-8 camera streams simultaneously, helping customers to ease their concerns on multi-camera deployments as well as dual-screen display scenarios.The solution offers flexible wireless connections such as 5G, Wi-Fi, Bluetooth, and is equipped with a GNSS receiver for precise navigation both indoors and outdoors. In terms of software, the solution supports the mainstream operating systems: Android, Linux, and Windows. Leveraging the computing power of up to 13 TOPS, the solution efficiently helps customers handle data-intensive computation and processing, running various 1.3B/3B/7B open-source LLMs on the device, making it an ideal solution for smart retail, In-Vehicle Infotainment (IVI) and industrial inspection."We are excited to see our powerful Qualcomm processors, the QCS8550 and QCM6490, being utilized in Fibocom's innovative on-device AI solutions," stated Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. "This collaboration is a testament to our commitment to advancing AI capabilities at the edge, enhancing performance and efficiency across a range of applications from industrial automation to smart retail.""It is paramount to master the productivity of AI and create value-added solutions from the edge side for our customers that are in urgent need of building their smart devices based on our solutions. We are thrilled to develop these solutions based on the advanced and powerful chipsets from Qualcomm Technologies, as it not only provides the fundamental architecture of edge intelligence, also enriches flexibility in network connections such as 5G/Wi-Fi/Bluetooth," said Ralph Zhao, VP of MC BU at Fibocom. "In collaboration with Qualcomm Technologies, Fibocom is dedicated to injecting new versatility to the future of intelligence, and accelerating the implementation of our collaboration in robotics, industrial automation, live streaming, and more."

Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches 5G + Wi-Fi 7 solution for 5G FWA during Computex 2024, satisfying the demand for higher data throughput and extending Wi-Fi 7 performance in the home, SMB (Small and Medium-sized Business) and industrial scenarios.Boosting 5G + Wi-Fi 7 Capabilities of Peak Performance Up to BE7200The ultra-high bandwidth and low latency features make the FG370 an optimal wireless solution for 5G FWA scenarios like smart home, SMB, and industrial monitoring. The multiplier solution can be realized by coupling with the latest Wi-Fi 7 technology, unleashing the full potential of a lightning-fast wireless experience for end users.Compliant with the IEEE 802.11be (Wi-Fi 7) standard, the 5G + Wi-Fi 7 solution supports a 4K QAM (Quadrature Amplitude Modulation) modulation scheme as well as up to 160MHz channel bandwidth to expand the data transmission capacity and reduce latency efficiently. It is worth mentioning that the solution also supports dual-band 2.4GHz 4 x 4 and 5GHz 5 x5 to achieve MLO speed of up to 7.2Gbps.In terms of reliability and transmission efficiency, the integration with OFDMA, Multi-RU, and MU-MIMO technologies guarantees interference-free, signal-boosted performance. Driven by the unique 5T5R system empowered by the Wi-Fi 7 chipset, the end users will benefit from 5dB antenna gains and extended network coverage versus previous generations."As the world's first 5G module developed from MediaTek's T830, Fibocom FG370 has been recognized and deployed by global Tier 1 operators' 5G CPE commercialization since its first debut in October 2023. Evolved with the latest Wi-Fi 7 standard, Fibocom launched the tri-band BE19000 solution based on FG370 during MWC 2024," said Simon Tao, VP of MBB Product Management Dept., Head of MBB BU at Fibocom. "Up to date, Fibocom is glad to be the first module vendor launching the industry-first dual-band BE7200 solution based on FG370 compatible with Wi-Fi 7 chipset, significantly boosting the overall performance in terms of speed performance, cost, and frequency regulatory requirements. The Tri industry-leading innovations prove Fibocom's product capabilities on the MediaTek T830 platform and the dedication to helping customers win the market."Welcome to visit Fibocom stand #K1215a at Computex 2024 for more details about 5G + Wi-Fi 7 demonstrations.Fibocom extends market leadership in 5G FWA by launching 5G + Wi-Fi 7 solution at Computex 2024Photo: Company

Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, today announces the expansion of its RedCap module portfolio by launching FG332 during Computex 2024 and introduces a cutting-edge 5G RedCap CPE solution integrated with the newly launched FG332 and the latest Wi-Fi 7/Wi-Fi 6 technologies.The industry-piloting layout of the 5G RedCap module and RedCap CPE solution is set to accelerate the 5G RedCap commercialization. The FG332 is a 3GPP R17-compliant module tailor-made for the lightweight of 5G IoT applications with optimized power consumption, enhanced network coverage, and R17 small data transmission.Developed from MediaTek's T300 chipset, the world's first 6nm Radio Frequency System-on-Chip (RFSOC) single die solution for 5G RedCap, the module supports 5G SA and a maximum bandwidth of 20MHz, enabling the peak transmitting performance up to 227Mbps downlink and 122Mbps uplink, and it is also backward compatible with 4G, ensuring the constant network connections. In hardware excellence, FG332 adopts the LGA form factor packaged at 29 x32mm and utilizes the cutting-edge hardware density design for a compact PCB area, allowing greater flexibility in product design.In terms of pin-compatibility, the module is pin-compatible with Fibocom LTE Cat 4 module series NL668, thus easing the customer's concern about hardware investment and time to market. Leveraging the optimized power consumption system, FG332 performs in a highly power-efficient mode and helps the UE (User Equipment) to extend the battery life. The module supports regional frequency bands in Europe, North America, and APAC, and the engineering sample of FG332-NA will be available in Q3 2024.FWA is gaining a larger market share to enable everyone's access to broadband networks anywhere, anytime. The FG332 is positioned for the mass deployment of CPE (Customer-Premises Equipment) and portable mobile hot spot devices with RedCap capabilities.Propelling the high-cost performance and low-power consumption of 5G RedCap, in conjunction with the latest Wi-Fi 7 and Wi-Fi 6 technology, Fibocom further offers a complete 5G RedCap CPE solution integrated with the latest Wi-Fi 7 and Wi-Fi 6 technologies, pivotal for consumer-level and enterprise-level users to enjoy the deadzone-free and interference-free wireless experience.The new generation 5G RedCap plus Wi-Fi 7 solution delivers higher data throughput of BE3600 and lower latency, compatible with IEEE 802.11a/b/g/n/ac/ax/be protocols, enabling the end devices to run at full speed of a maximum of 3571Mbps under the concurrent dual-band circumstance of 2.4GHz + 5GHz. The solution features Wi-Fi 7 benefits 4K-QAM for mass data loading thus enhancing the throughput, along with MLO, MRU, and preamble puncture to fully utilize the bandwidth, and software intelligence to improve the data transmission efficiency.For a more popularized 5G RedCap + Wi-Fi 6 selection, the solution utilizes a hardware accelerator for power optimization while maintaining an incredible speed of 3Gbps. The solution outperforms in both 2.4GHz and 5GHz frequency bands, the maximum 2402 Mbps can be achieved under the working mode of Wi-Fi 2X2 160MHz at 5GHz as well as 574Mbps under the working mode of Wi-Fi 2X2 40MHz at 2.4GHz. In terms of network coverage, uncompromised signaling and consistency will bring stable and seamless connectivity to end users."We are excited to unveil the FG332 RedCap module powered by MediaTek's T300 chipset at Computex 2024. At Fibocom, we are always dedicated to leading the way in 5G innovation, thanks to the cooperation with our ecosystem partner MediaTek, we launched the 5G RedCap CPE solution that integrates advanced Wi-Fi 7 and Wi-Fi 6 technologies, delivering exceptional data throughput and low latency," said Simon Tao, VP of MBB Product Management Dept., Head of MBB BU at Fibocom. "These innovations underscore our commitment to driving 5G RedCap monetization, ensuring our customers develop the FWA devices based on the latest technologies and capture the market opportunity ahead of time."Welcome to visit Fibocom stand #K1215a at Computex 2024 for more details about 5G RedCap demonstrations.Fibocom FG332

Targeting the booming industrial control applications driven by the AI wave, global AI PC and AIoT solutions leader MSI is unveiling its next-generation Autonomous Mobile Robot (AMR) solution at COMPUTEX, equipped with the NVIDIA Jetson AGX Orin module. This advanced AMR solution leverages intelligent vision and AI technologies to deliver unparalleled versatility and efficiency to industries such as warehousing, automotive, semiconductor, and panel manufacturing.Additionally, MSI's Smart 360° AI Patrolling Solution integrates cutting-edge AI image recognition and edge computing technologies to help enterprise clients achieve remote inspection, 24-hour unmanned surveillance, and production line safety protection. This solution targets industrial IoT opportunities in smart factories and smart cities, further diversifying MSI's AI product line and applications.MSI, dedicated to innovative research and development, was the first in the industry to launch AI PCs and continues to invest in AI application product development and hardware-software integration to meet enterprise needs.MSI AMR-AI-Cobot Pro Autonomous Mobile Robot Powered by NVIDIAThe MSI AMR-AI-Cobot Pro is equipped with a smart robotic arm designed to enhance productivity and safety across industries. Powered by the NVIDIA Jetson AGX Orin platform, it features precise SLAM-based navigation, efficient 3D route planning, accelerated object detection, and seamless integration with third-party applications. This makes it ideally suited for use in diverse sectors including semiconductor, panel manufacturing, electronics, warehousing, logistics, textiles, biotechnology, and the food industry.MSI AMR-AI-Delivery Robot Pro Autonomous Mobile Robot Powered by NVIDIAEquipped with advanced AI features, the MSI AMR-AI-Delivery Robot Pro includes smart face and speech recognition for safe and accurate deliveries. Powered by the NVIDIA Jetson AGX Orin platform, it excels in diverse environments, boasting SLAM capabilities, 3D navigation routes, and accelerated object detection. Its support for third-party APIs ensures seamless integration with other applications, making it highly versatile for use in factories, warehouses, medical facilities, offices, residential areas, and shopping centers.MSI autonomous mobile robotsThe "Smart 360° AI Patrolling Solution" uses MSI's intelligent industrial computers, MS-C910 and MS-C909, as the core computational units. These are combined with 360-degree panoramic video products, solar panels, EV-grade lithium iron phosphate batteries, and eco-friendly paper displays (EFPD). Through advanced AI and edge computing, this solution delivers efficient security monitoring and intelligent disaster prevention alert functions.MSI MS-C910 intelligent industrial computersFor example, in outdoor parking lots, the MS-C910 can serve as a small server system for AI image computation, data center tasks, and transmitting parking management information to an edge box, while the MS-C909 collects and manages solar energy charge and discharge information, sending it back to the C910. With license plate and facial recognition technology, this system intelligently identifies and displays vehicle entry and exit, parking space status, and provides real-time directions for vehicle retrieval, enhancing operational efficiency and improving overall management integration.MSI MS-C909MSI @ COMPUTEX TAIPEI 2024Date: Tuesday, June 4 - Friday, June 7, 2024Time: 9:30 - 17:30Booth: M0806Venue: 4th Floor, Hall 1, Taipei Nangang Exhibition Center

Allxon today announced Allxon OOB Cloud Serial Console, marking a milestone as the industry's first offering tailored for the NVIDIA Jetson family. Allxon OOB Cloud Serial Console empowers direct device-level troubleshooting and remote access via debug UART. Allxon will be hosting a live demonstration at COMPUTEX 2024, showcasing this powerful technology alongside AVerMedia.Partnering with AVerMedia, which unveiled its Standard Carrier Board D115W for the NVIDIA Jetson Orin NX and NVIDIA Jetson Orin Nano modules, Allxon showcased its power-related features for swift disaster recovery.Allxon OOB Cloud Serial Console leverages NVIDIA Jetson devices' serial console port through the hardware interface for seamless remote access and troubleshooting. This innovative solution provides unprecedented convenience and top-tier security. Unlike traditional SSH methods, Allxon OOB Cloud Serial Console eliminates the need for cumbersome server setups and fixed ports, significantly boosting security and operational flexibility.Allxon OOB Cloud Serial Console has received worldwide acclaim during its early access (EA), attracting partners including telecommunications giants, smart security innovators, independent hardware vendors, and leading-edge AI software developers. Allxon is thrilled to announce that its OOB Cloud Serial Console general availability (GA) is set for quarter three of 2024.Allxon will showcase Allxon Cloud Serial Console at COMPUTEX 2024 at booth #L1309a, Hall 1, 4F in Nangang Exhibition Center Halls 1 and 2 from June 4th to 7th.Learn more about Allxon's platform https://www.allxon.com/solutions/swiftdr.

Chenbro (TWSE: 8210), a pioneer in the design and manufacturing of own-brand rackmount systems, is participating in COMPUTEX Taipei from June 4 to 7. Focusing on the theme of AI, Chenbro is showcasing its latest NVIDIA MGX chassis products and OCP DC-MHS cloud server chassis solutions, seizing more AI business opportunities.This year, Chenbro is flexing its muscles with its OTS (Off-The-Shelf), ODM/JDM, and OEM Plus service models. In addition to highlighting OTS server chassis solutions for AI, Cloud, Storage, and Edge applications, Chenbro is exhibiting JDM/OEM products co-created with customers, showcasing its strong R&D design capabilities and manufacturing prowess and realizing win-win partnerships.Aiming for Next-Generation Server Development with Unreleased Enclosure SolutionsEric Hui, President of Chenbro, highlighted the role of NVIDIA MGX in bringing accelerated computing into any data center with modular server designs. These designs offer multiple form factors, including 1U, 2U, and 4U, enabling diverse configurations of GPUs, CPUs, and DPUs to fulfill various computing requirements. As an NVIDIA partner, Chenbro is showcasing NVIDIA MGX server chassis in 2U and 4U form factors to address enterprise-level AI application needs, and is exhibiting 1U and 2U compute trays to support customers deploying the GB200 NVL72 and NVL36.Chenbro is also introducing a new generation of cloud server chassis solutions compliant with the OCP DC-MHS standard, and collaborating with Intel on server architecture. Chenbro's DC-MHS enclosure solutions offer Full Width (FLW) and Density Optimized (DNO) specifications in 1U and 2U form factors, supporting E3.S and E1.S storage devices, to meet product development demand for next-generation high-performance servers.Also at Chenbro's booth is a unique data center display featuring a blend of virtual and physical cabinets, showcasing its Tri-Load high-density storage server chassis solution, which has won both the MUSE and TITAN design awards. Known for its exceptional heat dissipation and load-bearing mechanisms, the Tri-Load series ensures easy maintenance and stability in data center operations. Chenbro is also showcasing Edge AI solutions with short-depth server chassis capable of accommodating GPU deployment, enabling AI computing at the edge.Collaborating for a Win-Win Partnership Corona Chen, CEO of Chenbro, underscored the company's commitment to tracking the product roadmaps of tech giants such as NVIDIA, Intel, AMD, and Ampere. By leveraging modular design, Chenbro ensures maximum compatibility and can offer a wide range of server chassis solutions, adhering to the slogan "Whatever's inside, Chenbro outside." Through diverse business service models, Chenbro is actively collaborating with global customers to seize opportunities in the AI and cloud server industry.This year, along with TechTalk sessions that share innovative product and industry insights, Chenbro is also showcasing joint product demonstrations with motherboard partners such as Gigabyte, MSI, ASRock, Tyan, and Compal, as well as storage device partners like Toshiba, Seagate, and Kingston. In addition, server products created through JDM/OEM collaboration with Hyve Solutions, Wiwynn, Pegatron, MSI, ASRock, and ADLINK are on display. Lastly, Chenbro will hold a joint VIP night co-hosted with JPC and FSP, showcasing Chenbro's collaborative achievements with customers and partners in win-win partnerships.Amidst the wave of green exhibitions, Chenbro is further showcasing its commitment to sustainability through participation in COMPUTEX ESG GO and the Sustainable Design Award competition. Chenbro applies the principle of 3R (Reuse, Reduce, and Recycle) not only in product design but also in booth design, paving the way for a low-carbon, sustainable future.

At Computex 2024 in Taipei, Taiwan, VIA Labs announced PortSense, a suite of manageability and intelligent connectivity features for USB Hubs that sets a new standard for docking station functionality in business and professional environments.PortSense is an exclusive VIA Labs hardware and software solution embedded in the latest revisions of VIA Labs hub products, and it enables supported products to retrieve USB descriptor information from connected devices, even without a host system. USB descriptors contain vital details about the connected USB devices, such as the device class and capabilities, the product name and manufacturer information, serial number if present, and much more.Typically, a host system uses this information to identify, configure, and interact with connected devices. However, with PortSense, a managed docking station can collect usage data, perform tasks like pre-configuration and device inventory, and assist in implementing corporate policies.PortSense is available in VIA Labs VL817 USB 5Gbps Hub and VL822 USB 10Gbps Hub. The VL832 USB4 Endpoint Device has an integrated USB 10Gbps hub and supports PortSense.While PortSense can function in autonomous mode, its true potential is unlocked when integrated into a connected platform where AI could be applied for analytics and policy control. Hubs with PortSense can communicate with an external controller using a standard I²C interface to share collected USB descriptor information and offer a range of manageability controls, such as enabling or disabling ports, changing connection speeds, resetting devices, and toggling USB battery charging.These controls can be applied on a per-port basis, including the upstream port, providing granular control over each connection. PortSense can be used to collect detailed user activity and enable analysis of usage patterns over time, making it perfect for hot-desking setups or as part of a comprehensive office management solution.With PortSense, VIA Labs is enhancing the modern workspace with more intelligent and connected solutions. The advanced capabilities of PortSense extend beyond basic data collection and control, providing valuable insights that help businesses manage their USB peripherals more effectively.For instance, IT administrators can use PortSense to maintain an inventory of connected devices, ensuring that only authorized devices are in use. In addition, the AI-Ready features of PortSense support enforcing security policies, such as maintaining an allowlist or blocklist of devices or limiting the use of specific USB device classes in sensitive areas.By acting as one layer of a comprehensive security strategy, PortSense helps reduce the risk of data breaches and unauthorized data transfers. This approach enhances operational efficiency and security, helping companies maintain a reliable and secure technology infrastructure. VIA Labs has recently released a white paper with more technical details about PortSense, which can be found here: https://www.via-labs.com/pressroom_show.php?id=98VIA Labs PortSense: An exclusive suite of manageability and intelligent connectivity features for USB Hubs